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Chemistry: Electrical And Wave Energy > Non-distilling Bottoms Treatment > Coating, Forming Or Etching By Sputtering > Glow Discharge Sputter Deposition (e.g., Cathode Sputtering, Etc.) > Specified Deposition Material Or Use Specified Deposition Material Or UseSpecified Deposition Material Or Use patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/08/07 - 20070256928 - Silicon alloy coating of insulated wire Method and apparatus for sputter coating an insulated wire with a silicon and metal alloy, to provide the wire with sufficient surface conductivity to protect against build-up of electrostatic charge. A sputtering target of silicon has a metal plate positioned close enough to the sputtering site on the target to ... 10/11/07 - 20070235321 - Depositing rhuthenium films using ionized physical vapor deposition (ipvd) An iPVD system is programmed to deposit a barrier and/or seed layer using a Ru-containing material into high aspect ratio nano-size features on semiconductor substrates using a process which enhances the sidewall coverage compared to the field and bottom coverage(s) while minimizing or eliminating overhang within an IPVD processing chamber. ... 09/20/07 - 20070215456 - Oxide sintered body, manufacturing method therefor, manufacturing method for transparent conductive film using the same, and resultant transparent conductive film The present invention relates to the oxide sintered body substantially containing zinc, tin and oxygen, useful as a target, which can be sputtered under charging of high DC power, without generation of arcing or crack, and a manufacturing method for an oxide transparent conductive film formable in high-speed, and the ... 09/13/07 - 20070209928 - Indium oxide-cerium oxide based sputtering target, transparent electroconductive film, and process for producing a transparent electroconductive film A transparent conductive film for constructing a transparent electrode that is free from the generation of residue, etc. by etching with a weak acid (for example, organic acid). Further, there is provided a sputtering target for producing the transparent conductive film. In particular, there is provided a sputtering target composed ... 08/16/07 - 20070187228 - Manufacturing method and apparatus of phase shift mask blank There is disclosed a manufacturing method of a phase shift mask blank in which dispersions of phase angle and transmittance among blanks can be reduced as much as possible and yield is satisfactory. In the manufacturing method of the phase shift mask blank, a process of using a sputtering method ... 07/26/07 - 20070170050 - Method for the production of an ultra barrier layer system The invention relates to a method for producing an ultrabarrier layer system through vacuum coating a substrate with a layer stack that is embodied as an alternating layer system of smoothing layers and transparent ceramic layers, but comprising at least one smoothing layer between two transparent ceramic layers, which are ... 06/28/07 - 20070144892 - Method for forming metal film or stacked layer including metal film with reduced surface roughness A method for forming a metal film with a reduced surface roughness is described. A sputtering process is conducted using a metal target to deposit a layer of metal on a substrate, wherein the DC power density over the sputtered surface of the metal target is set higher than 5 ... 06/21/07 - 20070138001 - Method of forming an inductor on a semiconductor substrate A method of forming an aluminum-copper alloy film capable of preventing copper precipitation includes: (a) loading a wafer into a PVD tool comprising a vacuum transfer chamber that couples to a cool down chamber, an aluminum-copper sputter deposition process chamber and an anti-reflection coating process chamber; (b) sputter-depositing a first ... 06/07/07 - 20070125638 - Deposition of licoo2 In accordance with the present invention, deposition of LiCoO2 layers in a pulsed-dc physical vapor deposition process is presented. Such a deposition can provide a low-temperature, high deposition rate deposition of a crystalline layer of LiCoO2 with a desired (101) or (003) orientation. Some embodiments of the deposition addresses the ... 05/31/07 - 20070119704 - Method for sputtering a multilayer film on a sheet workpiece at a low temperature A method for sputtering a multilayer film on a sheet workpiece at a low temperature of the present invention has the following steps: employing plasma to modify a surface of a sheet workpiece, providing a reciprocating sputtering process to deposit metal oxide layers or semiconductor oxide layers on the sheet ... 05/31/07 - 20070119703 - Molds having multilayer diamond-like carbon film and method for manufacturing same A mold having a multilayer diamond-like carbon film is provided. The mold includes: a molding surface; an adhesive layer formed on the molding surface; a densified layer formed on the adhesive layer, the adhesive layer being configured for enhancing bonding strength between the densified layer and the molding surface, and ... 05/31/07 - 20070119702 - Method for sputtering a multilayer film on a sheet workpiece at a low temperature A method for sputtering a multilayer film on a sheet workpiece at a low temperature of the present invention has the following steps: employing plasma to clean a surface of a sheet workpiece, sputtering at least one metal oxide or semiconductor oxide on the sheet workpiece, and sputtering at least ... 05/17/07 - 20070108043 - Sputtering target including titanium silicon oxide and method of making coated article using the same This invention relates to a sputtering target of or including Ti1-xSixOy and/or a method of making a coated article using such a sputtering target. In certain example embodiments, the Ti1-xSixOy may be substoichiometric with respect to oxygen. In certain example embodiments of this invention, the target may include Ti1-xSixOy where ... 