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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Particular Conductive Connection (e.g., Crossover) > Feedthrough FeedthroughFeedthrough patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/03/08 - 20080000681 - Printed wiring board A signal line, a power supply pattern and a ground layer are formed within a board. An outer via and an inner via are formed within the board. The outer via is connected to the signal line. The inner via is connected to the ground layer. The outer via serves ... 12/13/07 - 20070284140 - Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced substrate includes a first conductive layer with a plurality of conductors on which an electrical component may be positioned and electrically coupled. The pads ... 10/18/07 - 20070240901 - Wiring board and method for fabricating the same The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation ... 10/18/07 - 20070240900 - Multilayer printed wiring board and component mounting method thereof A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, ... 09/20/07 - 20070215381 - Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores Methods of manufacturing printed wiring boards including electrically conductive constraining cores that involve a single lamination cycle are disclosed. One example of the method of the invention includes drilling a clearance pattern in an electrically conductive constraining core, arranging the electrically conductive constraining core in a stack up that includes ... 09/13/07 - 20070209831 - Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and ... 08/23/07 - 20070193775 - Impedance matching via structure for high-speed printed circuit boards and method of determining same An impedance matching conductive via structure that is effectively constructed by selecting an outer conductor and an inner conductor diameter through analytical calculation or numerical simulation, such that impedance of the conductive via structure is matched to the impedance of the conductive signal traces of a printed circuit board. The ... 08/16/07 - 20070187142 - Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate A blind hole (3) is formed on a substrate (1) from a first side of the substrate toward a second side of the substrate (1). A conductor (11) is filled in the blind hole (3). The substrate (1) is removed from the opposite side to expose the conductor (13) filled ... 07/26/07 - 20070169960 - Multilayer stacked wiring board A multilayer wiring board comprising at least two double-sided wiring boards which comprises an insulating substrate and conductive metal wiring patterns on both surfaces of the insulating substrate. The wiring patterns on the insulating substrate are connected through a conductive metal in a through hole through the insulating substrate. The ... 07/05/07 - 20070151758 - Capacitance laminate and printed circuit board apparatus and method A method is for fabricating an embedded capacitance printed circuit board assembly (400, 1100). The embedded capacitance printed circuit board assembly includes two embedded capacitance structures (110). Each capacitance structure (110) includes a crystallized dielectric oxide layer (115) sandwiched between an outer electrode layer (120) and an inner electrode layer ... 06/28/07 - 20070144774 - Circuit board assembly with fine electrically connecting structure A circuit board assembly with a fine electrically connecting structure is proposed, which includes at least a first circuit layer and at least a dielectric layer formed on surfaces of a circuit board and the first circuit layer. At least one opening is formed penetrating through the dielectric layer for ... 06/28/07 - 20070144773 - Circuit board The present invention relates to a circuit board in which signal lines transmitting a signal are wired, and which is capable of increasing the speed of signal transmission. There is provided a circuit board in which signal lines are wired, including: a signal pad which is formed at the tip ... 06/14/07 - 20070131452 - Multilayer printed circuit board having via arrangements for reducing crosstalk among vias A printed circuit board having via arrangements for reducing crosstalk is disclosed. The printed circuit board includes a first layer and a second layer. The printed circuit board also includes a first via and a second via, both traveling from the first layer to the second layer. The first via ... 06/07/07 - 20070125575 - Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure A dielectric structure comprising: a metal foil; a dielectric layer; and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 μm, the dielectric layer has a thickness of from 0.3 to 5 μm, and the conductor layer has a thickness ... 05/31/07 - 20070119619 - Multilayered wiring board and method for fabricating the same In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made ... 05/17/07 - 20070107934 - Printed circuit board using paste bump and manufacturing method thereof A printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a printed circuit board using paste bumps, comprising: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming ... 05/17/07 - 20070107933 - Internal conductor connection structure and multilayer substrate A multilayer substrate includes an internal conductor connection structure having first and second via conductors adjacent to each other in the multilayer substrate and a first line conductor disposed in the multilayer substrate. The first via conductor includes a first continuous via conductor arranged to extend in a direction away ... 05/10/07 - 20070102191 - Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A ... 05/03/07 - 20070095566 - Printed wiring board and printed circuit board using the same According to one embodiment, disclosed is a printed wiring board in which a plurality of pads are formed on the substrate surface, a surface conductor layer is formed around the pads, and at least one of the pads is partially in contact with the surface conductor layer. ... 