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Chemistry: Electrical And Wave Energy > Apparatus > Coating, Forming Or Etching By Sputtering > Coating > Specified Target Particulars Specified Target ParticularsSpecified Target Particulars patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/01/07 - 20070251818 - Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets The invention includes physical vapor deposition targets formed of copper material and having an average grain size of less than 50 microns and an absence of course-grain areas throughout the target. The invention encompasses a physical vapor deposition target of a copper material and having an average grain size of ... 09/06/07 - 20070205102 - Support plate for sputter targets Backing plate for sputter targets made of a composite material which comprises 5 to 99 wt. % of at least one refractory metal from the group consisting of Mo, W, Re and Ta and 95 to 1 wt. % of at least one fuirther metallic component from the group consisting ... 09/06/07 - 20070205101 - Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers A sputtering target assembly and method for bonding a sputtering target to a backing plate is disclosed. When insulatively bonding a sputtering target to a backing plate, it is necessary to ensure that the bonding material has good thermal conductivity so that the temperature of the target can be effectively ... 08/16/07 - 20070187236 - Co-cr-pt-b alloy sputtering target Provided is a Co—Cr—Pt—B alloy sputtering target comprising an island-shaped rolled structure formed from a Co-rich phase based on the primary crystal formed upon casting, and a Co—Cr—Pt—B alloy sputtering target in which the island-shaped rolled structure has an average size of 200 μm or less. This Co—Cr—Pt—B alloy sputtering ... 08/02/07 - 20070175753 - Alru sputtering target and manufacturing method thereof An AlRu sputtering target that is a sintered body composed of an AlRu intermetallic compound of 95 vol.% or more is provided. It is manufactured by a stable and low-cost method that provides it with an even texture, significantly reduces oxygen, prevents or suppresses the generation of particles, and improves ... 07/26/07 - 20070170052 - Target for sputtering chamber A sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an annular inclined rim surrounding the cylindrical mesa. In one version, the backing plate comprises a material having ... 07/19/07 - 20070163878 - Manganese alloy sputtering target and method for producing the same A manganese alloy sputtering target characterized in that oxygen is 1000 ppm or less, sulfur is 200 ppm or less and a forged texture is provided, and a method for producing a forged manganese alloy target stably by eliminating the drawbacks of manganese alloy that it is susceptible to cracking ... 06/14/07 - 20070131545 - Packaging device and packaging method for hollow cathode type sputtering target Provided are a packaging device and packaging method of a hollow cathode sputtering target which installs, in the hollow cathode sputtering target, a cover of a size capable of covering a void of the target; provides one or more through-holes to the cover; places a resin bag over them, and ... 06/07/07 - 20070125646 - Sputtering target for titanium sputtering chamber A sputtering target for a sputtering chamber comprises a backing plate and titanium sputtering plate mounted on the backing plate. The sputtering plate comprises a central cylindrical mesa having a plane, and a peripheral inclined annular rim surrounding the cylindrical mesa, the annular rim being inclined relative to the plane ... 06/07/07 - 20070125645 - Sputtering target with few surface defects, and surface processing method thereof Provided is a surface processing method of a sputtering target, wherein a target surface in which intermetallic compounds, oxides, carbides, carbonitrides and other substances without ductility exist in a highly ductile matrix phase at a volume ratio of 1 to 50% is preliminarily subject to the primary processing of cutting ... 05/24/07 - 20070114129 - Sputtering target and manufacturing method therefor, and optical recording medium and manufacturing method therefor To provide a sputtering target used for the formation of a recording layer of a recordable optical recording medium, wherein the sputtering target contains Bi and Fe and the packing density of the sputtering target is greater than 96%, and a recordable optical recording medium manufactured by using the sputtering ... 05/17/07 - 20070108046 - Sputtering target and method for finishing surface of such target Provided is a hollow cathode sputtering target comprising an inner bottom face having a surface roughness of Ra≦1.0 μm, and preferably Ra≦0.5 μm. This hollow cathode sputtering target has superior sputter film evenness (uniformity), generates few arcing and particles, is capable of suppressing the peeling of the redeposited film on ... 05/10/07 - 20070102290 - Novel material development apparatus and novel material development method using arc plasma This invention provides a novel material development apparatus capable of automatically and efficiently forming uniform novel materials with reduced impurities and different compositions individually on respective cells. The novel material development apparatus includes: a plurality of arc plasma guns; a magnetic circuit deflecting/focusing plasma of the arc plasma guns; a ... 05/10/07 - 20070102289 - Sputtering target material The provided is a sputtering target material that is made not to cause an arcing phenomenon and splash phenomenon at the time of sputtering as completely as possible. A portion to be used for sputtering of the sputtering target material is subjected to a friction stir processing. Even with a ... 