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Insulating

Insulating patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Electricity: Conductors And Insulators


Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Particular Material > Insulating



Formation of dielectric with smooth surface
12/04/14 - 20140353019 - Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface,...

Touch panel
12/04/14 - 20140353020 - A touch panel defines a touch region and a routing region. The touch panel includes a substrate, a transparent conductive layer, at least one electrode and at least one lead wire. The substrate has a surface and includes a planar part and a folded part extending from the planar part....

Wiring board and method of manufacturing the same
12/04/14 - 20140353021 - A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1...

Reducing dielectric loss in solder masks
11/27/14 - 20140345923 - A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons....

Vertical conductive unit and manufacturing method thereof
11/20/14 - 20140338963 - The invention provides a vertical conductive unit. The vertical conductive unit comprises an insulating layer comprising a connecting via, a first conductor, a second conductor, and a third conductor. The insulating layer comprises photosensitive polyimide, and the glass transition temperature of the photosensitive polyimide is lower than about 200° C....

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board
11/13/14 - 20140332260 - A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive...

Device for surface mounting and capacitor element
11/06/14 - 20140326492 - There is provided a device (1) for surface mounting that has a substrate (10) and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the substrate (10) and the capacitor element using a packaging resin. The substrate (10) includes a first terminal electrode...

Epoxy resin compound and radiant heat circuit board using the same
10/30/14 - 20140318839 - Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy...

Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board
10/23/14 - 20140311780 - An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side...

Metal-clad laminate and printed wiring board
10/23/14 - 20140311781 - A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The...

Multilayer ceramic capacitor, manufacturing method thereof, and circuit board for mounting electronic component
10/02/14 - 20140290993 - There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers laminated therein; an active part including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, and forming capacitance;...

Surface-modified inorganic filler, method of preparing the same, buildup film composition for multilayer printed wiring board, and the multilayer printed wiring board including the same
10/02/14 - 20140290994 - Disclosed herein is a method of preparing a surface-modified inorganic filler, comprising the steps of: drying an inorganic filler; treating the inorganic filler with fluorine-containing gas to bond fluorine (F) to a part of the surface of the inorganic filler; and bonding a functional group-bonded silane coupling agent to another...

Transparent conductive film and preparation method thereof
10/02/14 - 20140290995 - A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is patterned to define a meshed trench, the meshed trench is filled with a conductive material to form a sending area, a periphery of the sensing area...

Epoxy resin compound and radiant heat circuit board using the same
10/02/14 - 20140290996 - Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the...

Multilayer wiring substrate and manufacturing method thereof
10/02/14 - 20140290997 - The multilayer wiring board has a multilayered build-up construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately laminated. The resin insulating layers are formed of the lower insulating layer and the upper insulating layer disposed on the lower insulating layer. The conductor layer...

Electronic component and electronic component package
09/25/14 - 20140284089 - An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces...

Thin film substrate and method for manufacturing the same
09/25/14 - 20140284090 - The invention provides a method for manufacturing a thin film substrate. The method comprises steps of: providing a substrate having at least one through hole; forming a first metallic layer on a surface of the substrate and the through holes; forming a resist layer and a first opening on the...

Film constructions for interdigitated electrodes with bus bars and methods of making same
08/28/14 - 20140238731 - An interdigitated electrode film co-extruded with bus bars for thin film electronics or other devices. First electrode layers are located between first and second major surfaces of the film with a first bus bar electrically connecting and integrated with the first electrode layers. Second electrode layers are located between the...

Solder mask ink comprising amide gellant
08/14/14 - 20140224531 - Inkjet printer-compatible solder mask inks include amide gellants to provide improved print resolution. A solder mask ink includes an amide gellant and a plurality of acrylate monomers, oligomers, or combinations thereof....

Thin-film wiring substrate and substrate for probe card
08/14/14 - 20140224532 - A thin-film wiring substrate includes a base B including a ceramic substrate having an upper surface and a wiring conductor provided on the upper surface of the ceramic substrate; a bonding layer and a thin-film wiring layer laminated in order on the upper surface of the ceramic substrate; and a...

Wiring board with built-in electronic component
08/07/14 - 20140216800 - A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the...

Multi-layered capacitor and circuit board mounted with multi-layered capacitor
07/17/14 - 20140196937 - Disclosed herein is a multi-layered capacitor, including: an element formed by alternately multi-layering a dielectric layer and an internal electrode; and external terminals disposed at both ends of the element, wherein the dielectric layer disposed at an upper end U and a lower end L of the element is formed...

Quickly-mounted capacitor
07/10/14 - 20140190731 - A quickly-mounted capacitor consists of a capacitor (1) and a plug piece (10). The quickly-mounted capacitor is characterized in that a fixation mounting rod (22) or a screw (21) is extended from a lower end of a housing of the capacitor (1); the plug piece (10) comprises an insulating sheet...

Interposer and packaging substrate having the interposer
07/03/14 - 20140182906 - An interposer is provided, including a composite body and a plurality of conductive through vias penetrating the composite body. The composite body includes at least a main layer and at least a combining layer stacked on one another. The combining layer prevents the main layer from being cracked. The combining...

Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component
07/03/14 - 20140182907 - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another...

Epoxy resin composition for insulating film, insulating film, and printed circuit board having the same
07/03/14 - 20140182908 - This invention relates to an epoxy resin composition for an insulating film, an insulating film, and a printed circuit board including the same. Particularly in a printed circuit board using a build-up process, a skin layer and a roughness are formed on the surface of the insulating film using different...

Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same
06/26/14 - 20140174802 - A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized...

Wiring substrate and multi-piece wiring substrate
06/26/14 - 20140174803 - A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of...

Methods for forming metallized dielectric structures
06/19/14 - 20140166350 - An electronic device may be provided with metal coated dielectric structures that serve as electromagnetic interference shielding, antenna structures, or other metal structures. The metal coated dielectric structures may be formed form a sheet of polymer. Metal may be deposited on the sheet of polymer using a deposition tool and...

Multilayer ceramic capacitor and circuit board for mounting the same
06/19/14 - 20140166351 - A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and...

Hollow sealing structure
06/19/14 - 20140166352 - A hollow sealing structure includes a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap. The substrate includes a positioning part positioning the cap. The cap includes a fixation part being arranged...

Wiring board and laser drilling method thereof
06/05/14 - 20140151099 - A laser drilling method of a wiring board is provided. In the method, a laser beam shines on a wiring substrate including an insulating layer to remove a portion of the insulating layer. The wiring substrate is placed in a focus section of the laser beam. The focus section contains...

Electronic component embedded printed circuit board
06/05/14 - 20140151100 - An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material,...

Printed circuit board with circuit visible and method for manufacturing same
05/29/14 - 20140144685 - A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the...

Wiring board with built-in electronic component and method for manufacturing wiring board with built-in electronic component
05/29/14 - 20140144686 - A wiring board for a built-in electronic component includes a substrate having a cavity portion, an electronic component accommodated in the cavity portion of the substrate, a filling resin material filling a space formed between the electronic component and an inner wall of the substrate forming the cavity portion, an...

Printed circuit board and method of manufacturing the same
05/15/14 - 20140131081 - Disclosed herein is a printed circuit board, including: a base substrate on which a connection pad is formed; a dam spaced apart from one side of the connection pad; and a protective layer formed to surround the dam....

Multilayer ceramic capacitor and printed circuit board including the same
05/01/14 - 20140116761 - The present invention relates to a multilayer ceramic capacitor and a printed circuit board including the same that can minimize thickness deviations of an external electrode and a multilayer ceramic. A multilayer ceramic capacitor according to an embodiment of the present invention includes a multilayer ceramic and external electrodes formed...

Wiring board and mounting structure using the same
05/01/14 - 20140116762 - A wiring board includes a rectangular mount region surrounded by four sides circumscribed to pads located in an outer peripheral area among a plurality of pads arranged in a substantially matrix form, a corner pad close to a corner of the mount region, and a second via-conductor and a second...

Wiring board with built-in electronic component and method for manufacturing the same
05/01/14 - 20140116763 - A wiring board with a built-in electronic component includes a core substrate having a cavity, an electronic component accommodated in the cavity of the core substrate and having a body portion and multiple conductive portions formed on a surface of the body portion, a filling resin filling the space formed...

Metal-clad laminate and printed wiring board
05/01/14 - 20140116764 - A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer...

Alkali silicate glass based coating and method for applying
04/17/14 - 20140102776 - A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation...

Method of growing electrically conductive tissue
04/10/14 - 20140097008 - An electrical circuit is comprised of a sheet of mycelium having a wiring pattern for an electrical circuit thereon. The sheet of mycelium is prepared from a solution of Potato Dextrose Broth and Potato Dextrose Agar that is inoculated with a macerated tissue culture including a filamentous fungi selected from...

Wiring substrate
04/10/14 - 20140097009 - A wiring substrate includes a first wiring layer, a first insulating layer, a second wiring layer, and a first wiring pattern. The second wiring layer includes a first metal foil that is thinner than the first wiring layer. A first via in the first insulating layer connects the first and...

Blind via printed circuit board fabrication supporting press fit connectors
03/27/14 - 20140083754 - An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple...

Novel photosensitive resin composition and use thereof
03/13/14 - 20140069702 - The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100...

Layered body, production method and use thereof
03/06/14 - 20140060909 - The invention relates to a layered body, in particular one with two sheets of electric functional layers, as well as a use of this layered body for example in a touch screen with improved resolution. By changing the grid structure at the intersection areas a moiré effect can be avoided...

Electrical component resin, semiconductor device, and substrate
02/27/14 - 20140054077 - A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect...

Wiring board with hybrid core and dual build-up circuitries
02/20/14 - 20140048319 - A wiring board with built-in metal slugs includes a dielectric hybrid core and build-up circuitries. The metal slugs extend into apertures of a stiffener of the hybrid core and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slugs and the stiffener and provides signal routing....

