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Chemistry: Electrical And Wave Energy > Apparatus > Coating, Forming Or Etching By Sputtering Coating, Forming Or Etching By SputteringCoating, Forming Or Etching By Sputtering patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.10/18/07 - 20070240979 - Shield body and vacuum processing apparatus A vacuum processing apparatus using a shield member that is used in a processing chamber of the vacuum processing apparatus, that has a heating unit and that has a simple structure enabling the shield member to be thinned. A vacuum processing apparatus having a processing chamber, a gas exhaust unit ... 07/12/07 - 20070158186 - Apparatus for rotating magnet cathode sputtering with uniform process gas distribution A cathode sputtering source comprises a heat sink comprising a substantially circularly-shaped planar disk formed of an electrically and thermally conductive material, with a circumferentially extending edge connecting first and second opposing major surfaces, the first major surface including a plurality of radially extending, recessed gas supply channels formed therein ... 05/10/07 - 20070102287 - Method and apparatus for an improved optical window deposition shield in a plasma processing system The present invention presents an improved optical window deposition shield an improved optical window deposition shield for optical access to a process space in a plasma processing system through a deposition shield, wherein the design and fabrication of the optical window deposition shield advantageously provides an optically clean access to ... 05/10/07 - 20070102286 - Process kit and target for substrate processing chamber A process kit comprises a ring assembly that is placed about a substrate support in a substrate processing chamber to reduce deposition of process deposits on the chamber components and on an overhang edge of the substrate. The process kit includes a deposition ring, cover ring, and anti-lift bracket, and ... 04/26/07 - 20070089983 - Cathode incorporating fixed or rotating target in combination with a moving magnet assembly and applications thereof A sputtering cathode apparatus having a hollow cylindrical sputter target that is fixed or rotatable about its central axis and an internal magnet assembly that is rotated axially within the sputter target. ... 04/26/07 - 20070089982 - Sputtering target and method/apparatus for cooling the target A sputtering target includes an outer target tube, an inner support tube of rectangular cross-sectional shape supporting a magnet carrier extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within said inner support tube with an inlet at ... 04/12/07 - 20070080059 - Sputtering device A sputtering device according to the present invention comprises at least a vacuum container, a substrate holder arranged in the vacuum container, plural sputtering cathodes each of which has a target for sputtering to a substrate installed on the substrate holder, wherein the plural sputtering cathodes are arranged so that ... 03/08/07 - 20070051622 - Simultaneous ion milling and sputter deposition A magnetron sputter reactor including an ion beam source producing a linear beam that strikes the wafer center at an angle of less than 35°. The linear beam extends across the wafer perpendicular to the beam but has a much short dimension along the beam propagation axis while the wafer ... 02/08/07 - 20070029192 - Tube cathode for use in sputter processes The invention relates to a tube cathode with a target carrier and a target. The target can herein be a single- or a multi-part target. Between target carrier and target are placed several annular elements of a thermally conductive material along the longitudinal axis of the target carrier. The annular ... 01/25/07 - 20070017802 - Automatic in-line sputtering system with an integrated surface corona pretreatment An automatic in-line sputtering system with an integrated surface corona pretreatment includes a first loading region, a corona processing region, a first unloading/reversible region, a first return region, a transfer region, a second loading region, a pressure-down region, a sputtering region, a pressure-up region, a second unloading/reversible region, and a ... 12/14/06 - 20060278524 - System and method for modulating power signals to control sputtering One embodiment includes a sputtering system that includes a vacuum chamber; a substrate transport system configured to transport a substrate through the vacuum chamber; a cathode for supporting a sputtering target, the cathode at least partially inside the vacuum chamber; and a power supply configured to supply power to the ... 12/14/06 - 20060278523 - Real-time adjustable mechanism of shielding plate in sputtering vacuum chamber design A sputtering system includes a chamber with two frames therein. Several shafts are pivoted on the frames for rotation and transport. A shielding plate is placed above the shafts, and several adjustable mechanisms are between the frames and the shielding plate. Each of the adjustable mechanisms has an operation member ... 12/07/06 - 20060272940 - System and a method using rfid tags for tracing a production process of discs A system and a method using RFID tags for tracing a production process of discs, wherein the system comprises a disc spindle, which has an RFID tag, and a plurality of readers. The disc spindle cooperates with the readers to control the production process of discs that pass through a ... 10/19/06 - 20060231388 - Multi-station sputtering and cleaning system A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm ... 10/12/06 - 20060226004 - Machine for coating a substrate, and module A machine for coating a transparent substrate for the production of display screens comprises a coating chamber that has a modular design. Each of the modules 1 features a chamber section 2, a first support 3 that is arranged removably in or at the chamber section 2, and a second ... 10/12/06 - 20060226003 - Apparatus and methods for ionized deposition of a film or thin layer A coil assembly (200) is described herein that comprises a) at least one coil (220) with a width (240); and b) at least one boss (210) coupled to the at least one coil, wherein the at least one boss comprises at least two support sections. Methods of forming and/or producing ... 09/28/06 - 20060213769 - Coils utilized in vapor deposition applications and methods of production A coil assembly for utilization in a vapor deposition system is described herein that includes at least one subject coil having a length, a height, an inside edge, an outside edge and a thickness, wherein the thickness of the subject coil is measured as the distance between the inside edge ... 08/03/06 - 20060169582 - Physical vapor deposition plasma reactor with rf source power applied to the target and having a magnetron A physical vapor deposition reactor includes a metal sputter target, a D.C. sputter power source coupled to the metal sputter target and a wafer support pedestal facing the metal sputter target. A movable magnet array is adjacent a side of the metal sputter target opposite the wafer support pedestal. A ... ### FreshPatents.com Support |