With Lateral Extensions

With Lateral Extensions patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

06/29/06 - 20060137977 - Wafer electroplating apparatus for improving process uniformity
Disclosed is a wafer electroplating apparatus, which includes an electroplating bath comprising an anode in the electroplating bath, an electroplating solution, and a cathode located on the top of the electroplating bath and on to which a wafer is mounted. The cathode comprises a first portion electrically connected to an ...

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