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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Electrical Device With Electrical DeviceWith Electrical Device patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/24/08 - 20080017409 - Multilayer board A multilayer board includes a base member made of an insulation material. A plurality of conductor patterns is disposed in the base member in a multi-layered manner. A plurality of interlayer connectors is disposed in the base member, and is electrically connected to the conductor pattern by a heating process. ... 01/24/08 - 20080017408 - Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package A method of fabricating a device including plural electronic parts mounted on a circuit board with mounting areas for mounting the electronic parts being covered by a sealing resin is disclosed. The method prevents small air bubbles from entering into the sealing resin near the electronic parts. The method includes ... 01/17/08 - 20080011508 - Electronic parts packaging structure and method of manufacturing the same An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess ... 01/17/08 - 20080011507 - Build-up printed wiring board substrate having a core layer that is part of a circuit Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are ... 01/10/08 - 20080006441 - Wiring board and semiconductor device excellent in folding endurance A wiring board with folding endurance includes an insulating film and a copper-containing wiring pattern on a surface of the insulating film, and includes an insulating resin coating layer formed on the wiring pattern such that terminals are exposed. The wiring board has any of the constitutions (A), (B), (C) ... 01/03/08 - 20080000676 - Circuit board A method of forming a circuit board, the method comprising mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first laminate material; and attaching a second laminate material to the first surface of ... 12/27/07 - 20070295533 - Buildup board, and electronic component and apparatus having the buildup board A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and ... 12/27/07 - 20070295532 - Multilayer printed wiring board A multilayer printed wiring board 10 includes: a build-up layer 30 that is formed on a core substrate 20 and has a conductor pattern 32 disposed on an upper surface; a low elastic modulus layer 40 that is formed on the build-up layer 30; lands 52 that are disposed on ... 12/20/07 - 20070289772 - Electronic circuit The present invention has an object to provide an electronic circuit capable of efficiently transmitting signals in a case where signals are transmitted over substrates with three or more substrates three-dimensionally mounted. In the present invention, LSI chips are stacked in three layers, and a bus is formed over three ... 12/06/07 - 20070278000 - Component-embedded printed wiring board, manufacturing method for component-embedded printed wiring board, and electronic apparatus According to one embodiment, a component-embedded printed wiring board includes a base including a component mounting surface, a pair of conductive patterns which is disposed on the component mounting surface of the base, and a circuit component which is mounted on the base so as to be in close contact ... 12/06/07 - 20070277999 - Circuit board and electrical connection box having the same A circuit board includes a metal core having a plate shape, an insulation section covering a surface of the metal core, and a heat radiation section in which the metal core is exposed and which is provided at a circumference of the metal core. ... 11/22/07 - 20070267217 - Method for manufacturing a miniaturized three-dimensional electric component Manufacturing of miniaturised three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one polymer layer onto which layer at least one conductive path is provided. ... 11/08/07 - 20070256859 - Ceramic multilayer substrate and its manufacturing method A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film ... 11/08/07 - 20070256858 - Heat resistant substrate incorporated circuit wiring board This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are ... 10/25/07 - 20070246252 - Manufacture of printed circuit boards with stubless plated through-holes A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed ... 10/11/07 - 20070235217 - Devices with microjetted polymer standoffs An electronic package having a controlled standoff height between a surface mount electronic device and a substrate includes a plurality of polymeric standoffs adhered to at least one of the underside of the surface mount electronic device or an upper surface of the substrate. The polymeric standoffs prevent collapse of ... 10/11/07 - 20070235216 - Multichip package system A multichip integrated circuit package system is provided attaching a first integrated circuit die on a substrate top surface, mounting a second integrated circuit die over the first integrated circuit die, connecting an external interconnect on a substrate bottom surface, and forming a first encapsulation having a recess to expose ... 10/11/07 - 20070235215 - Multiple flip-chip integrated circuit package system An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate. ... 10/04/07 - 20070227765 - Multilayer printed circuit board and multilayer printed circuit board manufacturing method A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit ... 09/27/07 - 20070221402 - Soft wire bank joint device A soft wire bank joint device comprises a body and a joint connected to one end of the body; the body including: a first insulating layer; a conductive wire layer located above the first insulating layer; a second insulating layer located above the conductive wire layer; a silver shielding layer ... 