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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Particular Conductive Connection (e.g., Crossover) With Particular Conductive Connection (e.g., Crossover)With Particular Conductive Connection (e.g., Crossover) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/31/08 - 20080023220 - Plating buss and a method of use thereof The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing ... 01/24/08 - 20080017410 - Method for forming a plated microvia interconnect A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a substrate in direct mechanical contact with a conductive element thereon. An opening in the EDL exposes the conductive element and create a microvia in the EDL. A sidewall and bottom wall surface of ... 01/17/08 - 20080011509 - Fractal and space-filling transmission lines, resonators, filters and passive network elements A high frequency electromagnetic circuit is disclosed as being patterned on a metallic or superconducting film on top of a dielectric in a plurality of configurations. A part of the circuit such as the characteristic strip or slot of the configurations is shaped in a novel space-filling geometry which allows ... 10/04/07 - 20070227766 - Drill and method of producing printed circuit board A drill in which no positional shift on a drilled hole and no irregularities on an internal wall are formed. A torsion angle of a shaving discharge groove of a drill is set in the range of 30 degrees to 50 degrees. In this manner, a positional shift of a ... 09/13/07 - 20070209830 - Semiconductor chip package having a slot type metal film carrying a wire-bonding chip A chip package with COB configuration is disclosed. A thin film substrate as a carrier of a wire-bonded chip has a slot, wherein the electrical connection between the chip and the thin film substrate are a plurality of bonding wires through the slot. The thin film substrate includes a patterned ... 08/16/07 - 20070187141 - Circuit board with configurable ground link A circuit board for transitioning a cable to a connector comprises a circuit board having an outer surface. A circuit trace provided on the outer surface has a cable pad and a contact pad provided at different ends of the outer surface. A ground plane is held by the circuit ... 08/09/07 - 20070181337 - Direct wire attach An assembly has a conductive trace on a substrate and at least one conductor electrically coupled to the trace. First and second gaps arranged such that one gap is on either side the trace, allowing control of electrical characteristics of a signal path formed of the conductor and the trace. ... 07/12/07 - 20070158105 - Multilayer wiring board capable of reducing noise over wide frequency band with simple structure A multilayer wiring board 10 has a high-capacitance layer 121 formed between a ground layer 141 and a power supply layer 15 and a high-capacitance layer 122 formed between the power supply layer 15 and a ground layer 142. The high-capacitance layers 121 and 122 are different in capacitance from ... 07/12/07 - 20070158104 - Printed wiring board and production method thereof The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conductor circuit free from undercuts which is ... 07/05/07 - 20070151757 - Wiring board and wiring board module A wiring board module includes a multilayer wiring board. A crystal oscillator and an IC component, for example, are mounted on the mounting surface of the multilayer wiring board. Mounting lands for the IC component, mounting lands for the crystal oscillator, and mounting lands for other surface mount components are ... 04/05/07 - 20070074901 - Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus According to one embodiment of, a multilayer printed wiring board comprises an electronic part, a mount layer where the electronic part is mounted, a mount layer conductor pattern formed in the mount layer, an opposite layer containing the electronic part between itself and the mount layer, an opposite layer conductor ... 03/29/07 - 20070068700 - Electric contact and method for producing the same and connector using the electric contacts A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the ... 03/22/07 - 20070062727 - Three-dimensional printed circuit board A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated on at least one of the one or more side surfaces. The one or more solder ... 02/15/07 - 20070034404 - Tab tape for tape carrier package A TAB tape for a tape carrier package may have an opening formed in a shortest connection portion. The opening may be provided in the shortest connection portion and a portion of the corresponding second lead. The opening may be arranged near a boundary between the corresponding first lead and ... 12/28/06 - 20060289201 - Backlight assembly, display device having the same, and method thereof A backlight assembly and a display device having the backlight assembly are provided where the backlight assembly includes a plurality of light sources for emitting light and a plurality of metal core printed circuit boards on which the light sources are mounted. The metal core printed circuit boards are directly ... 