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Electrolysis: Processes, Compositions Used Therein, And Methods Of Preparing The Compositions > Electrolytic Coating (process, Composition And Method Of Preparing Composition) > Coating Selected Area > Internal Coating (e.g., Coating Inside Of Cylinder, Etc.)

Internal Coating (e.g., Coating Inside Of Cylinder, Etc.)

Internal Coating (e.g., Coating Inside Of Cylinder, Etc.) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

10/09/14 - 20140299476 - Electroplating method
An electroplating method is disclosed. The method includes preparing a substrate having via holes in a surface thereof, performing a pretreatment of the substrate surface by immersing the substrate in a pretreatment liquid containing a plating suppressor to adsorb the plating suppressor onto the substrate surface, immersing the pretreated substrate...

09/18/14 - 20140262801 - Method of filling through-holes
The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing disulfide compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using an acid copper electroplating...

05/22/14 - 20140138252 - Aqueous acidic bath for electrolytic deposition of copper
The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler for copper-deposition, wherein at least one leveler is a ruthenium compound, and to a process...

04/10/14 - 20140097089 - Microcrystalline anodic coatings and related methods therefor
Methods of preparing metal and metal alloys with partially microcrystalline anodic coatings are disclosed. Associated article therefrom are correspondingly disclosed. The partially microcrystalline anodic coatings exhibit steam, superheated steam, alkaline and acidic resistance. Partially microcrystalline anodic coating can be prepared by impregnation of micropores of a metal or metal substrate...

03/27/14 - 20140083860 - Plating catalyst and method
Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices....

03/28/13 - 20130075268 - Methods of forming through-substrate vias
A method of forming through-substrate vias includes separately electrodepositing copper and at least one element other than copper to fill remaining volume of through-substrate via openings formed within a substrate. The electrodeposited copper and the at least one other element are annealed to form an alloy of the copper and...

11/08/12 - 20120279866 - Method of forming a multilayer structure
A multilayer structure is formed by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer...

06/14/12 - 20120145552 - Electroplating method
An electroplating method includes: preparing a substrate having via holes formed in a surface; immersing the substrate in a pretreatment solution to carry out pretreatment of the substrate; immersing the substrate in a plating solution without applying a voltage between the substrate and an anode, thereby replacing the pretreatment solution...

04/05/12 - 20120080318 - Forming through-substrate vias by electrofilling
A plurality of through holes in a workpiece are filled with a solid conductive material. The workpiece is immersed in an electroplating solution, with the through holes covered at one end by a portion of a conductive plating base. The electroplating solution is permitted to fill the through holes in...

01/19/12 - 20120012465 - Methods for forming barrier/seed layers for copper interconnect structures
Methods for forming barrier/seed layers for interconnect structures are provided herein. In some embodiments, a method of processing a substrate having an opening formed in a first surface of the substrate, the opening having a sidewall and a bottom surface, the method may include forming a layer comprising manganese (Mn)...

10/06/11 - 20110240481 - Seed layer deposition in microscale features
A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece...

07/21/11 - 20110174629 - Method for functionalising the wall of a pore
The invention relates to a method for functionalising at least a portion of a wall of a pore of a carrier material, characterised in that it comprises: a) contacting the pore with a solution of electrically activated entities and positioning two electrodes in said solution in order to create inside...

10/21/10 - 20100264036 - Microstructure
Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm2. In...

10/21/10 - 20100264037 - Method for electrochemical fabrication
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first...

09/30/10 - 20100243462 - Methods for activating openings for jets electroplating
One embodiment of the present invention one embodiment of the present invention is a method for electrofilling a metal or alloy inside at least one opening surrounded by a field on a front surface of a substrate, wherein at least one surface inside the at least one opening includes an...

12/10/09 - 20090301892 - Process and apparatus for plating articles
A process and apparatus utilizing at least one conformable anode (40) in a plating process to apply a plating to an article (10). A wire or other material suitable for an anode is shaped to conform to the approximate shape of a region of the article to be coated. The...

12/10/09 - 20090301893 - Methods and apparatus for forming multi-layer structures using adhered masks
Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least...

10/15/09 - 20090255822 - Electrical discharge surface treatment method and dressing method
A first semi-sintered electrode 31 that is formed in a tapered shape whose distal end portion becomes smaller in diameter toward the distal end portion is attached to an electrode supporting tube 26, is configured to be rotatable by a motor 27, is positioned near a seat portion 8 of...

09/10/09 - 20090223828 - Plating method
A plating method for pre-plating or plating a cylinder inner peripheral surface to be treated of a cylinder block by introducing treatment liquid to the cylinder inner peripheral surface by using a plating apparatus provided with a sealing jig having a sealing member and an electrode to which the seal...

06/04/09 - 20090139870 - Plating apparatus and plating method
A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior...

03/19/09 - 20090071837 - Master electrode and method of forming it
A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a conducting material is arranged, said electrode conducting material being electrically connected to...