09/27/07 - 20070221401 - Releasably mountable electronics component A releasably mountable electronics component is provided. The electronics component comprises a backing having a mounting surface and an electronic module joined to the mounting surface of the backing. The electronic module has electrical contacts disposed on a first side thereof. The electronic module also includes an adhesive covering at ... 09/06/07 - 20070205018 - Multilayer printed board, electronic apparatus, and packaging method A multilayer printed board comprising a plurality of capacitive coupling layers (6) each consisting of a dielectric layer (4) and a power supply layer (3) and a ground layer (5) facing each other while sandwiching the dielectric layer (4), first vias (7) connecting between the power supply layers (3) included ... 09/06/07 - 20070205017 - Circuit device and method of manufacturing the same In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small ... 08/16/07 - 20070187140 - Printed wiring board with a pin for mounting a component and an electronic device using it The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using ... 08/02/07 - 20070175658 - High performance chip carrier substrate A multilayer chip carrier with increased space for power distribution PTHs and reduced power-related noise. In a multilayer chip carrier with two signal redistribution fanout layers, in addition to signal escape from near-edge signal pads at the first fanout layer, remaining signal pads are moved closer to the edge of ... 08/02/07 - 20070175656 - Electrical component on a substrate and method for production thereof In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. ... 07/26/07 - 20070169959 - Microelectronic device with mixed dielectric A microelectronic device and method of making the microelectronic device is provided. A dielectric substrate having first and second surfaces is provided. A first component, located in the dielectric substrate between the first and second surfaces of the dielectric substrate is formed. The first component includes a first interface and ... 07/12/07 - 20070158103 - Multilayer board with built-in chip-type electronic component and manufacturing method thereof A chip-type electronic component built-in multilayer board includes a multilayer board including two or more layered dielectric layers and an inner conductor pattern, and a chip-type electronic component which is provided at the interface of the upper and lower dielectric layers and includes an external terminal electrode. The external terminal ... 07/12/07 - 20070158102 - Method of attaching a high power surface mount transistor to a printed circuit board A power device that includes a printed circuit board having one or more dielectric and copper layers between a top and a bottom metal layer. The power device includes an area extending through all metal and dielectric layers of the printed circuit board except the bottom metal layer. A semiconductor ... 07/12/07 - 20070158101 - Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal ... 07/05/07 - 20070151756 - Flexible substrate having interlaminar junctions, and process for producing the same A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second ... 06/28/07 - 20070144772 - Method of making circuitized substrate with split conductive layer and information handling system utilizing same A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within ... 06/28/07 - 20070144770 - Printed wiring board including power supply layer and ground layer A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second ground layer. First and second electrically-conductive pieces are interposed between the first and second power supply ... 06/28/07 - 20070144769 - Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate A printed circuit is made by laser projection patterning a metal panel of a substrate, laminating a dielectric layer on the metal panel, laser irradiating the substrate to form vias in the substrate, laser activating a seed coat on the substrate, washing the seed coat from an unpatterned portion of ... 06/21/07 - 20070137890 - Printed wiring board A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is ... 06/21/07 - 20070137889 - Multi-strand substrate for ball-grid array assemblies and method A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 ... 06/21/07 - 20070137888 - Cable clamp An object of the present invention is to provide a cable clamp which can be installed on a printed wiring board automatically without forming a through hole in the printed wiring board. A cable clamp (1), which is installed on a printed wiring board (20) to hold cables (21,21, . ... 06/14/07 - 20070131451 - Electrical interconnect with maximized electrical contact An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of ... 06/07/07 - 20070125574 - Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and ... 06/07/07 - 20070125573 - Printed circuit board A printed circuit board includes a plurality of pairs of first bond pads mounted on an area of a surface thereof, and a plurality of pairs of second bond pads mounted to on the same area thereof. One first bond pad of each pair is electrically connected to a first ... 06/07/07 - 20070125572 - Thin circuit board A thin circuit board includes a dielectric layer with at least one cavity formed on a surface thereof; a metal pad formed in the cavity; at least one circuit layer formed on another surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer to ... 06/07/07 - 20070125571 - Column grid array using compliant core A method for forming interconnections within a column grid array is provided. The method involves casting one or more columns with at least a compliant core material that increases flexibility between an electronic component and a printed wiring board by at least a factor of two over metallic-based solder columns, ... 05/31/07 - 20070119618 - Wiring board, electronic component mounting structure, and electronic component mounting method A flip chip mounting method for improving the accuracy of positioning of a semiconductor chip and avoiding a short circuit between protruding electrodes even when the protruding electrodes are formed at smaller spacings. The method comprises: placing a semiconductor chip on a wiring board, the semiconductor chip having protruding electrodes ... 05/31/07 - 20070119617 - Method for manufacturing component built-in module, and component built-in module A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second ... 05/24/07 - 20070114058 - Circuit board and its manufacturing method A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive ... 05/24/07 - 20070114057 - Printed wiring board and fabrication method for printed wiring board A printed wiring board on which a pattern can be formed favorably by printing and soldering even where a small part of the 1005 size or less is mounted. The printed wiring board includes a substrate; a pair of soldering lands on the substrate, the soldering lands being spaced from ... 05/17/07 - 20070107932 - Moisture resistant chip package A moisture resistant chip package includes a substrate, a chip mounted to the substrate, and a cover over the chip and secured to the substrate. The substrate and/or the cover includes at least one LCP layer. Each moisture ingress path through the thickness of any LCP layer is restricted by ... 05/10/07 - 20070102190 - Circuit device and method of manufacturing the same To provide a circuit device having both of high heat releasing property and high breakdown voltage, and a method of manufacturing the same. A first insulating layer is formed on a front surface of a circuit board, and a second insulating layer is formed on a rear surface thereof. Conductive ... 05/03/07 - 20070095564 - Thin printed circuit board The present invention is directed to a printed circuit board, comprising: at least one chip; and a board comprising at least one aperture corresponding to each chip, for enabling each chip to be placed inside the corresponding aperture, thereby enabling reducing the thickness of the printed circuit board to that ... 04/26/07 - 20070089901 - Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component A circuit board according to the present invention is so formed that an extension pattern not covered with an insulating film is provided at a NC land that does not allow an electric signal to pass therethrough, so as to have a configuration equivalent to that of a pattern not ... 04/19/07 - 20070084629 - Low stress conductive polymer bump Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion ... 04/19/07 - 20070084629 - Low stress conductive polymer bump Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion ... 04/19/07 - 20070084628 - Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer and a second protecting layer are formed ... 04/19/07 - 20070084628 - Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer and a second protecting layer are formed ... 04/12/07 - 20070079987 - Wiring board, semiconductor device, and method of manufacturing the same A semiconductor device comprising a flat wiring board, a first LSI disposed on one surface of the wiring board, a sealing resin for covering the one surface and a side face of the first semiconductor element, and a second LSI disposed on another surface of the wiring board. The wiring ... 04/12/07 - 20070079986 - Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same A multilayered wiring board has electrodes disposed on a first surface and a second surface, alternately layered insulation layers and wiring layers, and vias that are disposed in the insulation layer and electrically connect the wiring layers. The second electrode disposed on the second surface is embedded in the insulation ... 04/05/07 - 20070074900 - Printed circuit board and manufacturing method thereof A printed circuit board and manufacturing method thereof are disclosed. By use of a method of manufacturing a printed circuit board, which uses a metal substrate as a core member and has an electronic component embedded in the metal substrate, mainly comprising: (a) anodizing at least one surface of the ... 04/05/07 - 20070074899 - Production method of suspension board with circuit A production method of a suspension board with circuit that can form the ground terminal for connection with the ground, while reducing the number of man-hour and complicated processes, and reduce production cost. After an insulating base layer is formed on a metal supporting board in such a manner that ... 04/05/07 - 20070074898 - Pads for printed circuit board A pad is adapted for selectively receiving a first surface mounted component (SMC) and a second SMC on a printed circuit board. The first SMC and the second SMC include a number of footprints respectively. The pad includes a first portion for receiving the first SMC, a second portion for ... 04/05/07 - 20070074897 - Thermal event detection on printed wire boards The present invention provides a system and method for detecting thermal events on circuit boards, such as those used in information handling systems. In embodiments of the present invention, a plurality of thermal event detector traces are etched on a printed wire board (PWB) and are isolated from voltage planes ... 03/22/07 - 20070062726 - Embedded capacitor device having a common coupling area An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry ... 03/22/07 - 20070062725 - Embedded capacitor core having a multiple-layer structure An embedded capacitor core includes a first set of capacitors, a second set of capacitors, and an inter-layer dielectric film between the first set of capacitors and the second set of capacitors. The first set of capacitors includes: a first conductive pattern comprising at least two conductive electrodes; a second ... 