05/10/07 - 20070102288 - Tantalum sputtering target and method of manufacturing same Provided is a tantalum sputtering target manufactured by working a molten and cast tantalum ingot or billet through forging, annealing and rolling, wherein the structure of the tantalum target comprises a non-recrystallized structure. The tantalum sputtering target having a high deposition speed and excellent uniformity of film, producing less arcings ... 04/26/07 - 20070089986 - Sputtering target and method/apparatus for cooling the target A sputtering target includes an outer target tube, an inner support tube supporting a magnet carrier bar extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof ... 04/26/07 - 20070089985 - Sputtering target and method/apparatus for cooling the target A sputtering target comprising an outer target tube, an inner support tube supporting a magnet carrier extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted ... 04/26/07 - 20070089984 - Methods of making molybdenum titanium sputtering plates and targets Molybdenum titanium sputter targets are provided. In one aspect, the targets are substantially free of the β(Ti, Mo) alloy phase. In another aspect, the targets are substantially comprised of single phase β(Ti, Mo) alloy. In both aspects, particulate emission during sputtering is reduced. Methods of preparing the targets, methods of ... 04/19/07 - 20070084719 - Inertial bonding method of forming a sputtering target assembly and assembly made therefrom A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sputtering ... 04/05/07 - 20070074970 - Device and method of manufacturing sputtering targets The present invention comprises an apparatus for manufacturing a sputtering target that has a crucible for holding a liquid material. The crucible has a discharge opening. A positioning mechanism is mounted adjacent the crucible. A substrate is held by the positioning mechanism. The positioning mechanism moves the substrate such that ... 03/29/07 - 20070068804 - Pvd target with end of service life detection capability A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of ... 03/29/07 - 20070068803 - Pvd target with end of service life detection capability A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of ... 03/22/07 - 20070062809 - Rotary sputtering target, apparatus for manufacture, and method of making The process that is the subject of this invention is a method of making a rotary sputtering target having the steps of providing a cylinder of sputtering target material having an adhesion-wetting layer on its inside surface; providing a stainless steel sputtering target backing tube having an outside diameter smaller ... 03/22/07 - 20070062808 - Sputtering target for phase-change memory, film for phase change memory formed by using the target, and method for producing the target The present invention provides a sputtering target for a phase change memory and a phase change memory film formed with such a target, and the manufacturing method thereof, characterized in that the sputtering target is composed from elements of not less than a three component system and has as its ... 03/22/07 - 20070062807 - Tantalum sputtering target and method for preparation thereof Provided is a tantalum sputtering target having a crystal structure in which the (222) orientation is preferential from a position 10% of the target thickness toward the center face of the target, and a manufacturing method of a tantalum sputtering target, including the steps of forging and recrystallization annealing, and ... 03/22/07 - 20070062806 - Tantalum sputtering target and method for preparation thereof Provided is a tantalum sputtering target having a crystal structure in which the (222) orientation is preferential from a position 10% of the target thickness toward the center face of the target, and a manufacturing method of a tantalum sputtering target, including the steps of forging and recrystallization annealing, and ... 03/22/07 - 20070062805 - Sputtering target with bonding layer of varying thickness under target material Certain example embodiments of this invention relate to a rotatable magnetron sputtering target(s) for use in sputtering material(s) onto a substrate. In certain example embodiments, the target includes a cathode tube with a target material applied thereto via plasma spraying or the like. A bonding layer is provided on the ... 03/15/07 - 20070056850 - Large-area magnetron sputtering chamber with individually controlled sputtering zones The present invention generally provides an apparatus for processing a surface of a substrate in a physical vapor deposition (PVD) chamber that has a sputtering target that has separately biasable sections, regions or zones to improve the deposition uniformity. In general, aspects of the present invention can be used for ... 03/08/07 - 20070051623 - Method of making sputtering target and target Method of making a sputtering target wherein the number of processing steps is reduced by providing melted sputtering target material in a heated mold and solidifying the melted material in the mold using a unidirectional heat removal process to produce a sputtering target with a selective grain orientation. The method ... 03/01/07 - 20070045108 - Monolithic sputter target backing plate with integrated cooling passages A single-piece backing plate for a sputtering target is disclosed where cooling passages are formed internal to the backing plate. In some embodiments, cooling passages can be formed through the edges of a single plate of material by gun drilling. These passages can then be sealed at the edge so ... 