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Chemistry: Electrical And Wave Energy > Apparatus > Electrolytic > Object Protection > Rotary RotaryRotary patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.02/01/07 - 20070023277 - Plating apparatus, plating cup and cathode ring A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate ... 01/11/07 - 20070007126 - Electrohydrogen generator and molecular separator using moving electrodes and auxiliary electrodes A cylinder containing electrolyte is rotated at a very high speed, which facilitates dissociation of the electrolyte, producing oxygen and hydrogen as well as generating an increased potential difference between an insulated, central cathode and grounded, peripheral, multiple, moving anodes. When the anodes are close to the cathode, there is ... 03/30/06 - 20060065518 - Method and apparatus for polishing an internal surface of an aluminum extrusion hollow shape There is provided an electrolytic integrated polishing apparatus which enables high precision polishing of the internal surface of a long sized cylindrical workpiece such as a metallic tube. The apparatus includes a work supporting unit for disposing the cylindrical workpiece, so that the axial center of the cylindrical portion is ... 03/02/06 - 20060042931 - Ecm-machine ECM machine for electrochemically machining metallic workpieces by anodic dissolution of the workpiece by means of an electrolyte and an applied dc voltage, comprising at least one revolving table for mounting the workpiece or a workpiece carrier, as well as a portal with a transverse girder, at which one or ... 01/12/06 - 20060006060 - Method and apparatus for processing a substrate with minimal edge exclusion An apparatus for processing a material on a surface of a wafer having a diameter includes a cavity defined by a peripheral wall terminating at a peripheral edge and having at least one lateral dimension smaller than the wafer diameter and at least one lateral dimension larger than the wafer ... 12/15/05 - 20050274605 - Method and apparatus for applying a voltage to a substrate during plating A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually parallel orientation, typically vertically, during ... 09/01/05 - 20050189213 - Method and apparatus for copper plating using electroless plating and electroplating A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within ... 07/07/05 - 20050145483 - Apparatus for making particulates of controlled dimension We make particulates, especially magnetic Fe—Co alloys having high magnetic permeability, of controlled dimensions, especially those having a narrow thickness size distribution centered around a median or target thickness in the range of about 0.1-1.0 μm, using electrodeposition typically on a smooth (polished) titanium cathode. Our preferred continuous process uses ... ### FreshPatents.com Support |