03/15/07 - 20070056766 - Electronic component embedded board and its manufacturing method A second substrate 12 is provided above a first substrate 11, and an electronic component 13 is arranged between the first substrate 11 and the second substrate 12 so that between the first substrate 11 and the second substrate 12, the electronic component 13 is sealed and a photosensitive resin ... 03/08/07 - 20070051535 - Circuit board assembly and electronic device utilizing the same An electronic device includes an electronic component (40), a first printed circuit board (PCB) (100) and a second printed circuit board (200). The electronic component includes a first pin (A1) and a second pin (A2). The first PCB and a second PCB, respectively including first conductor trace lines (102) and ... 03/01/07 - 20070044998 - Electronic package and circuit board having segmented contact pads An electronic package is provided having a circuit board including a substrate electrical circuitry including circuit traces and first and second contacts for connecting to surface mount device(s). The first and second contacts each have multiple components including first and second pads. The first pad is separate from the second ... 02/22/07 - 20070039753 - Built-up printed circuit board with stack type via-holes A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly screen of a general screen printing machine. ... 02/15/07 - 20070034403 - Four-way lead flat package ic-mount printed circuit board, method of soldering four-way-lead flat package ic and air conditioner A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead flat package IC, has ... 02/15/07 - 20070034402 - Tape substrate, tape package and flat panel display using same A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape package may be bent and ... 02/08/07 - 20070029108 - Printed circuit board and soldering method and apparatus A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each through hole in which a component lead is inserted, whereby solder wicking up into the through hole is enhanced ... 01/25/07 - 20070017699 - Circuit board A pair of through holes are formed in a circuit board, and a silver paste filled up in the through holes connects lands formed on a front surface and a rear surface of the circuit board, respectively to each other. When the silver paste is solidified, the silver paste bulges ... 01/18/07 - 20070012477 - Electronic component package including joint material having higher heat conductivity An electronic component is mounted on the surface of a printed wiring board. A heat conductive member is received on the surface of the electronic component. A joint material is interposed between the electronic component and the heat conductive member. The joint material is made of material containing Ag in ... 01/04/07 - 20070000690 - Printed circuit board assembly and method for preventing emi of crystal oscillator thereof A printed circuit board Assembly (PCBA), including at least one crystal oscillator and a printed circuit board (PCB), is provided. The crystal oscillator includes a body and a shell. The shell covers the body. The PCB includes at least one inserting area and at least one plated hole. The inserting ... 12/28/06 - 20060289200 - Circuit board and manufacturing method thereof A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one protrusion-positioning region. At least a part of the protrusion is disposed on the protrusion-positioning region. The first circuit layer ... 12/21/06 - 20060283628 - Connecting device for connecting electrical foil conductors A connecting device that connects at least one foil conductor to at least one connection line comprises an insulative connector housing having a pressed screen arranged in an interior thereof. The pressed screen electrically connects the foil conductor to the connection line. A first clamping spring configured for resilient attachment ... 12/21/06 - 20060283627 - Substrate structure of integrated embedded passive components and method for fabricating the same The present invention is related to a substrate structure and a method for fabricating the substrate, and more particularly to a substrate structure of integrated embedded passive components and a method for fabricating the substrate. In the present invention, the openings are formed on the substrate by removing part of ... 11/30/06 - 20060266548 - Flexible flat cable, printed circuit board, and electronic apparatus According to one embodiment, a connecting portion of conductors has a first region containing copper as main component, and a second region provided on the first region and containing tin and copper as main components. At least part of a surface region of the second region is formed of a ... 11/16/06 - 20060254812 - Printed circuit boards having embedded thick film capacitors A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry. ... 11/09/06 - 20060249302 - Ball grid array assignment A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of adjacent transmitter differential pairs. High speed receiver contacts are disposed in a second portion of the pattern, where the ... 11/02/06 - 20060243480 - Methods and apparatus for interconnecting a ball grid array to a printed circuit board Methods and apparatus provide for connecting an integrated circuit having a ball grid array to a printed circuit board having a matrix of contact pads for electrical connection to the ball grid array. ... 10/26/06 - 20060237226 - Multilayer printed wiring board Provided is a multilayer printed wiring board in which power supply patterns are shortened to decrease an impedance and electromagnetic radiation noise. The multilayer printed wiring board includes: a power supply layer (1) having at least two power supply patterns (5) with different voltages formed thereon; and a conductor layer ... 10/26/06 - 20060237225 - Multilayer printed wiring board In a multi-layer printed wiring board 100 comprising single side circuit boards A, B and for accommodating an IC chip 70, BGAs 56 are disposed on its front and rear faces, so that with an IC module 120 mounted through the BGA 56 on the front face, this board can ... 