05/03/07 - 20070095565 - Wiring board A wiring board (1, 1a, 20, 20a) having: a board body (2, 22) including an insulating material and having a front surface (3, 23), a back surface (4, 24), a cavity (5, 25) having an opening in the front surface (3, 23) of the board body (2, 22) and having ... 04/26/07 - 20070089903 - Printed circuit board A printed circuit board includes a reference layer, a through hole defined in the reference layer, and a plurality of insulating areas are defined in the reference layer around the through hole. The copper around the through hole is separated by the insulating areas and forms a plurality of copper ... 04/26/07 - 20070089902 - Circuit board having a multi-signal via A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole.The open via hole is filled with a non-conductive filling material. ... 04/19/07 - 20070084630 - Coreless substrate and manufacturing method thereof The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and ... 04/19/07 - 20070084630 - Coreless substrate and manufacturing method thereof The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and ... 04/05/07 - 20070074904 - Circuit board and method of manufacturing circuit board A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from ... 04/05/07 - 20070074903 - Key sheet module A key sheet module comprising a single-sided printed wiring board including a front surface on which a plurality of wiring patterns are provided and a plurality of holes provided at predetermined positions, rear-surface connection parts for the wiring patterns being exposed from the holes on a rear surface of the ... 04/05/07 - 20070074902 - Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor The present invention provides a printed-wiring board which can make the electric wiring densified and can be thinned, even when having a BVH of a non-penetration hole filled with a selectively plating, formed therein for interfacial connection means. The printed-wiring board has a blind via hole connecting different wiring-pattern-formed layers ... 03/29/07 - 20070068701 - Air trapped circuit board test pad via A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the ... 03/22/07 - 20070062729 - Printed wiring board and method for manufacturing the same A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the ... 03/22/07 - 20070062728 - Printed wiring board and method for manufacturing the same A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the ... 03/15/07 - 20070056767 - Printed wiring board and method for manufacturing the same A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the ... 03/01/07 - 20070044999 - Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has the circuit board in which a metal substrate ... 02/22/07 - 20070039754 - Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via openings in the substrate using laser irradiation; providing a laser activatable ... 02/15/07 - 20070034405 - Using rows/columns of micro-vias to create pcb routing channels in bga interconnect grid (micro-via channels) A printed circuit board having micro-vias used to connect a portion of the contacts in a selected row or column to the first internal layer of the board, thereby creating routing channels on the second and subsequent internal layers of the board between selected rows or columns of through-board vias ... 02/08/07 - 20070029109 - Multilayer printed wiring board and production method therefor A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a build-up board of plural insulation layers as the main structure. In each of the insulation layers, via holes (columnar conductors) ... 01/11/07 - 20070007034 - Connector-to-pad printed circuit board translator and method of fabrication In one embodiment, a laminated printed circuit board translator is provided. In some embodiments, the translator includes a receiving board adapted to receive a pin, the receiving board includes a plated via extending through the receiving board and has a hole for receiving a pin. An interface board laminated with ... 01/04/07 - 20070000691 - Printed circuit board having vias A printed circuit board (PCB) having vias for reducing reflections of input signals includes a first signal layer, a second signal layer, one via, an input signal line arranged on the first signal layer, and an output signal line arranged on the second signal layer. The via further includes a ... 12/28/06 - 20060289202 - Stacked microvias and method of manufacturing same A flip chip package may include stacked vias in which the diameter D1 of the outermost via is less than the diameter D2 of the innermost via. The ratio D2/D1, for example, may be 1.5 to 2. ... 12/21/06 - 20060283629 - Wiring board and method for manufacturing the same A wiring board for mounting a semiconductor element or electronic component having a plurality of wiring layers, an insulating layer provided between these wiring layers, and a via which is provided to the insulating layer and which electrically connects the wiring layers. In this wiring board, the cross-sectional shape of ... 12/07/06 - 20060272853 - Wiring board and manufacturing method of wiring board A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core ... 11/30/06 - 20060266550 - Through-hole arrangement for a ball grid array package The through holes in an array manner in the signal layer within the chip-interposed region on a substrate of a BGA package comprise a ball pads array having a plurality of ball pads and a vias array. The vias array has a plurality of vias located interlaces with the ball ... 11/30/06 - 20060266549 - Printed circuit board with differential vias arrangement A printed circuit board (PCB) with crosstalk reduction arrangement of differential vias includes a plurality of groups of differential vias, a plurality of signal lines corresponding to the differential vias, and a plurality of layers electrically connected with each other by the differential vias and signal lines. Each group of ... 11/16/06 - 20060254813 - Plating buss and a method of use thereof The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing ... 