02/22/07 - 20070039818 - Method for fabricating a sputtering target A sputtering target includes a backing plate and a copper target provided on the backing plate. A protection layer is formed on the surface of the copper target from a corrosion-resistant metal. Accordingly, the oxidation of the copper target can be suppressed. Thus, the formation of a contaminant layer on ... 02/22/07 - 20070039817 - Copper-containing pvd targets and methods for their manufacture The invention includes a physical vapor deposition target containing copper and at least two additional elements selected from Ag, Al, As, Au, B, Be, Ca, Cd, Co, Cr, Fe, Ga, Ge, Hf, Hg, In, Ir, Li, Mg, Mn, Nb, Ni, Pb, Pd, Pt, Sb, Sc, Si, Sn, Ta, Te, Ti, ... 02/01/07 - 20070023281 - Tantalum sputtering target A tantalum sputtering target, wherein when the sum of the overall crystalline orientation is 1 on a tantalum target surface, the area ratio of crystals having any orientation among (100), (111), (110) does not exceed 0.5. Thus, obtained is a tantalum sputtering target having superior deposition properties where the deposition ... 01/11/07 - 20070007131 - Variable thickness plate for forming variable wall thickness physical vapor deposition target A variable thickness sputtering target which increases the target material thickness at strategic locations to greatly improve the yield of usable wafers per target, and a method of manufacturing such target comprising forming a generally flat and circularly shaped target blank so that a thickness dimension between the top and ... 01/11/07 - 20070007130 - Enhanced magnetron sputtering target An enhanced sputtering target is provided for use in a magnetron sputtering system. The sputtering target includes an active surface from which target material is sputtered and a back surface opposite the active surface. At least one magnet is embedded in the back surface of the target and is oriented ... 01/11/07 - 20070007129 - Universal vacuum coupling for cylindrical target A coupling system (10) to releasably affix a cylindrical target (12) to a spindie (14) comprises the following parts: a) a spindle (14) terminating in a flange portion (16); b) a cylindrical target (12) having at its end a grooved outside circumferential surface (18); c) an interface ring (20) having ... 12/28/06 - 20060289305 - Centering mechanism for aligning sputtering target tiles In a sputtering target assembly comprising a plurality of tiles bonded to a target backing plate with gaps formed between the tiles, centering mechanisms for aligning and centering each of the tiles to the backing plate. The centering mechanism for each tiles can comprise a two or three grooves formed ... 12/28/06 - 20060289304 - Sputtering target with slow-sputter layer under target material Certain example embodiments of this invention relate to a sputtering target(s) for use in sputtering material(s) onto a substrate. In certain example embodiments, the target includes a cathode tube with a slow sputtering material applied thereto prior to application of the target material to be sputtered onto the substrate. Because ... 12/28/06 - 20060289303 - Ito sputtering target Provided are an ITO sputtering target wherein the number of particles having a grain diameter of 100 nm or greater exposed in the ITO sputtering target as a result of royal water etching or sputter etching is 1 particle/μm2, and an ITO sputtering target having a density of 7.12 g/cm3 ... 12/21/06 - 20060283705 - Electron beam welding of sputtering target tiles Embodiments of the invention provide a method of welding sputtering target tiles to form a large sputtering target. Embodiments of a sputtering target assembly with welded sputtering target tiles are also provided. In one embodiment, a method for welding sputtering target tiles in an electron beam welding chamber comprises providing ... 12/07/06 - 20060272941 - Large area elastomer bonded sputtering target and method for manufacturing The present invention includes an assembly comprised of a large sputtering target attached to a backing plate by an elastomer, such as a silicone elastomer, and a method for attaching the large sputtering target to the backing plate using the elastomer as an attachment layer. The method of the present ... 11/30/06 - 20060266643 - Elastomer bonding of large area sputtering target Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bonding at least one sputtering target tile ... 11/23/06 - 20060260937 - Interior antenna for substrate processing chamber An antenna for coupling RF energy to a plasma in a process chamber having a wall comprises a coil having a face exposed to the plasma in the chamber. A plurality of standoffs support the coil at a set spacing from the wall of the process chamber, at least one ... 10/12/06 - 20060226005 - Aluminum-based sputtering targets An Al-based sputtering target mainly containing Al has a total number of concave defects having largest depths of 0.2 μm or more and equivalent area diameters of 0.2 μm or more of 45000 or less per square millimeter of unit surface area of a surface of the sputtering target corresponding ... 08/10/06 - 20060175198 - Method of manufacturing a sputter target The invention relates to a method of manufacturing a sputter target. The method comprises the steps of: —providing a target holder having a coefficient of thermal expansion; —providing a target material having a coefficient of thermal expansion. The target material comprises at least a first and a second compound. The ... 