10/12/06 - 20060225918 - Electronic device substrate and its fabrication method, and electronic device and its fabrication method An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to ... 10/05/06 - 20060219430 - Land structure, printed wiring board, and electronic device A land part where a connection part of an electronic part is soldered, includes a head end part. The head end part includes an inclination part. The inclination part may be formed by an end side. The end side may make a designated angle from an end line of the ... 09/21/06 - 20060207789 - Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical contactors on the first bare chip are pressed against the plurality of spiral contactors, various ... 09/21/06 - 20060207788 - Memory module and signal line arrangement method thereof In a memory module and a signal line arrangement method thereof, the memory module comprises: memory chips mounted on both sides of the module in a mirrored configuration; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sides in contact with same signal applying ... 09/14/06 - 20060201705 - Electrical device allowing for increased device densities A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and ... 09/14/06 - 20060201704 - Stacked microfeature devices and associated methods Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad ... 09/14/06 - 20060201703 - Flip chip mounting substrate The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced ... 09/14/06 - 20060201702 - Component for a printed circuit board and method for fitting a printed circuit board with this component A printed circuit board component includes a housing carrying a peg that engages a printed circuit board hole. This peg has a radially projecting detent lug extending beyond the plug outer periphery. The lug is located and formed on the peg so the peg outer periphery is smaller in the ... 08/31/06 - 20060191712 - Interconnect An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed substantially beneath the pad, and one via coupled to one of the five substantially straight edges ... 08/31/06 - 20060191711 - Embedded chip printed circuit board and method of manufacturing the same The present invention relates to an embedded chip printed circuit board in which a space required for embedding a chip is formed to a desired depth depending on various thicknesses of chips to be embedded, and thus, the circuit line for the electrical connection between the embedded chip and the ... 08/24/06 - 20060185894 - Conductive contamination reliability solution for assembling substrates A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of ... 08/24/06 - 20060185893 - Surface-mounting type electronic circuit unit without detachment of solder A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of plate-shaped metal material having a solder film on the outer surface thereof. Solder bumps are provided on second lands. Since ... 08/24/06 - 20060185892 - Semiconductor device with micro connecting elements and method for producing the same A semiconductor device with micro connecting elements and method for producing the same disclosed. In one embodiment, the semiconductor device includes a number of micro connecting elements for the high-frequency coupling of components of the semiconductor device. The micro connecting elements have an at least three-layered structural form with a ... 08/24/06 - 20060185891 - Printed board A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of the conductor pattern forming the pad is smaller ... 08/10/06 - 20060175083 - Wiring board and capacitor to be built into wiring board An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area ... 08/03/06 - 20060169488 - Circuit board mounted with surface mount type circuit component and method for producing the same A circuit board mounted with a surface mount type circuit component, including: a circuit board body mounted with the surface mount type circuit component, at least a part of a top surface of the surface mount type component being exposed to ambient air; and a reinforcing plate having an outer ... 07/13/06 - 20060151206 - Semiconductor device and manufacturing method therefor A semiconductor device of the present invention includes a semiconductor elements on a circuit board of the semiconductor device, interposing an adhesive material between the semiconductor element and the circuit board. Further, a connection use circuit board including an external terminal connecting portion is mounted on an upper surface of ... 07/13/06 - 20060151205 - Multilayer printed circuit board A multilayer PCB includes a plurality of signal layers, a ground layer and a power layer disposed between the plurality of signal layers, a signal via extending through the plurality of signal layers to allow a signal current to flow therethrough, at least one stitching capacitor provided in one of ... 07/13/06 - 20060151204 - Pad and electronic device employing the same The present invention discloses a pad and an electronic device employing the same, wherein the pad has an accommodating groove, a ditch disposed around the periphery of the accommodating groove, and at least one guiding groove disposed between the ditch and the accommodating groove, and one end of the guiding ... 07/13/06 - 20060151203 - Encapsulated electronic component and production method The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. ... 07/06/06 - 20060144617 - Printed circuit board including embedded capacitor and method of fabricating same Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible. ... 06/22/06 - 20060131069 - Method of manufacturing wiring substrate to which semiconductor chip is mounted The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the base, forming a capacitor having a plurality of layers on the peeling layer, and forming a wiring part ... 