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Chemistry: Electrical And Wave Energy > Apparatus > Coating, Forming Or Etching By Sputtering > Coating CoatingCoating patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.10/25/07 - 20070246355 - Batch-type remote plasma processing apparatus A plasma processing apparatus comprises a processing chamber in which a plurality of substrates are stacked and accommodated; a pair of electrodes extending in the stacking direction of the plurality of substrates, which are disposed at one side of the plurality of substrates in said processing chamber, and to which ... 10/25/07 - 20070246354 - Plasma systems with magnetic filter devices to alter film deposition/etching characteristics Plasma systems with magnetic filter devices to alter film deposition/etching characteristics by altering the effective magnetic field distribution. The magnetic filter devices are placed between the magnet or magnets and a target, typically a semiconductor wafer, and selected and configured to alter the magnetic field to obtain the desired processing ... 10/04/07 - 20070227882 - Sputter chamber for coating a substrate The invention relates to a sputter chamber for coating substrates, in which the so-called “picture frame effect” is eliminated or at least largely reduced. The thickness of the coating at the margin of a substrate hereby no longer deviates significantly from the thickness of the coating in the center of ... 09/20/07 - 20070215462 - Target holding apparatus An apparatus for the attachment of a target or target segment (9) of a coating source includes a target or target segment (9) and a target holder (1) which includes a cooling body (3) and connecting means (6,7,8,11) for the attachment of the target or target segment to the cooling ... 08/16/07 - 20070187234 - Facing-targets type sputtering apparatus Provided is a facing-targets sputtering apparatus which attains a target unit of large effective length without employment of an elongated target, and enables a film to be formed on a substrate of large area. The facing-targets sputtering apparatus includes a box-shaped facing-targets sputtering unit 70 and a vacuum chamber 10, ... 08/09/07 - 20070181421 - Sputtering system providing large area sputtering and plasma-assisted reactive gas dissociation This invention provides a sputtering system providing large area sputtering and plasma-assisted reactive gas dissociation. A plurality of plasma sources is provided in a reaction chamber to dissociate at least one reactive gas. The dissociated reactive gas is doped in a film during the deposition of the film so as ... 08/09/07 - 20070181420 - Wafer stage having an encapsulated central pedestal plate A wafer stage includes a bottom insulator plate secured on a bottom portion of the processing chamber; a central pedestal plate mounted on the bottom insulator plate; and a removable top insulator cover having a chamber fittingly accommodating the central pedestal plate and the bottom insulator plate, wherein the top ... 07/12/07 - 20070158188 - Metal foam shield for sputter reactor A shield (22) for protecting chamber walls (14) of a sputter reactor (10) comprising foam metal shaped into a desired shield shape. The foam metal inserts (24) are easily configured for mounting within the sputter reactor chamber. The foam metal shield material provides more surface area and better adhesion of ... 07/12/07 - 20070158187 - Cathode for a vacuum sputtering system A novel cathode for use in a vacuum sputtering system is disclosed. The cathode includes a cathode core and a first removable portion and a second removable portion on the cathode core. ... 03/29/07 - 20070068802 - Substrate carrier The invention relates to a substrate carrier comprising two vertical plates and two horizontal plates. In order for the substrate during its transport through a sputter unit to be coated uniformly in its margin regions, a lever arrangement is provided between the two vertical plates. The lever arrangement comprises at ... 02/15/07 - 20070034508 - Self-adjustable and cross-chamber transmission system A transmission system includes two or more independent chambers, in each of which shafts with gears thereon are provided for rolling in synchronous motion, and a carrier with adjustable gear devices on a bottom thereof. Each of the adjustable gear devices has a base, a movable rack member, vertical springs ... 02/08/07 - 20070029193 - Segmented biased peripheral electrode in plasma processing method and apparatus A system and method for enhancing the plasma etch process uniformity in an ionized PVD semiconductor wafer processing system is provided. The system and method controls chamber conditions so as to produce highly uniform processing for a deposition-etch process sequence and yielding improved coverage capabilities of high aspect ratio (HAR) ... 11/23/06 - 20060260936 - Target assemblies, targets, backing plates, and methods of target cooling The invention includes backing plates having coolant deflectors with at least a portion of each of the deflectors being nonlinear. Projections projecting from the backing plate are configured to insert into openings within a sputtering target. The invention includes targets having at least one opening to receive a fastener extending ... 10/19/06 - 20060231390 - Temperature control of pallet in sputtering system A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm ... 10/19/06 - 20060231389 - Insulated pallet in cleaning chamber A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm ... 08/03/06 - 20060169584 - Physical vapor deposition plasma reactor with rf source power applied to the target A physical vapor deposition reactor includes a vacuum chamber including a sidewall, a ceiling and a wafer support pedestal near a floor of the chamber, a vacuum pump coupled to the chamber, a process gas inlet coupled to the chamber and a process gas source coupled to the process gas ... 08/03/06 - 20060169583 - Sputtering device The present invention is to provide a sputtering device which can achieve film thickness distribution and coverage distribution desired at present in a simple constitution. Accordingly, the present invention is a sputtering device comprising at least; a substrate holder holding a substrate and revolving; sputtering cathode units each of which ... 07/20/06 - 20060157345 - In-line coating/sputtering system with internal static electricity/dust removal and recycle apparatuses An in-line coating/sputtering system includes a clean region with an internal static electricity/dust removal apparatus and an elevator device therein. A loading region has a pressure-down chamber with two gates on opposite ends thereof, one of which is communicated with the clean region. A coating/sputtering region has a vacuum chamber ... 05/11/06 - 20060096855 - Cathode arrangement for atomizing a rotatable target pipe A quick attachment system for cathodes is described. One embodiment of the system comprises a laterally movable support shaft; a flange connected to the support shaft, the flange including a cavity locking element and a shoulder locking element; a bordering separator connectable to a target pipe, the bordering separator comprising ... 03/23/06 - 20060060470 - Pressure switched dual magnetron A dual magnetron for plasma sputtering in which two distinctly different magnetrons are mounted on a common plate rotating about a central axis in back of a target. At least one of the magnetrons is switched on and off by changes in chamber pressure or target power while the other ... 03/09/06 - 20060049040 - Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels A rectangular magnetron placed at the back of a rectangular target to intensify the plasma in a sputter reactor configured for sputtering target material onto a rectangular panel. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of ... ### FreshPatents.com Support |