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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Particular Conductive Connection (e.g., Crossover)

With Particular Conductive Connection (e.g., Crossover)

With Particular Conductive Connection (e.g., Crossover) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

09/11/14 - 20140251671 - Micro-channel with conductive particle
A micro-channel structure includes a substrate and a cured layer formed on the substrate. One or more micro-channels are embossed in the cured layer on a cured-layer surface opposite the substrate and define a bottom surface. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate....

09/11/14 - 20140251672 - Micro-channel connection pad
A connection-pad structure includes a substrate and a cured layer formed in the substrate. A group of intersecting micro-channels is embossed in the cured layer opposite the substrate. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate; the intersecting micro-channels form a connection pad. An...

09/11/14 - 20140251673 - Micro-channel connection method
A method of making a connection-pad structure includes providing a substrate and coating a curable layer over the substrate. A group of intersecting micro-channels is embossed in the curable layer. Each micro-channel extends from a surface of the curable layer into the curable layer toward the substrate. The curable layer...

09/11/14 - 20140251674 - Bridge structure in conductive mesh and method for manufacturing the same
A bridge structure for electrically connecting to a second direction meshed conductive trace disposed on a substrate surface, where a first direction meshed conductive trace disposed on the same surface, which includes a first bridging wire, a second bridging wire, an insulating layer, and a conductive bridge. The first bridging...

08/21/14 - 20140231125 - Interconnect joint protective layer apparatus and method
Disclosed herein is a mechanism for forming an interconnect comprising forming a connector on an interconnect disposed on a first surface of a first substrate and applying a nonconductive material in a non-liquid form over the interconnect after forming the connector. The nonconductive material covers at least a lower portion...

08/07/14 - 20140216802 - Substrate structure and the process manufacturing the same
The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the...

07/24/14 - 20140202751 - Paddle card with improved performance
A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair...

07/17/14 - 20140196938 - Lead frame
A lead frame includes a plurality of unit lead frames arranged in a matrix. Leads of adjacent ones of the unit lead frames are connected via a connecting bar, in which a longitudinal connecting bar and a transverse connecting bar are crossed at a crossing part. The lead frame further...

07/17/14 - 20140196939 - Wiring board
To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a...

07/03/14 - 20140182912 - Packaging substrate
A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a...

07/03/14 - 20140182913 - Packaging substrate and method of fabricating the same
A packaging substrate is provided, including a substrate body and conductive pillars. The substrate body has a first surface and a second surface opposite to the first surface. The first surface has a plurality of first conductive pads, and the second surface has a die attach area and a peripheral...

06/26/14 - 20140174807 - High density organic bridge device and method
Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal...

06/26/14 - 20140174808 - Reduced capacitance land pad
A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may...

05/29/14 - 20140144689 - Touch-sensor structure and manufacturing method thereof
A touch-sensor structure includes a substrate having a plurality of grooves formed thereon. A plurality of first axial electrode strips are disposed in the grooves individually. A plurality of second axial electrode strips are disposed on the substrate and intersect with the first axial electrode strips. An insulating layer fills...

05/29/14 - 20140144690 - Method for producing a structure for microelectronic device assembly
The invention concerns the forming of a microelectronic device comprising a substrate containing at least one conductive pad, the said pad being provided with a bottom surface resting on the substrate and an upper surface opposite said bottom surface, the said upper surface of said pad having a stack applied...

05/22/14 - 20140138140 - Pcb pad for imager of vehicle vision system
A circuit board for an image processing chip of a vision system of a vehicle is configured for a surface mount device to be attached thereto and includes at least one mounting location having a plurality of solder pads established thereat. The pads are arranged in a manner that enhances...

05/22/14 - 20140138141 - Peripheral circuit structure
A peripheral circuit structure disposed on a substrate having an element region and a peripheral circuit region is provided. The peripheral circuit structure located in the peripheral circuit region includes first pads, second pads, a first trace, a second trace and third traces connected to the second pads and a...