06/22/06 - 20060131068 - Surface mounted resistor with improved thermal resistance characteristics A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased ... 06/22/06 - 20060131067 - Pcb, manufacturing method thereof and semiconductor package implementing the same A method may involve providing a substrate body having an upper surface and a lower surface. Circuit layers may be provided on the upper and the lower surfaces of the substrate body. A prepreg layer may be provided on the upper surface of the substrate body. The prepreg layer may ... 06/15/06 - 20060124350 - Electronic module comprising an element exposed on one surfce and method for making same The aim of this invention consists in avoiding the appearance of undesirable residues on the exterior face of the module in the vicinity of the element (3). These residues that originate from the infiltration of a filling material (8) through the window (4) and/or the element (3) which is housed ... 06/08/06 - 20060118329 - Wiring base board, method of producing thereof, and electronic device A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as differential transmission at via parts. For this wiring base board, an insulating substrate is used. The wiring ... 06/01/06 - 20060113108 - Printed wiring board and a method of manufacturing the same This patent specification describes a printed wiring board which includes an insulating board, a wiring pattern, and a resistor pattern. The wiring pattern includes a metallic material and is formed on the insulating board in a process step. The resistor pattern includes the metallic material and is formed on the ... 05/25/06 - 20060108146 - Structure of electronic package and method for fabricating the same A structure of an electronic package and a method for fabricating the structure are provided in the present invention. The provided method includes steps of providing a first substrate, forming an electronic component thereon, providing a second substrate to cover the first substrate and the electronic component so that a ... 05/18/06 - 20060102386 - Multi-layered flexible print circuit board and manufacturing method thereof A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at ... 05/11/06 - 20060096780 - Thin film circuit integrating thick film resistors thereon A method of fabricating printed circuit boards integrating thick film resistor components and thin film circuit portions thereon is disclosed. This is a two-phase process, where the first phase is to create multiple thick film resistors, and the second phase is to create a thin film circuit portion on the ... 05/11/06 - 20060096779 - Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring board The impedance of a newly manufactured data transmission wire pattern can be measured easily and accurately. A multilayer type printed-wiring board 1 comprises a pair of data transmission wire patterns 4, 5 arranged between a CPU module 2 and a memory module 3 on respective inner layer substrates 6, 7, ... 05/04/06 - 20060090931 - Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument A semiconductor device includes a semiconductor chip and a substrate having an interconnecting pattern formed thereover. The substrate has the semiconductor chip mounted on one surface thereof. The substrate has an outline larger than the semiconductor chip. First terminals are formed in a region outside the region of the substrate ... 04/20/06 - 20060081397 - Multilayer circuit board A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of ... 03/30/06 - 20060065438 - Circuit component mounting device A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the circuit component and the solder. The device further includes a base metal pattern which covers parts of the principal ... 03/30/06 - 20060065437 - Mounting structure mounting substrate, electro-optical device, and electronic apparatus A mounting structure includes a first substrate that has a first surface and a second surface, a plurality of first connection terminals that are disposed on the first surface in a first direction, a plurality of second connection terminals that are disposed on the first surface in a second direction ... 03/30/06 - 20060065436 - System and method for protecting microelectromechanical systems array using back-plate with non-flat portion Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. ... 03/16/06 - 20060054352 - Printed circuit board including embedded passive component and method of fabricating same Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the ... 02/23/06 - 20060037778 - Circuit board with smd-components and at least one wired component, and a method for populating, securing and electrical contacting of the components A circuit board and method for populating, securing and electrical contacting of components thereon is provided, as an alternative to the known pressfit technology. After the soldering of SMD-components on a first side of a circuit board, conductive adhesive and solder paste are applied on a second side of the ... 02/23/06 - 20060037777 - Mounting structure of electronic components and mounting method thereof A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic components which are inserted and positioned in the positioning holes protrudes from one surface of the film substrate, and the other surfaces ... 02/23/06 - 20060037776 - Securable electronic module Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, ... 02/16/06 - 20060032668 - Printed circuit boards and method of producing the same A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the ... 02/16/06 - 20060032667 - Lead terminal and power supply device The present invention is directed to a power supply apparatus in which a battery and a circuit wiring board or boards are electrically connected by using lead terminals. The lead terminal (3) is adapted so that thickness of a welding portion (3a) is caused to be thinner than the thickness ... 