12/07/06 - 20060272852 - Matched-impedance high-bandwidth configuration jumper The present invention provides a matched-impedance jumper that is operable to connect pairs of differential signal conductors to provide improved signal transmission characteristics. In an embodiment of the invention, the impedance-matched jumper is used to connect a first pair of differential signal conductors to a selected pair of differential signal ... 11/09/06 - 20060249303 - Connectorless electronic interface between rigid and compliant members using hemi-ellipsoidal surface features A connectorless board-to-board, cable-to-board or cable-to-cable interconnect is presented. The interconnect is fashioned from solder beads or hemi-ellipsoidal surface structures on traces of a printed circuit board on one portion of the interconnect and contact pads on traces of a flexible interconnect media of a second portion of the interconnect ... 10/12/06 - 20060225919 - Plating buss and a method of use thereof The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing ... 08/31/06 - 20060191714 - High frequency multilayer circuit structure and method for the manufacture thereof In a Conductor-Backed Coplanar Waveguide (CBCPW) structure, an effective dielectric constant of a parallel plate waveguide is higher than that of a Coplanar Waveguide (CPW), so that a parallel plate leakage is generated. To reduce the parallel plate leakage, the present invention provides air cavities, whose dielectric constant is low, ... 08/31/06 - 20060191713 - Fusible device and method Electrically conductive devices and methods of making such devices are disclosed. One such device has a fusible conductor and a substrate. The substrate may support the fusible conductor. The substrate may have an outer perimeter and within the outer perimeter the substrate may have a heat-transfer-resisting material-deficient portion proximate to ... 08/24/06 - 20060185895 - Universal pattern of contact pads for semiconductor reflow interconnections An insulating substrate comprises an orderly and repetitive arrangement of a plurality of metal pads (320, 321) of about the same size interconnected by conductive traces (330), wherein these traces form parallel equidistant rows. The plurality of pads is divided in sub-arrays (380, 381) of equal numbers of pads. The ... 06/29/06 - 20060137906 - Printed wiring board and method of manufacturing the same The present invention provides a printed wiring board in which there is no positional deviation between a blind via hole and a round and which enables high-density wiring design to be easily achieved. Provided is a method of manufacturing a printed wiring board in which wiring pattern forming layers are ... 06/22/06 - 20060131070 - Power delivery mechanism According to one embodiment, a system is disclosed. The system includes a power supply a printed circuit board (PCB). The PCB includes a voltage regulator and a bus bar to couple power from the power supply to the voltage regulator ... 06/15/06 - 20060124351 - Flexible multilayer wiring board and manufacture method thereof Metal foil is laminated via an insulating layer so as to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed so as to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power ... 06/08/06 - 20060118331 - Printed circuit boards for use in optical transceivers One example of an optical transceiver includes a housing and an optical transmitter and optical receiver disposed within the housing. A PCB is also disposed in the housing. The PCB has front and side edges, as well as circuitry in communication with the optical transmitter and the optical receiver. The ... 06/08/06 - 20060118330 - Wired circuit board and connecting structure thereof A wired circuit board that can allow precise connection between wired circuit boards with respect to a direction orthogonal to each other with a simple structure, while allowing reduction in size of the wired circuit boards, and a connecting structure of the wired circuit board comprising two wired circuit boards ... 06/01/06 - 20060113109 - Circuit board To provide a circuit board comprising a plurality of first signal lines which transmits first signals, a plurality of second signal lines which transmits second signals which are higher in speed than the first signals, a joint which is bonded to a joint of another circuit board through an anisotropic ... 05/04/06 - 20060090932 - Solder-bearing wafer for use in soldering operations A solder-bearing wafer is provided for use in a soldering operation. The solder-bearing wafer is designed to provide a solder material which is used in a soldering operation for electrically connecting a first electronic device to a second electronic device. According to a first embodiment, the wafer comprises a substrate ... 04/27/06 - 20060086534 - Electro-optic hybrid circuit board A method for embedding tamper proof layers and discrete components into a printed circuit board stack-up is disclosed. According to this method, a plating mask is applied on a base substrate to cover partially one of its faces. Conductive ink is then spread on this face so as to fill ... 04/13/06 - 20060076159 - Contour structures to highlight inspection regions An integrated circuit has a wiring layer below an insulator layer. A pad comprises a conductive material that is on the insulator layer. The pad has a wirebond connection region and a probe pad region. An inspection mark is between the wirebond connection region and the probe pad region. The ... 