11/02/06 - 20060243482 - Circuit board structure and method for fabricating the same A circuit board structure and a method for fabricating the same are proposed in the present invention. Firstly, a core layer covered with a first metal layer on a surface thereof is provided. Also, the core layer is formed with at least one through hole penetrating therethrough. A second metal ... 11/02/06 - 20060243481 - Apertures for signal shaping using ground and signal pth back-drilling A method and apparatus for shaping signals transmitted via plated through holes (PTHs) utilizes standard back-drilling techniques to reduce the resonant stub lengths of ground PTHs in the vicinity of a back-drilled signal PTH. ... 10/26/06 - 20060237228 - Printed circuit board having reduced parasitic capacitance pad A printed circuit board (PCB) includes a signal layer, a transmission line on the signal layer, a drill hole penetrating the signal layer, and a pad on the signal layer encircling the drill hole, wherein the pad includes an annular region and at least a port extending out from the ... 10/26/06 - 20060237227 - Circuit board via structure for high speed signaling One embodiment of the invention comprises an improved via structure for use in a printed circuit board (PCB), and method for fabricating the same. The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ... 10/05/06 - 20060219432 - Circuit device A circuit device capable of suppressing reduction of reliability resulting from heat generated in a circuit element is obtained. This circuit device comprises a first insulating layer having a first opening and a second opening, a first conductor filling up the first opening of the first insulating layer, a second ... 10/05/06 - 20060219431 - Electronic circuit for high speed signal transmission An electronic circuit in which a return current path can be acquired effectively, in order to realize high speed signal transmission. The electronic circuit has a first signal layer and a second signal layer, connected with a first via, and at least first and second power supply layers and a ... 09/28/06 - 20060213686 - Cut via structure for and manufacturing method of connecting separate conductors A cut via structure for and a manufacturing method of connecting separate conductors are provided. The cut via structure is electrically connected to a substrate. It includes at least two separate conductors. These conductors form a central-hollow via structure. Alternatively, the central hole can be filled with desired materials (central-filling ... 09/21/06 - 20060207790 - Bonding pads having slotted metal pad and meshed via pattern Bonding pad structures according to the invention will include one or more dielectric layer patterns and/or conductive via patterns provided within the periphery of an associated primary conductive layer pattern. These patterns may be configured so that the patterns on successive levels of the bonding pad metallization sequence are offset ... 08/17/06 - 20060180345 - Perimeter matrix ball grid array circuit package with a populated center A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted ... 08/17/06 - 20060180344 - Multilayer printed wiring board and process for producing the same At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. ... 08/10/06 - 20060175085 - Printed circuit board and forming method thereof A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the ... 08/10/06 - 20060175084 - Wiring board and method for fabricating the same The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation ... 07/27/06 - 20060162960 - System for determining printed circuit board passive channel losses A method for determining passive channel losses for passive channel structures (48) in electronic circuit boards includes selecting parameters from the list including driver/receiver device current and device time or device voltage and device time data, electrical environment variables, electrical data for materials used, electrical data for via structures, copper ... 07/20/06 - 20060157272 - Microvia structure and fabrication A system may include a first microvia pad, a second microvia pad having a projection extending in a direction toward the first microvia pad, and a microvia electrically coupled to the first microvia pad and to the second microvia pad. ... 06/29/06 - 20060137907 - Component for impedance matching A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric layer laterally encasing the conductive ground core, and a signal conductor ... 06/08/06 - 20060118332 - Multilayered circuit board for high-speed, differential signals The present invention provides a multilayered circuit board that can be used in high-density and high-speed electronic applications. ... 05/25/06 - 20060108147 - Printed wiring board A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on ... 05/04/06 - 20060090933 - Apparatus and method for improving printed circuit board signal layer transitions A method and apparatus for improving printed circuit board signal layer transitions are described. In one embodiment, the method includes the formation of a first via within a printed circuit board (PCB). A second via is formed concurrently within the PCB. In one embodiment, the second via is positioned proximate ... 04/13/06 - 20060076160 - Multilayer printed circuit board A multilayer printed circuit board (PCB) includes a plurality of signal planes, two reference planes, a signal via, and a stitching via. The signal via passes through all planes for a signal trace flowing therethrough. The stitching via is defined near the signal via and electrically connects to one of ... 04/06/06 - 20060070769 - Printed circuit board and method of fabricating same Disclosed is a PCB which includes an insulating layer. At least one via hole is formed through the insulating layer. A first electroless plating layer is formed on a wall of the via hole and on at least one side of the insulating layer so as to have a predetermined ... 03/23/06 - 20060060380 - Circuit board having an overlapping via A printed circuit board (100) includes a first BGA landing pad (102) having a first clearance zone (106) and a second BGA landing pad (104) having a second clearance zone (108). A via (110), overlaps the first clearance zone and the second clearance zone such that the first BGA landing ... 03/23/06 - 20060060379 - Printed circuit board structure A printed circuit board structure includes three layer substrates and two layer metal sheets, the each substrate formed with a plurality of hole for conducting the each substrate one another. The two layer metal sheets are positioned between the two adjacent substrate, the each metal sheet is formed with grid ... 03/02/06 - 20060042831 - Visually inspectable surface mount device pad A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form ... 01/26/06 - 20060016620 - Multilayer printed wiring board and production method therefor A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a build-up board of plural insulation layers as the main structure. In each of the insulation layers, via holes (columnar conductors) ... 01/05/06 - 20060000640 - Multilayer printed wiring board and a process of producing same A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by ... 01/05/06 - 20060000639 - Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric ... 12/29/05 - 20050284657 - Double-sided printed circuit board without via holes and method of fabricating the same Disclosed is a method of fabricating a double-sided PCB without via holes, functioning to transport electric signals between both sides of the PCB, by folding a flexible substrate, in which circuit patterns are formed on only one side of the flexible substrate, and the double-sided PCB without the via holes ... 12/22/05 - 20050279529 - Wiring board, magnetic disc apparatus, and production method of wiring board Disclosed is a wiring board, comprising: a rigid substrate having a first surface and a second surface, wiring layers on the first surface and the second surface, and through hole's inner wall conductors electrically conducting the wiring layers on the first and the second surface, the wiring layer on the ... 11/24/05 - 20050257958 - Package modification for channel-routed circuit boards A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vias penetrating at least one layer of the circuit board and being arranged so as ... 11/17/05 - 20050252684 - Electroless copper plating machine thereof, and multi-layer printed wiring board A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating ... 11/17/05 - 20050252683 - Circuit substrate and method of manufacturing plated through slot thereon A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple transmission paths is formed in the linear slot so that a multiple of signals can be transmitted through the ... 11/10/05 - 20050247482 - Wiring base board, method of producing thereof, and electronic device A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as differential transmission at via parts. For this wiring base board, an insulating substrate is used. The wiring ... 11/03/05 - 20050241854 - Layered structure with electric leads for a body worn device Layered structure for a head worn device, wherein electric signals are fed along metallic leads, which are adhered to a layer on or within the layered structure and where a first and a second lead for connecting a first and a second terminal of a component are provided and whereby ... 10/27/05 - 20050236182 - Board for printed wiring, printed wiring board, and method for manufacturing them A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for ... 10/06/05 - 20050217895 - Flexible printed circuits with many tiny holes A board that may include for example a first conductive area on a first side and a second conductive area on a second side of such board. The board may be fitted with a plurality of holes that may for example open or end on both such first side and ... 08/18/05 - 20050178585 - Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... 07/28/05 - 20050161256 - Apparatus and methods for measuring parasitic capacitance and inductance of i/o leads on an electrical component using a network analyzer Apparatus and methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and ... 07/28/05 - 20050161255 - Multi-layer wiring board In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or ... 07/28/05 - 20050161254 - Multilayered circuit board for high-speed, differential signals The present invention provides a multilayered circuit board that can be used in high-density and high-speed electronic applications. ... 07/21/05 - 20050155791 - Multilayer wiring board including stacked via structure A multilayer wiring board includes a substrate, a first planar conductor layer, a second planar conductor layer, resin dielectric layers, filled vias, and stacked via structures. Each of the stacked via structures is disposed in the resin dielectric layers and is configured such that the filled vias are stacked substantially ... 07/14/05 - 20050150686 - Organic dielectric electronic interconnect structures and method for making A method for making a multi-layer electronic structure. A layer of dielectric material having a top surface and a bottom surface is provided. A layer of electrically conducting material is provided on one of the top surface and the bottom surface of the dielectric layer. At least one passage is ... 06/30/05 - 20050139391 - Circuit board with trace configuration for high-speed digital differential signaling Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set of conductive traces parallel to the first set and disposed within the ... 06/30/05 - 20050139390 - Printed circuit board and package having oblique vias Disclosed herein is a via structure that minimizes high frequency loss. A PCB or an IC package of the present invention includes an insulation layer, a plurality of circuit layers, and one or more vias obliquely formed with respect to the circuit layers and constructed to have obtuse angles with ... 06/23/05 - 20050133257 - Printed circuit board with low cross-talk noise A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially ... ### FreshPatents.com Support |