02/02/06 - 20060021793 - Wiring board and magnetic disk apparatus A through hole 2 is formed in an end portion of a wiring board main body 1. A land 3 formed around the through hole 2 is in a shape having partially lacking portions symmetrically formed on an end portion side of the wiring board main body 1 and on ... 02/02/06 - 20060021792 - Surface mount axial leaded component for an electronic module A surface mountable axial leaded component including a component body, a first component lead and a second component lead. The first component lead extends from a first end of the component body and a second component lead extends from a second end of the component body that is opposite the ... 01/26/06 - 20060016619 - Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same There are provided a printed circuit board having a structure for relieving a stress concentration on an outer most lead of leads, due to a difference in thermal expansion coefficients between the semiconductor device and the printed circuit board when the semiconductor device is mounted on the printed circuit board. ... 01/19/06 - 20060011384 - Reducing or eliminating cross-talk at device-substrate interface Inter-layer shielding is employed to shield printed circuit board transmission lines from EMI and cross-talk at traversals between adjacent inner layers, between inner layers separated by one or more inner layers, between an outer layer and an adjacent inner layer, between an outer layer and an inner layer separated by ... 01/12/06 - 20060005996 - Method of attaching electronic components to printed circuit board and attachment structure thereof In a method of attaching an electronic component to a printed circuit board by a plurality of screws that are inserted into corresponding through holes cut in the board from a surface of the board and then screwed into corresponding screw holes formed in the component mounted on an opposite ... 01/05/06 - 20060000638 - Micro-castellated interposer A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount packages. The miniature PWB is mounted on the circuit board using techniques well known in the art. This combination of technologies provides ... 12/08/05 - 20050269129 - Printed circuit board with shielded path and method of manufacturing printed circuit board with shielded path A printed circuit board with at least one shielded path placed on an outer layer of the board is provided with a shield composed of SMD elements (215) and shielding paths and/or planes, placed at both sides along the shielded path. The shielding paths or planes (213, 214) are connected ... 12/01/05 - 20050263323 - Surface mountable clip suitable for use in a mobile communication device A mobile communication device includes a printed circuit board (PCB); a radio frequency (RF) transceiver carried on the PCB; and an antenna coupled to the RF transceiver. A surface mountable antenna clip is mounted on the PCB for retaining the antenna. The clip is a metal structure having a plurality ... 12/01/05 - 20050263322 - Enhanced blind hole termination of pin to pcb Tails (20) projecting from an electrical component (12) that lies on a circuit board surface, are terminated to traces on a multi-layer circuit board (14) in a manner that minimizes the disadvantages of long through hole soldering and of surface mount techniques. A blind hole is drilled and plated to ... 11/24/05 - 20050257957 - Printed wiring board with conductive constraining core including resin filled channels Printed wiring boards and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores having at least one resin filled channel. The resin filled channels perform a variety of functions that can be associated with electrical isolation ... 11/24/05 - 20050257956 - Structurally integrated circuit and associated method A composite structural member with an integrated electrical circuit and an associated method of manufacture are provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural ... 11/24/05 - 20050257955 - Packaging of a microchip device A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer (7) is placed on microchip devices (1). The interposer (7) comprises an aperture (11) which extends from the interposer surface where external electrical contacts (9) are located to the surface of the ... 11/17/05 - 20050252682 - Wiring board and semiconductor package using the same (6) (H-65/H150)≦2.3 ... 11/17/05 - 20050252681 - Microelectronic assembly having variable thickness solder joint A microelectronic assembly includes a component attached to a substrate by a variable thickness solder joint. The solder joint comprises a first thickness adjacent the central region of the component and a second, relatively greater thickness adjacent the perimeter region of the component. The variable thickness solder joint may be ... 11/03/05 - 20050241851 - Pin grid array package carrier and process of mounting passive component thereon A pin grid array (PGA) package carrier is provided. The PGA package carrier is capable of mounting at least a passive component having a plurality of electrodes thereon. The PGA package carrier comprises a substrate, a plurality of passive component electrode pads, a plurality of pins, and a plurality of ... 10/13/05 - 20050224256 - Interlayer member used for producing multilayer wiring board and method of producing the same To increase the dimensional accuracy of an interlayer member used for producing a multilayer wiring board which is inserted between two wiring layers to establish interlayer insulation and interlayer electrical connection between the wiring layers, to thereby increase a layout density. A mask film is formed on a main surface ... 10/06/05 - 20050217894 - Fabrication method and structure of pcb assembly, and tool for assembly thereof A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing ... 