03/23/06 - 20060060378 - Modular electronic card for a communication network Modular electronic card to support and manage a plurality of calculation nodes and their interconnections with a three-dimensional topology, wherein each node includes a card carrying at least a processing unit, a memory battery and connection members with the modular card. The modular electronic card has a spatial density of ... 03/16/06 - 20060054353 - Method and device for protection of a component or module A connectivity from a module to a board is ordinary achieved with pads as via Land Grid Array (LGA), where an inner area of the module is provided with pads designated for electrical connectivity to corresponding points of connection on the board. To protect the component or the module and ... 02/16/06 - 20060032669 - Electronic circuit device An electronic circuit device includes at least two circuit substrates for mounting electronic components and a flexible board for external electrical connection disposed between the circuit substrates. The flexible board is electrically connected to at least the surface of one circuit substrate opposed to another circuit substrate. ... 02/09/06 - 20060027396 - Hot bar soldering method for soldering two circuit boards together The present invention relates to a hot bar soldering method for soldering two circuit boards, including following steps: firstly, providing a first circuit board (4) including a plurality of first pads (42) and a second circuit board (5) including a plurality of second pads (52), each of the pads having ... 12/08/05 - 20050269130 - Plating buss and a method of use thereof The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing ... 11/10/05 - 20050247481 - Circuit board with quality-indicator mark and method for indicating quality of the circuit board A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around each circuit board unit and extended to form a plating trace in an inner-layer circuit structure of ... 11/03/05 - 20050241853 - Display, wiring board, and method of manufacturing the same Provided is a wiring board including an insulating substrate with a first region and a second region adjacent to each other on a major surface, signal line groups arrayed on the first region, and connection portions arranged on the second region in correspondence with the signal line groups, wherein each ... 11/03/05 - 20050241852 - Cross-connecting by permutations using configurable printed circuits The invention relates to wiring in a junction box using a printed circuit panel having on one of its edges N input terminals and on the opposite edge N output terminals, and between said two edges, a plurality of stages of individual connection devices each having two inputs and two ... 09/29/05 - 20050211466 - Measuring device An intelligent sensor module (1) with an electrical sensor element (2; 3) and a printed circuit board (4) comprises a bipartite guiding means through which electrical connecting wires (23, 24, 25) are guided to the printed circuit board (4) in an insulated fashion at a certain spacing from one another. ... 09/15/05 - 20050199422 - Maximizing capacitance per unit area while minimizing signal transmission delay in pcb A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section having a first dielectric constant (DK), a second section having a second DK lower than the first DK and ... 08/25/05 - 20050183885 - Conducting structure of a multi-layers ic board The invention relates to a conducting structure of a multi-layers IC board, which includes conducting rod being received in aperture of the IC board to obtain an effective connection and conduction. And the conducting wire is placed horizontally on the IC board, which has its ending pin and annular metal ... 07/28/05 - 20050161253 - Tamper barrier for electronic device A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom ... 07/21/05 - 20050155790 - Mounting board and electronic device using same Wiring electrodes are formed on a first principal surface of a base substrate. An insulation film partially covers the first principal surface of the base substrate and the wiring electrodes. The insulation film has opening portions where the base substrate and the wiring electrodes are not coated with the insulation ... 06/23/05 - 20050133256 - Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands for testing the driver IC mounted on the tape substrate, and a plating terminal used for plating the land. The test ... 06/23/05 - 20050133255 - Method and apparatus for trace shielding and routing on a substrate Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of ... 06/23/05 - 20050133254 - Direct integration of inorganic nanowires with micron-sized electrodes An electronic device such as a sensor or a NEMS. The electronic device comprises at least one substrate; a plurality of electrodes disposed on the substrate; and at least one nano-wire growing from an edge of a first electrode to an edge of a second electrode. A method for making ... 06/09/05 - 20050121229 - Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal ... ### FreshPatents.com Support |