07/20/06 - 20060157346 - Rotating tubular sputter target assembly A target assembly is claimed for use in e.g. a magnetron deposition apparatus. The target assembly is characterised in that at least one of the functions—bearing of the tube, rotation of the tube, electrical contact, coolant sealing and vacuum sealing—is integrated into the tube itself. Such an assembly has the ... 07/13/06 - 20060151320 - Tubular sputtering target A tubular sputtering target with a target body and with an attachment device arranged at at least one end of the target body. The attachment device and/or an end cover are joined with the target body by material joining or positive locking. ... 06/15/06 - 20060124456 - Sputtering target, method for producing sputtering target, sputtering apparatus, and liquid-jet head A sputtering target, which is obtained by rolling a metallic material comprising platinum to form a metal plate having a predetermined thickness, and heating the metal plate for recrystallization, has crystallographic textures isotropic in any of the planar direction and the thickness direction, and has a maximum value of Vickers ... 05/25/06 - 20060108217 - Cooled backing plate for a sputtering target, and sputtering target comprising a plurality of backing plates Claimed is a sputtering target system comprising a plurality of backing plates (2, 3, 4) to be individually cooled. Each backing plate (2, 3, 4) is provided on its back side with a meandering groove (5) that is closed off by a sealing plate. The sealing plate (9) is welded ... 04/20/06 - 20060081465 - Assembly for sputtering aluminum-neodymium alloys −0.15≦(B−A)/A<0.15 (1) ... 04/20/06 - 20060081464 - Backing plates for sputtering targets A backing plate for sputtering targets contains an aluminum alloy having an average coefficient of linear expansion of 23.0×10−6/° C. or less at temperatures of 25° C. to 100° C. This backing plate prevents warp occurring upon bonding with a target, reduces stress occurring upon film deposition (sputtering) of Al—Nd ... 04/06/06 - 20060070876 - Physical vapor deposition target constructions The invention includes a target construction having a sputtering region and a flange region laterally outward relative to the sputtering region. The flange region has a front surface disposed on a front face of the construction and a back surface opposing the front surface. An o-ring groove is disposed within ... 02/16/06 - 20060032741 - Sputtering cathode adapter assembly and method An adapter assembly is provided for supporting a sputtering cathode in a fixed opening in the chamber of a sputter coating machine. The assembly includes: one of several adapter bodies, each configured to support, in the fixed opening, a target of one of a plurality of sizes and types, and ... 02/16/06 - 20060032740 - Slotted thin-film sputter deposition targets for ferromagnetic materials A slotted sputtering target for a magnetron sputtering system for thin-film deposition particularly suited for ferromagnetic target materials such as cobalt, nickel, and iron or an alloy including more than one of these elements. ... 01/12/06 - 20060006064 - Target tiles in a staggered array A sputtering target, particularly for sputter depositing a target material onto large rectangular panels, in which a plurality of target tiles are bonded to a backing plate in a two-dimensional non-rectangular array such that the tiles meet at interstices of no more than three tile, thus locking the tiles against ... 12/22/05 - 20050279629 - Sputtering cathode for coating processes c) the diaphragm (3) and the surfaces of the conduit (4) facing away from the diaphragm (3) are exposed via said supporting structure (12) to the atmospheric pressure outside of the vacuum chamber (18). ... 10/13/05 - 20050224342 - Target support assembly The invention relates to a target support assembly (1) comprising a support (2), on which a target lining is arranged. In order to simplify the production of the target lining or of the target support assembly and/or the placement of the target lining on the support, the target lining is ... 09/15/05 - 20050199492 - Sputtering device The present invention is to provide a sputtering device in which a film can be formed to a large sized substrate efficiently and uniformity of forming film distribution is designed, which comprises a sputtering cathode group including a plurality of sputtering cathodes which are established at a specific arrangement in ... 08/18/05 - 20050178661 - Physical vapor deposition targets The invention includes methods of forming physical vapor deposition targets, and includes targets and target assemblies. The methods of forming the targets comprise hot-pressing or die forging of suitable materials to form a target blank. The target blank has a pair of opposing surfaces, with one of the opposing surfaces ... 07/28/05 - 20050161322 - Replaceable target sidewall insert with texturing This invention provides a sputter target (30) and backing plate (60) assembly having a replaceable sputter target sidewall insert (10). The replaceable sidewall insert (10) enhances the effectiveness and useful life of the assembly by replacing only the insert portion of the sidewall (10) when needed, while retaining the remaining ... 06/23/05 - 20050133366 - Cathode for vacuum sputtering treatment machine A cathode for a vacuum sputtering processing machine includes a target plate mounted on a support having a cooler. The support is secured to a frame delimiting a closed space for positioning and centering the target. The frame peripherally has a profiled catching rim configured to collaborate with a set ... ### FreshPatents.com Support |