05/03/07 - 20070095654 - Controlled multi-step magnetron sputtering process A multi-step sputtering process in plasma sputter reactor having target and magnetron operable in two modes, for example, in a substrate sputter etch and a substrate sputter deposition. The target has an annular vault facing the wafer to be sputter coated. Various types of magnetic means positioned around the vault ... 05/03/07 - 20070095653 - Method for manufacturing conductive complex oxide layer, and method for manufacturing laminated body having ferroelectric layer A method for manufacturing a conductive complex oxide layer includes the steps of: forming, above a base substrate, a first layer of conductive complex oxide expressed by a general formula of ABO3 by first sputtering with first oxygen concentration; and forming, above the first layer of conductive complex oxide, a ... 03/01/07 - 20070045103 - Aluminum sputtering while biasing wafer An aluminum sputtering process including RF biasing the wafer and a two-step aluminum fill process and apparatus used therefor to fill aluminum into a narrow via hole by sputtering under two distinctly different conditions, preferably in two different plasma sputter reactors. The first step includes sputtering a high fraction of ... 01/11/07 - 20070007124 - Back-biased face target sputtering based memory with low oxygen flow rate Systems and methods are disclosed to form an exemplary memory structure by flowing argon gas and oxygen gas in a deposition chamber; providing a low oxygen flow rate approximately between 0 and ten percent (10%) of an argon flow rate, a pressure approximately between 2×10−5 Torr and 1×10−3 Torr, and ... 12/07/06 - 20060272938 - Method of manufacturing a liquid crystal alignment film utilizing long-throw sputtering The present invention provides a method of manufacturing an LC alignment film utilizing long-throw sputtering. The method includes putting a substrate on a substrate carrier in a chamber, utilizing high-density plasma to bombard a target over the substrate to produce sputtering species, and providing a bias voltage in the chamber. ... 11/09/06 - 20060249373 - Sputtering targets and method for the preparation thereof A process for the preparation of a sputtering target which comprises sub-stoichiometric titanium dioxide, TiOx, where x is below 2, having an electrical resistivity of less than 0.5 ohm.cm, optionally together with niobium oxide, which process comprises plasma spraying titanium dioxide, TiO2, optionally together with niobium oxide, onto a target ... 08/03/06 - 20060169578 - Apparatus for plasma-enhanced physical vapor deposition of copper with rf source power applied through the workpiece with a lighter-than-copper carrier gas A method of performing physical vapor deposition of copper onto an integrated circuit in a vacuum chamber of a plasma reactor includes providing a copper target near a ceiling of the chamber, placing an integrated circuit wafer on a wafer support pedestal facing the target near a floor of the ... 08/03/06 - 20060169577 - Ag base sputtering target and process for producing the same Dave: average value of the grain sizes D at all the selected locations ... 07/13/06 - 20060151313 - Thin film battery, anode film for thin film battery and preparation method thereof Method for preparation of anode film for thin film battery comprises: providing a target material to provide Li ion and Ti ion and a substrate comprising a base layer, a buffer layer and a precious metal current collector layer; sputtering LiMO layer on a said substrate at high temperature in ... 07/06/06 - 20060144697 - Method of making coated article by sputtering cast target to form zinc oxide inclusive layer(s) A coated article includes a coating which has a zinc oxide inclusive layer provided as a contact layer under and directly contacting an infrared (IR) reflecting layer of a material such as silver. It has been found that the emissivity (or emittance) of the coated article can be reduced by ... 07/06/06 - 20060144696 - Magnetron sputtering process A magnetron sputtering process is provided. First, a reaction chamber including a substrate base, a target comprised of Al or its alloy or other metals or their alloy with higher melting point, and a magnetron device. Next, a substrate is disposed onto the substrate base. The pressure within the reaction ... 07/06/06 - 20060144695 - Sputtering process for depositing indium tin oxide and method for forming indium tin oxide layer A sputtering process of indium tin oxide (ITO) is provided. The sputtering process includes the following steps. First, a substrate is moved into a reaction chamber, wherein an ITO target is disposed inside the reaction chamber. Then, a plasma gas and a reaction gas are provided into the reaction chamber ... 06/29/06 - 20060137970 - Shield unit for tin sputtering apparatus, method of coating the same, and sputtering method The present invention relates to a shield unit for a titanium nitride (TiN) sputtering apparatus that can reduce or prevent generation of unwanted particles. An exemplary shield unit for the sputtering apparatus according to an embodiment of the present invention includes an upper shield having a titanium (Ti) coating on ... 06/29/06 - 20060137969 - Method of manufacturing alloy sputtering targets The present invention relates to a composite sputtering target comprising a plurality of bonded metal pieces. The composite sputtering target further comprises a bonded region between the metal pieces. The bonded region may comprise an inter-metallic region upon bonding. The composite sputter target of the present invention may be used ... 06/15/06 - 20060124449 - Thin film coating having niobium-titanium layer The invention provides niobium-titanium films, coatings (e.g., low-emissivity coatings) comprising one or more niobium-titanium films, and substrates bearings such coatings. Methods of depositing niobium-titanium films are also provided. ... 