05/15/14 - 20140131085 - Circuit board having tie bar buried therein and method of fabricating the same
Provided is a circuit board having a tie bar buried therein. The circuit board includes a dielectric stack, at least a first tie bar, at least a first gold finger and at least a first microvia. The dielectric stack includes a first dielectric layer and a second dielectric layer. The...

05/15/14 - 20140131086 - Lead frame strip with half (1/2) thickness pull out tab
A metal lead frame strip is provided for use in manufacturing a packaged electrical device. A ½ thickness engagement portion of the lead frame strip is encapsulated together with the electrical device in a block of encapsulating material to physically secure the lead frame strip to the device package. The...

04/24/14 - 20140110162 - Stacked packages using laser direct structuring
Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces...

04/10/14 - 20140097010 - For electrical circuits
d) a second resiliently flexible part connected at one end to an second end of the second part and connected at its opposite end to a first end of the first part of an adjacent pathway section....

04/10/14 - 20140097011 - Composite component with electrical lines
A composite component composed of a plastics-fibre composite material, having at least two plies of fibre-reinforced material, and at least one electrical line arranged between the at least two plies of fibre-reinforced material....

04/10/14 - 20140097012 - Leadframe for semiconductor packages
A leadframe for semiconductor packages is provided. The leadframe includes a die pad, a side rail, a tie bar, and a plurality of leads. The side rail is around the die pad. The tie bar connects the die pad and the side rail. The leads extend from the side rail...

03/13/14 - 20140069703 - Dual row quad flat no-lead semiconductor package
Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery...

02/27/14 - 20140054078 - Lead frame base plate for light emitting device and manufacturing method of light emitting device using the same
Disclosed is a lead frame base plate for a light emitting device, the base plate including: one or more lead frame areas respectively including a plurality of lead frames repeated in a first direction, the lead frame areas being arranged in parallel to be spaced apart from each other in...

02/13/14 - 20140041918 - Looped interconnect structure
Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed...

02/13/14 - 20140041919 - Circuit structure and manufacturing method thereof
A circuit structure includes an inner circuit layer, a first and a second dielectric layers, a first and a second conductive material layers, and a second and a third conductive layers. The first dielectric layer covers a first conductive layer of the inner circuit layer and has a first surface...

02/13/14 - 20140041920 - Printed circuit board
A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side...

01/23/14 - 20140020944 - Wiring connection structure, terminal portion, parallax barrier substrate, and touch panel
There is provided a wiring connection structure connecting a transparent conductive film formed on a main surface of a transparent substrate having the main surface and a metal wiring formed on the main surface and made of a metal material, wherein the metal wiring is formed to extend from the...

01/16/14 - 20140014404 - Ball grid array (bga) and printed circuit board (pcb) via pattern to reduce differential mode crosstalk between transmit and receive differential signal pairs
A ball grid array (BGA) and via pattern includes a printed circuit board (PCB) having a surface on which a plurality of regions are formed and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a...

01/09/14 - 20140008117 - Connecting structure of circuit board
A connecting structure of a circuit board is provided. The connecting structure includes at least one connecting trace and at least one connecting pad. The connecting trace and the connecting pad are disposed on a surface, or inside of the circuit board. The connecting pad has a first end surface...

01/02/14 - 20140000950 - Multi-layer circuit board and method for manufacturing same
A method for manufacturing a multi-layer circuit board includes steps of: providing three copper clad laminates; forming trace layers in each copper clad laminate by selectively removing portions of copper layer of each copper clad laminate to obtain three first circuit substrates; laminating a dielectric layer on two of the...

01/02/14 - 20140000951 - Printed circuit board and method for manufacturing same
A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad...

12/19/13 - 20130333933 - Delta arrangement of hexagonal-close-packed signal pairs
A circuit board is provided which includes a plurality of signal pairs of connectors. The signal pairs of connectors are disposed in a triangular grouping of three signal pairs of connectors such that a first connector of each signal pair is located at a vertex of the triangular grouping. A...

12/05/13 - 20130319744 - Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe
Embodiments of a method for preparing a leadframe for integrated circuit (IC) die packaging in a molded package with an exposed die pad are disclosed. In one embodiment, a method involves producing a leadframe with a die pad, wherein the die pad has a top surface, a bottom surface, and...

