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Chemistry: Electrical And Wave Energy > Apparatus > Electrolytic > Cells > With Feeding And/or Withdrawal Means With Feeding And/or Withdrawal MeansWith Feeding And/or Withdrawal Means patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/08/07 - 20070256931 - Process for the electrochemical decomposition of powders and electrolysis cells suitable therefor Process for the electrochemical decomposition of precursors in powder form by introducing a powder batch between two electrodes of an electrolysis cell, electrodes being designed to be liquid-permeable, and the electrolyte flowing through the powder batch perpendicularly to the electrode surfaces, and electrolysis cell suitable therefor, which is essentially characterized ... 06/07/07 - 20070125642 - Electrolytic cell assembly An electrolytic cell assembly for connection to a liquid flow line includes an electrode set, a cell housing supporting the electrode set, a cell retainer attached to the flow line and in fluid communication with the flow line, and a connection for detachably connecting the housing to the cell retainer ... 09/21/06 - 20060207875 - Electroplating apparatus and electroplating method using the same Provided are an electroplating apparatus and an electroplating method using the electroplating apparatus. The electroplating apparatus includes an electroplating bath, an anode, a cathode, and a conductor. An electroplating solution is supplied into the electroplating bath. An electroplating solution entrance and an electroplating solution exit are formed in the electroplating ... 08/24/06 - 20060185976 - Plating apparatus and method A plating apparatus continuously plates a surface of a substrate with metal and performs its supplementary process in one housing unit. The plating apparatus comprises a cassette stage for placing a substrate cassette thereon, a pre-treatment unit for pre-treating a surface of a substrate, and a plating unit for plating ... 08/17/06 - 20060180463 - Electroionic flow cell electrode configuration The present invention relates to an electroionic apparatus for treating an aqueous solution, including a flow cell through which the aqueous solution may flow, and a high frequency AC power source. A pair of electrodes within the flow cell are in contact with the aqueous solution and coupled to the ... 07/13/06 - 20060151316 - Ion eluting unit and device loaded with same An ion elution unit generates metal ions by applying a voltage between electrodes. Terminals are formed integrally to the electrodes. The terminals protrude downward through the bottom wall of the casing of the ion elution unit. The space between the electrodes becomes narrower from the upstream side to the downstream ... 06/08/06 - 20060118411 - Process and apparatus for multiple surface treatments of battery cans Apparatus for surface treatment of battery cans, including cleaning and electroplating of the interior and exterior surfaces of battery cans as they are transported along a continuously moving production line. The battery cans are automatically loaded from a conveyor onto workpiece holders on a series of circular carriers. Surface processing ... 06/01/06 - 20060113185 - Plating apparatus The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a ... 05/18/06 - 20060102469 - Electroplating apparatus The interior of a stator bar clip that is joined to the end of a stator bar is electroplated so that a metallic barrier coating overlies the braze joint between the stator bar and the clip to define a seal at and around the joint that is substantially impermeable to ... 04/20/06 - 20060081461 - Electroless plating apparatus and method An electroless plating solution includes a first liquid chemical containing a metal salt and a second liquid chemical containing a reducing agent. In respective liquid chemical supply lines, liquid chemical opening/closing units are installed in the vicinity of a junction therebetween, and at the same time, a plating solution opening/closing ... 11/10/05 - 20050247558 - Electrokinetic delivery systems, devices and methods A method of pumping fluid including the steps of providing an electrokinetic pump comprising a pair of double-layer capacitive electrodes having a capacitance of at least 10−2 Farads/cm2 and being connectable to a power source, a porous dielectric material disposed between the electrodes and a reservoir containing pump fluid; connecting ... 09/15/05 - 20050199489 - Electroless deposition apparatus An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include ... 08/11/05 - 20050173243 - Device and method for increasing mass transport at liquid-solid diffusion boundary layer A device and method for increasing the mass transport rate of a chemical or electrochemical process at the solid and fluid interface in a fluid cell. The device includes a membrane in close contact with surface of the work piece, to separate the process cell into two chambers, so that ... ### FreshPatents.com Support |