06/15/06 - 20060124448 - Thin film semi-permeable membranes for gas sensor and catalytic applications The invention relates to novel sensors of the catalytic gas-sensing thin-film metal surface type wherein the surface has an inorganic protective membrane coating formed by a pulsed dc sputtering technique. Preferably, the thin-film metal surface is a Pd, Pt, Ni, Au, Ag or an alloy thereof. The inorganic membrane is ... 04/13/06 - 20060076233 - Magnetic recording medium and method for production thereof A reactive sputtering method is provided for producing a magnetic layer in a stable manner with good reproducibility. One aspect of the invention is to form a magnetic layer for a magnetic recording medium without adversely affecting magnetic properties. Carbon oxide gas is added at the time of reactive sputtering. ... 04/06/06 - 20060070870 - Flexible extruded plastic profile, especially plastic tube and method for producing the same A method for making the plastic profile comprising depositing an inner thin film with a metallic appearance onto the surface of the flexible extruded plastic profile depositing an outer protective cover layer that is at least partially transparent onto the inner thin film wherein the inner thin film and the ... 04/06/06 - 20060070869 - Thin film coating and temporary protection technology, insulating glazing units, and associated methods The present invention in some embodiments provides sputter deposition techniques for applying thin film and thereafter applying over the sputtered film a temporary protective film. The thin film can optionally be applied by sputtering a target in a gaseous sputtering atmosphere containing an oxidizing gas and/or an inert gas. The ... 03/23/06 - 20060060466 - Manufacturing method and manufacturing apparatus of magnetoresistance elements A manufacturing method of a magnetoresistance element having a pinned magnetic layer, a non-magnetic intermediate layer, and a free magnetic layer, the method includes forming at least one thin film of the non-magnetic intermediate layer and the free magnetic layer at a pressure of 8.0×10−3 Pa or less in the ... 03/09/06 - 20060049035 - Wear-resistant coating and process for producing it The present invention relates to a process for producing a wear-resistant coating and to a wear-resistant coating on predetermined surfaces of machine or engine parts, in particular for internal combustion engines, which are exposed to frictional wear, comprising at least one nanocrystalline functional layer (4) made up of at least ... 03/02/06 - 20060042930 - Method for reactive sputter deposition of a magnesium oxide (mgo) tunnel barrier in a magnetic tunnel junction As part of the fabrication of a magnetic tunnel junction (MTJ), a magnesium oxide (MgO) tunnel barrier is reactively sputter deposited from a Mg target in the presence of reactive oxygen gas (O2) in the “high-voltage” state to assure that deposition occurs with the Mg target in its metallic mode, ... 03/02/06 - 20060042929 - Method for reactive sputter deposition of an ultra-thin metal oxide film The invention is a method for reactive sputter deposition of an ultra-thin film of an oxide of a first metal onto a film of a second metal. The method can be part of the fabrication of a magnetic tunnel junction (MTJ) with the metal oxide film becoming the tunnel barrier ... 02/02/06 - 20060021871 - Method for fabricating l10 phase alloy film A method for fabricating an L10 alloy film is provided. The method includes steps of (a) providing a substrate; (b) heating the substrate as a preheated substrate at a first temperature ranged from 100° C. to 600° C. for a time period ranged from 5 minutes to 120 minutes, and ... 01/19/06 - 20060011471 - Process for manufacturing a ceramic element for a watch case and element obtained by this process According to this process for manufacturing a ceramic element intended to be fitted onto a watch case, the visible surface of which has features, a soluble layer is selectively deposited on said visible surface, the thickness of said soluble layer being at least equal to the height of said features, ... 01/12/06 - 20060006059 - Method for preparing alumna coating film having alpha-type crystal structure as primary structure For forming alumina films on substrates by sputtering of an aluminum metal target in an oxidizing gas-containing atmosphere, a method of producing α crystal structure-based alumina films efficiently includes as an early film formation, forming films under conditions suited for formation of α crystal structure alumina. For example the forming ... 01/05/06 - 20060000706 - Soil-resistant coating for glass surfaces A glass article which has a water-sheeting coating. In one embodiment, a glass sheet is provided bearing a sputtered water-sheeting coating comprising silica on an exterior surface and bearing a reflective coating on an interior surface. The interior surface of a sheet of glass can be coated with a reflective ... 11/24/05 - 20050258028 - Thin-film coating for wheel rims A process for coating a non-uniform, thin-film, dichroic pattern to a wheel rim or motorcycle part. The thin-film coating adds a colored or iridescent pattern to the wheel rim or motorcycle part, while maintaining other characteristics, such as brilliance, shine, durability and general appearance. The coating is intentionally non-uniform. It ... 09/22/05 - 20050205414 - Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma Increased sidewall coverage by a sputtered material is achieved by generating an ionizing plasma in a relatively low pressure sputtering gas. By reducing the pressure of the sputtering gas, it is believed that the ionization rate of the deposition material passing through the plasma is correspondingly reduced which in turn ... 06/23/05 - 20050133362 - Transferable micro spring structure A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then ... ### FreshPatents.com Support |