12/05/13 - 20130319745 - Routing structure and display panel
The present invention provides a routing structure and display panel. The routing structure includes a plurality of routing, disposed separately. Each routing corresponds to a symbol, and the symbol is disposed on the routing to act as a part of the routing to conduct electricity. In this manner, the routing...

12/05/13 - 20130319746 - Printed wiring board assembly and related methods
A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and...

11/14/13 - 20130299226 - Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are...

11/07/13 - 20130292168 - Starting material for a sintered bond and process for producing the sintered bond
The invention relates to a starter material for a sintering compound, said starter material comprising particles which at least proportionally contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the...

10/03/13 - 20130256023 - Printed circuit board and method of manufacturing the same
Disclosed herein is a printed circuit board, including: a base substrate having an outer layer circuit; an insulating layer formed partially on the base substrate; and a circuit layer formed on the insulating layer....

08/29/13 - 20130220689 - Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
A manufacturing method of electrical bridges, wherein a conductive pattern (2) from electroconductive material, such as metal foil, is applied over a substrate (1) made of electrically insulating material and the electroconductive material has at least one strip tongue (3) unattached to the substrate, one side of the tongue is...

08/22/13 - 20130213704 - Package structure and the method to fabricate thereof
The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive...

07/25/13 - 20130186678 - Substrate set, electronic device, and method for manufacturing substrate set
Provided is a highly accurately alignable substrate set, the cost of which is kept low. In the substrate set, a light source FPC substrate (11) has a notch (16), and an anode pad (13) and a cathode pad (14) that are disposed so as to sandwich the notch (16) therebetween,...

07/18/13 - 20130180771 - Suspended lattice for electrical interconnects
An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a...

07/11/13 - 20130175076 - Component carrier, electric conductor and method for producing a component carrier as well as an electric conductor
The disclosure relates to a component carrier or printed circuit board for electronic components. According to embodiments, a component carrier may include a first contact face for a contact to a first component, a second contact face for a contact to a second component as well as a conductor track...

06/27/13 - 20130161081 - Connecting structure of touch panel
Disclosed herein is a connecting structure of a touch panel, the connecting structure including a circuit line of a base substrate, a connecting portion having a surface of the circuit line, and a touch signal line connected to the surface of the circuit line and formed on a transparent substrate,...

05/30/13 - 20130133937 - Mesh planes with alternating spaces for multi-layered ceramic packages
An improved multi-layered ceramic package includes a plurality of signal planes, each having one or more signal lines; a plurality of vias, each providing one of a voltage (Vdd) power connection or a ground (Gnd) connection; and at least one reference mesh plane adjacent to one or more signal planes....

05/30/13 - 20130133938 - Dicing sheet and a production method of a semiconductor chip
A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 μm. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond...

05/09/13 - 20130112467 - System and method for controlling radio frequency transmissions from an electronic device
The disclosure relates to a printed circuit board (PCB) for an electronic circuit for a power amplifier of a wireless communication device. The PCB comprises: a substrate; a ground reference in the substrate; first through fourth locations and first and second pads in the substrate; and first and second electrical...

05/02/13 - 20130105211 - Low cost and high performance bonding of wafer to interposer & method of forming vias and circuits
A low cost and high performance method for bonding a wafer to an interposer is provided. The technology provides designs and metallization techniques for through via glass applications that is thermal coefficient expansion matched to the glass or synthetic fused quartz substrates. An off-the-shelf glass, such as borosilicate based or...

04/04/13 - 20130081868 - Printed circuit board
Disclosed herein is a printed circuit board, including: a dielectric substrate having a ground surface; a plurality of pads formed on the dielectric substrate; a transmission line transmitting a signal between the plurality of pads; and slots formed in partial regions of the ground surface correspondingly to the pads, thereby...

04/04/13 - 20130081869 - Touch sensing apparatus and method of manufacturing the same
Disclosed is a touch sensing apparatus having a transparent substrate that includes a touch sensing region and a peripheral region outside the touch sensing region. The touch sensing region may include a pair of column electrodes extending in a vertical direction; a plurality of patch electrodes arranged in two columns...