Flat dam and method for manufacturing chip package using the same
02/13/14 - 20140041911 - Disclosed herein is a flat dam formed in a package region of an insulation layer provided on a board to limit movement of an underfill and made of the hydrophobic material including any one of or at least two of perfluorooctyl acrylate (PFAC), polypropylene, polytetrafluoroethylene (PTFE), and fluorine compound....

Method for manufacturing multilayer ceramic substrate and composite sheet
02/13/14 - 20140041912 - A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the...

Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof
02/06/14 - 20140034371 - [Means for Solution] The pattern forming method according to the present invention is characterized by comprising the steps of: (A) forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; (B) activating the photobase generator contained in the alkali-developable thermosetting resin composition...

Ceramic wiring board, multi-piece ceramic wiring board, and method for producing same
02/06/14 - 20140034372 - Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a...

Printed wiring board
01/30/14 - 20140027165 - A printed wiring board includes a first buildup layer including first and second interlayer insulating layers, and a second buildup layer formed on the first buildup layer and including the outermost interlayer insulating layer and the outermost conductive layer formed on the outermost interlayer resin insulating layer. The buildup layer...

Printed wiring board and method for manufacturing printed wiring board
01/23/14 - 20140020940 - A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to...

Printed circuit board and electronic device comprising the same
01/23/14 - 20140020941 - Provided is a printed circuit board consisting of laminated substrates each with a fiberglass cloth contained in its resin and with a wiring arranged onto at least one of its surfaces, wherein, in at least one of substrates provided with a wiring for transmitting a higher speed signal than that...

Epoxy resin composition for build-up insulating film, insulating film formed therefrom, and multilayer printed circuit board having the same
01/16/14 - 20140014402 - This invention relates to an epoxy resin composition, an insulating film formed therefrom, and a printed circuit board, and more particularly to an epoxy resin composition including an epoxy resin, an acid anhydride curing agent, etc., which exhibits improved dielectric properties by decreasing permittivity, dielectric tangent, etc. in a build-up...

Conductive laminate and touch panel
01/09/14 - 20140008115 - A conductive laminate includes a substrate, a crosslinked layer, and a conductive layer and a protective layer, wherein (i) the crosslinked layer is composed of a crosslinked polymer including a structure in which compounds, each having two or more carbon-carbon double bond groups contributing to a polymerization reaction, are subjected...

Resin composition, and printed wiring board, laminated sheet, and prepreg using same
01/02/14 - 20140000948 - There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are...

Wiring board and method of manufacturing the same
12/19/13 - 20130333930 - A wiring board includes a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer,...

Novel insulating film and printed wiring board provided with insulating film
12/19/13 - 20130333931 - The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a...

Spring finger interconnect
12/05/13 - 20130319739 - A spring finger interconnection system can include a plug and a receptacle. In one embodiment, the plug can include spring finger contacts configured to carry electrical signals. The receptacle can include a cavity to receive the plug and the cavity can be constructed with printed circuit board fabrication techniques. In...

Electronic component built-in substrate and method of manufacturing the same
12/05/13 - 20130319740 - An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member,...

Printed circuit board
11/21/13 - 20130306362 - A printed circuit board includes a line intensive distribution area, a line sparse distribution area, a solder mask layer, and a signal layer. A first signal line is laid on the signal layer. The first signal line crosses the line intensive distribution area and the line sparse distribution area. The...

Space transformer for probe card and method of manufacturing the same
11/14/13 - 20130299221 - There is provided a space transformer for a probe card, including: a substrate having a first surface and a second; a plurality of first pads formed on the first surface to be spaced apart from each other and connected to a printed circuit board of a probe card; a plurality...

Electrode member and touch window including the same
11/14/13 - 20130299222 - Disclosed is an electrode member. The electrode member includes a substrate, and an electrode provided in the shape of a mesh on the substrate....

Photo-patternable dielectric materials and formulations and methods of use
11/07/13 - 20130292163 - Silsesquioxane polymers, silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers, and structures made from silsesquioxane polymers....

Insulating structure and production method of same
10/17/13 - 20130269992 - An insulating structure is formed that favorably maintains gap-fill capability of a narrow width pattern in a memory cell while also preventing the formation of cracks in an insulator in a peripheral circuit, and has the memory cell and peripheral circuit within the same layer. The present invention provides an...

Cellulosic printed circuit board materials having boronate moieties
10/03/13 - 20130256015 - A printed circuit board is provided here, the printed circuit board including a cellulosic polymer, where the cellulosic polymer contains a boronate moiety....

Printed circuit board and manufacturing method thereof
10/03/13 - 20130256016 - An embodiment of a printed circuit board includes: a mounting board with a solder resist on a front surface thereof; a component mounted on the mounting board; an underfill material that fixes the component to the mounting board; and resin materials dotted between the solder resist and the underfill material....

Laminated structure, dry film and method of producing laminated structure
10/03/13 - 20130256017 - [Means for Solution] Provided is a laminated structure comprising a base material and a plurality of resin insulating layers formed thereon, which is characterized in that a layer of the plurality of resin insulating layers, which is in contact with the base material, is a resin insulating layer (A) which...

Circuit substrate, laminated board and laminated sheet
10/03/13 - 20130256018 - A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion....