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Including Means To Apply Flux Or Filler To Work Or Applicator

Including Means To Apply Flux Or Filler To Work Or Applicator patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Metal Fusion Bonding


Including Means To Apply Flux Or Filler To Work Or Applicator



Fill head interface with combination vacuum pressure chamber
08/14/14 - 20140224860 - A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of...

Viscous material feeder and viscous material printer
05/01/14 - 20140117067 - This viscous material feeder includes a nozzle to discharge a viscous material stored in a storage portion storing the viscous material and a feeding mechanism transferring the viscous material from the storage portion to the nozzle and discharging the viscous material from the nozzle. The nozzle has a bent feed...

Solder injection head
02/06/14 - 20140034707 - Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the...

Three dimensional flip chip system and method
12/12/13 - 20130327811 - Solder is simultaneously transferred from a mold to a plurality of 3D assembled modules to provide solder bumps on the modules. The mold includes cavities containing injected molten solder or preformed solder balls. A fixture including resilient pressure pads and vacuum lines extending through the pads applies pressure to the...

Metal bonding apparatus
10/31/13 - 20130284794 - The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to...

Solder bump forming apparatus and soldering facility including the same
05/30/13 - 20130134207 - Disclosed herein is a solder bump forming apparatus including: a flux dispenser dispensing a flux to a processing substrate; a solder dispenser dispensing a solder to the processing substrate to which the flux is applied while moving following the flux dispenser; and driver driving the flux dispenser and the solder...

Automatic torch fluxing apparatus
02/21/13 - 20130043296 - An automatic torch fluxing apparatus is provided and includes a supply of fuel, a flux container formed to define a reservoir of non-corrosive flux for aluminum brazing, the reservoir being receptive of the fuel whereby the fuel and the flux form a fuel/flux mixture and a torch to which the...

Micro-fluidic injection molded solder (ims)
05/31/12 - 20120132694 - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when...

Automatic soldering device and carrier device
11/17/11 - 20110278348 - Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4,...

Micro-fluidic injection molded solder (ims)
09/29/11 - 20110233262 - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when...

Ignition source system for an exothermic reaction mold device
06/09/11 - 20110132967 - An ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A...

Injection molded solder method for forming solder bumps on substrates
06/02/11 - 20110127312 - A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with...

Device for the controlled displacement of a spray nozzle to individual spray points, in particular for spraying flux in wave soldering units
12/17/09 - 20090308912 - The invention relates to a device for the controlled displacement of an upward-directed spray nozzle to individual spray points that are situated a distance apart, in particular for spraying flux in wave soldering units. The spray nozzle is situated axially on a rotary axle rotated by a rotary drive, to...