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Electrolysis: Processes, Compositions Used Therein, And Methods Of Preparing The Compositions > Electrolytic Coating (process, Composition And Method Of Preparing Composition) > Coating Selected Area

Coating Selected Area

Coating Selected Area patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

05/08/14 - 20140124375 - Cationic electrodeposition paint composition paintable even on narrow-clearance portion, and electrodeposition coating film using the same
An object of the present invention is to provide an electrodeposition paint composition and a method of forming an electrodeposited coating, which exhibit quality of coating deposition even in the interior of narrow spaces of objects subjected to painting. A solution of the object is cationic electrodeposition paint composition in...

03/20/14 - 20140076731 - Compound parts
A method for manufacturing a compound part comprises preparing a cavity in a receiving part, selecting a resin for application in the receiving part, applying the resin into the cavity, curing the applied resin, and simultaneously finishing the receiving part and the cured resin....

02/27/14 - 20140054176 - Pattern forming device and pattern forming method
A pattern forming device includes a plurality of tanks, and a power supply device. Each of the tanks has an open end having the same shape as a profile shape of a corresponding one of regions of a surface of a workpiece, in which different types of films are to...

02/27/14 - 20140054177 - Transparent plastic film that can be electroplated for partial electroplating
The present invention relates to an electroplatable plastics film having a light transmission greater than 50%, particularly preferably greater than 80%, for the production of metallised components, in particular partially metallised components....

02/13/14 - 20140042032 - Electroplating method and electroplating apparatus for through-hole
There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole to reduce a diameter of...

01/02/14 - 20140001051 - Method of electroplating and depositing metal
A method of electroplating and depositing metal includes: providing an insulation substrate formed with conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the...

10/10/13 - 20130264213 - Composition for metal electroplating comprising leveling agent
Disclosed is a composition comprising a source of metal ions, one or more suppressing agents and at least one additive comprising a linear or branched, polymeric biguanide compound comprising the structural unit of formula L1 or the corresponding salt thereof, wherein R1 is independently selected from H or an organic...

09/19/13 - 20130240366 - Plated terminations
Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be...

09/12/13 - 20130233719 - Masking process
Methods and systems for masking interior surfaces of a part from exposure to a subsequent process. In some embodiments the interior surfaces are threaded. Methods include forming a plugged insert by overmolding a masking plug material into an opening in the insert, the plug being substantially impervious to exposure to...

03/21/13 - 20130068626 - Composition for metal electroplating comprising leveling agent
A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R1, R2, R3 are each independently selected from an H atom and an organic radical having from 1 to...

03/14/13 - 20130062213 - Method of manufacturing an electrochromic article
The present invention relates to a process for manufacturing an electrochromic article comprising the following successive steps: (a) the deposition of a layer of an electrochromic compound on the surface of a transparent or translucent electrically conductive substrate, said layer of electrochromic compound covering only one portion of the surface...

01/17/13 - 20130015075 - Plating apparatus and plating method
A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing...

01/03/13 - 20130001090 - Polymer film bioelectrodes and methods of making and using the same
Bioelectrodes, methods of making bioelectrodes and methods of using bioelectrodes are provided. The bioelectrodes have an electrically-conductive substrate coated with an electroconductive polymer. The bioelectrode exhibits ohmic behavior over a range of about 1 Hz to about 100 KHz, where ohmic behavior means that the value of the impedance is...

12/27/12 - - Electroplated lead-free bump deposition
A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver...

11/22/12 - 20120292193 - Composition for metal electroplating comprising leveling agent
A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, N-quarternisation or acylation....

11/22/12 - 20120292194 - Electrolytic process using cation permeable barrier
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing...

10/18/12 - 20120261267 - Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers...

09/20/12 - 20120234688 - Method for electrochemical fabrication
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first...

09/13/12 - 20120228143 - Method for electrochemical fabrication
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first...

08/23/12 - 20120211369 - Copper electroplating method
A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive...

08/02/12 - 20120193238 - Compositions for plating copper and methods of forming a copper bump using the same
A composition for plating copper includes an electrolyte solution, an accelerator, a suppressor and a leveler. The electrolyte solution includes a soluble copper salt, sulfuric acid and hydrochloric acid. The accelerator includes about 20 to about 60 ppm of a disulfide compound. The suppressor includes about 40 to about 100...

07/26/12 - 20120186984 - Stencil with pattern and method for forming pattern on workpiece
A stencil with pattern includes a porous material and a masking pattern layer disposed on the porous material. The masking pattern layer includes a patterned mask area covering a portion of the porous material. When electroplating or etching is performed, the stencil with pattern is laminated with a workpiece so...

06/21/12 - 20120152752 - Seed layer deposition in microscale features
A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver...

05/17/12 - 20120118750 - Composition for metal plating comprising suppressing agent for void free submicron feature filling
A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a poly-hydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the...

01/26/12 - 20120018310 - Composition for metal plating comprising suppressing agent for void free submicron feature filling
Composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising at least three active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides....