09/29/05 - 20050211465 - Electronic parts packaging structure and method of manufacturing the same An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess ... 09/01/05 - 20050189140 - Chip package structure A chip package structure including a substrate, a first chip, a second chip, a third chip and an encapsulant is provided. The substrate has a cavity, a plurality of first contacts and second contacts disposed on a surface thereof, wherein the first contacts are located within the cavity and the ... 09/01/05 - 20050189139 - Flexible circuit having an integrally formed battery A method and apparatus of forming a battery enabled flexible circuit. The invention includes forming a first insulating layer and positioning a battery on the first insulating layer, the battery having at least a first and a second terminal. A second insulating layer is then formed on the first insulating ... 09/01/05 - 20050189138 - Electronic assembly and method of manufacture thereof A method of manufacture of an electronic assembly that has a circuit board and an electrical component includes laying a first terminal of the electrical component upon a conductive region of the circuit board, providing solder paste contacting the first terminal of the component and the circuit board, and heating ... 08/11/05 - 20050173152 - Circuit board surface mount package An electronic package is provided having a surface mount electronic device connected to a circuit board. The package includes a circuit board and a surface mount electronic device. A mounting pad is formed on the circuit board. A plurality of vias are formed each having an opening extending into the ... 08/04/05 - 20050167155 - Apparatus and method for fixing component of circuit substrate It is intended to provide a component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provided with a circuit substrate having a ... 07/28/05 - 20050161252 - Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method A method for populating and soldering a circuit board, which is populated with a wired, electrical component having at least one connection wire or pin and a housing or casing thermally critical for conventional, automatic soldering methods. Additionally, a reflow oven for the soldering of the circuit board and a ... 06/30/05 - 20050139389 - Method of mounting electronic component on substrate without generation of voids in bonding material When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the ... 06/30/05 - 20050139388 - Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same A semiconductor device is provided including a printed circuit board and first, second and third rows of power and/or signal pads on the printed circuit board. A plurality of input and output buffers are also provided. Ones of the plurality of input and output buffers are provided between the first ... 06/30/05 - 20050139387 - Wiring circuit board At least a particular part of a strip conductor 2 of a wiring circuit board for mounting, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component, is covered with a solder resist 3. The ... 06/30/05 - 20050139386 - Multi-layer printed circuit board and method for manufacturing the same A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is ... 06/30/05 - 20050139385 - Input transient protection for electronic devices A circuit board assembly which includes an electrically insulating layer, a conductive printed wiring layer formed on the surface of the electrically insulating layer and includes a plurality of conductive paths, a conductive trace on the electrically insulating layer and apparatus for dissipating a transient in addition to a surface ... 06/23/05 - 20050133253 - Harness excess-length absorbing apparatus A harness excess-length absorbing apparatus 1 includes a protector 4 for receiving a wire harness 14 in a folded-back condition, a harness guide member 7 which is provided in a folded-back portion 14a of the wire harness, and can be moved in a longitudinal direction of the wire harness, and ... 06/23/05 - 20050133252 - Printed circuit board noise suppression device and method of manufacturing A noise suppression device for a printed circuit board suppresses both radiated noise and conducted noise. An electrically conductive sub-enclosure at least partially encloses a portion of the PCB, and a divider extends electrically into a surface of the PCB along an edge of the enclosed portion. Electrical signal filters ... 06/16/05 - 20050126820 - Method for fabricating wiring board provided with passive element, and wiring board provided with passive element A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a ... 06/16/05 - 20050126819 - Methods to prevent mechanical flexure related bga failure Methods and associated apparatus of reducing stress in a package are described in which a package is provided comprising an array of interconnects that are connected to a substrate, and then reducing the stress of the interconnects located near a weak area in the package, during flexure of the substrate, ... 06/09/05 - 20050121228 - Wiring layout auxiliary wiring package and printed circuit wiring board A printed circuit board wiring system including a printed wiring circuit board having a plurality of conductive layers, at least one electronic part mounted on one side of the circuit board and configured to output signals via signal lines, and an auxiliary wiring package mounted on the other side of ... 06/09/05 - 20050121227 - Method for electrical interconnection of angularly disposed conductive patterns and a cornerbond assembly made from the method A method for electrical interconnection of angularly disposed and abutted conductive patterns is disclosed along with a device created from the method. Conventional wire bonding equipment is used to apply a conductive metal ball at the junction of angularly disposed conductive patterns by orienting a cornerbond assembly whereby one or ... ### FreshPatents.com Support |