12/29/11 - 20110315555 - Plating method
Disclosed is a plating method including: performing plating on a plating surface of a plating substrate with a cathode electrode contacting an area in an outer circumferential section of the plating substrate where the cathode electrode is to be contacted, the plating substrate being provided with a dummy plating area...

12/29/11 - 20110315556 - Methods and apparatus for forming multi-layer structures using adhered masks
Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least...

10/27/11 - 20110259750 - Method of direct plating of copper on a ruthenium alloy
A method is disclosed for depositing a copper seed layer onto a substrate surface. In one embodiment, the method includes providing a substrate having a barrier layer disposed on a substrate surface, wherein the barrier layer has a barrier surface comprising a material selected from the group consisting of cobalt,...

07/28/11 - 20110180412 - Plating method and plating apparatus
A plating method can fill a plated metal into interconnect recesses at a higher rate without forming voids in the plated metal embedded in the interconnect recesses. The plating method includes: preparing a substrate having interconnect recesses in a surface; carrying out first pretreatment of the substrate by immersing the...

06/30/11 - 20110155580 - Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of...

06/09/11 - 20110132767 - Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to...

05/12/11 - 20110108427 - Substrate package with through holes for high speed i/o flex cable
An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package...

03/31/11 - 20110073479 - Multi-step release method for electrochemically fabricated structures
Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is...

12/16/10 - 20100314257 - Methods of reducing interlayer discontinuities in electrochemically fabricated three-dimensional structures
Disclosed methods reduce the discontinuities that between individual layers of a structure that is formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist...

10/28/10 - 20100270165 - Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials...

08/05/10 - 20100193366 - Method for electrochemical fabrication
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first...

06/24/10 - 20100155252 - Membrane structure and method of making
A membrane structure is provided. The membrane structure includes a first layer having a plurality of interconnected pores; and a second layer disposed on the first layer. The second layer has a plurality of unconnected pores. Each of the unconnected pores is in fluid communication with at least one of...

06/03/10 - 20100133109 - Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and...

03/25/10 - 20100072072 - Method for the restoration of a metallic coating
d. optionally verifying the quality of the restored metallic coating (2)....

03/18/10 - 20100065432 - Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions
Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective...

03/04/10 - 20100051467 - Process for surface treating aluminum and aluminum alloy articles
A process for surface treating aluminum and aluminum alloy articles is provided. The method includes the steps of providing a substrate of aluminum or aluminum alloy material, the substrate having an internal surface and an external surface; machining the external surface of substrate, thereby forming a first surface appearance on...

02/18/10 - 20100038253 - Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that...

12/03/09 - 20090294292 - Method of surface printing and plating
A method of surface printing and electric plating, it is to perform pre-plating to form a pre-plated layer firstly on a surface of a metallic or non-metallic article to be plated, thereby the metallic or non-metallic surface will not be oxidized, and to perform printing and then electric plating to...

10/01/09 - 20090242410 - Method for electrochemical plating and marking of metals
A method for the electrochemical plating or marking of metals includes providing a metal surface, providing an electroplating solution at the metal surface, and electroplating the metal surface with the electroplating solution. A top layer of the metal surface comprises an oxide scale. The method can also include masking a...

08/20/09 - 20090205967 - Method of forming a multilayer structure
Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed...

06/04/09 - 20090139868 - Method of forming conductive lines and similar features
A print-patterned structure may be used as a self-aligned etch and deposition mask. A method of forming conductive lines and other similar features over a plurality of layers comprises forming a print-patterned structure over a first layer. The print-patterned structure is used as an etch mask to expose a portion...

06/04/09 - 20090139869 - Efab methods and apparatus including spray metal or powder coating processes
Various embodiments of the invention present techniques for forming structures via a combined electrochemical fabrication process and a thermal spraying process or powder deposition processes. In a first set of embodiments, selective deposition occurs via masking processes (e.g. a contact masking process or adhered mask process) and thermal spraying or...

04/23/09 - 20090101508 - Method for electrochemically realizing a hydrophilic area on a hydrophobic substrate
the reducing electrode is subjected to the formation potential of the reducing agent....

04/16/09 - 20090095632 - Electrochemical fabrication method and apparatus for producing three-dimensional structures having improved surface finish
An electrochemical fabrication process produces three-dimensional structures (e.g. components or devices) from a plurality of layers of deposited materials wherein the formation of at least some portions of some layers are produced by operations that remove material or condition selected surfaces of a deposited material. In some embodiments, removal or...

03/05/09 - 20090057156 - Production method for wiring and vias
An additive is added to a plating solution to be used for electroplating. The additive has a plating reaction suppressing capability, but has a characteristic that the plating reaction suppressing capability is reduced as the plating reaction progresses. The additive has a capability for increasing a metal deposition overpotential and...

03/05/09 - 20090057157 - Efab methods including controlled mask to substrate mating
Embodiments include treatment of substrates, formation of structures, and formation of multilayer structures using contact masks where a controlled mating of the contact masks and substrates is used. Some embodiments involve controlled mating at speeds equal to or less than 10 microns/second, more preferably equal to or less than 5...