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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Particular Material

With Particular Material

With Particular Material patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

02/27/14 - 20140054073 - Method for forming solder resist and substrate for package
The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and...

06/06/13 - 20130140064 - Method of making electronic devices using selective deposition
Electronic devices can be prepared by forming a patterned thin film on a suitable receiver substrate. A cyanoacrylate polymer is used as a deposition inhibitor material and applied first as a deposition inhibitor material. The deposition inhibitor material can be patterned to provide selected areas on the receiver substrate where...

06/06/13 - 20130140065 - Conductive structure body and method for manufacturing the same
An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without...

05/23/13 - 20130126219 - Multi-ply circuit board with fiber bundles
Provided is a circuit board that includes a first layer on which circuit patterns are disposed, a second layer opposite to the first layer and on which external terminals are disposed, and a core portion disposed between the first and second layers and including a first ply and a second...

11/01/12 - 20120273262 - Transparent conductive structure applied to a touch panel and method of making the same
A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent...

08/02/12 - 20120193131 - Metal base circuit board and production method thereof
The metal base circuit board according to the present invention includes a metal substrate, an insulating layer provided on the metal substrate, and a conductive foil for circuit formation that is provided on the insulating layer. The metal substrate has a thermal conductivity of 60 W/mK or more and a...

04/05/12 - 20120080217 - Electrostatic capacitive type touch screen panel
A touch screen panel according to an embodiment includes a substrate; an electrode forming part including a plurality of first electrode serials arranged in parallel in a first direction and a plurality of second electrode serials arranged in parallel in a second direction to cross the first direction, and each...

02/09/12 - 20120031655 - Multi-layer circuit assembly and process for preparing the same
A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto...

12/29/11 - 20110315434 - Fine aluminum hydroxide powder for filling in resin and method for producing the same
The object of the present invention is to provide an aluminum hydroxide powder for filling in resin, which is excellent fillability in resin. Provided is an aluminum hydroxide powder forfilling in resin, being characterized in that it comprises a gibbsite crystal structure....

12/22/11 - 20110308843 - Transparent thin plate
Provided is a transparent thin plate including a transparent substrate in a sheet form, a mesh layer formed on a surface of the transparent substrate and made of an opaque material having a structure wherein an outline of meshes is made of bands that are very thin and have a...

11/10/11 - 20110272185 - Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1...

11/03/11 - 20110266037 - Electronic part, electronic member connection method, and circuit connection member
An electronic part includes a first electronic member having a wiring side. An anisotropic conductive sheet has a first side and a second side opposite to the first side and is disposed on the first electronic member so that the wiring side contacts the first side. A second electronic member...

06/23/11 - 20110147056 - Circuit board and process for fabricating the same
A circuit board including a circuit substrate, a first dielectric layer, an antagonistic activation layer, a first conductive layer, a second conductive layer and a second dielectric layer is provided. The circuit substrate has a first surface and a first circuit layer. The first dielectric layer is disposed on the...

06/16/11 - 20110139496 - Resin composition
A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin...

05/26/11 - 20110120757 - Method for selective deposition and devices
A chemical vapor deposition method such as an atomic-layer-deposition method for forming a patterned thin film includes applying a deposition inhibitor material to a substrate. The deposition inhibitor material is a hydrophilic polymer that is has in its backbone, side chains, or both backbone and side chains, multiple secondary or...

05/19/11 - 20110114372 - Printed wiring board
A printed wiring board has an insulation layer having upper and lower surfaces, an upper-surface circuit formed on the upper surface of the insulation layer, a resin insulation layer formed on the upper surface of the insulation layer and the upper-surface circuit and having a via-conductor opening through the resin...

05/05/11 - 20110100684 - Method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste
A method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste, to a substrate by a dispensing operation, wherein the paste is applied in at least one strand....

05/05/11 - 20110100685 - Substrate anchor structure and method
An electrical structure and method of forming. The electrical structure includes a first substrate, a first dielectric layer, an underfill layer, a first solder structure, and a second substrate. The first dielectric layer is formed over a top surface of the first substrate. The first dielectric layer includes a first...

04/21/11 - 20110088930 - Printed circuit board and manufacturing method thereof
A printed circuit board and a manufacturing method of the same are disclosed. The method includes: preparing a carrier including a primer resin layer formed thereon; forming a circuit pattern on the primer resin layer; stacking the carrier onto an insulating layer such that the circuit pattern is buried in...

04/14/11 - 20110083883 - Wiring board and mount structure
A circuit board provided with a first resin layer and with a first conductive layer formed on the first resin layer. The first conductive layer has a metal carbide layer containing a carbide of a transition metal selected from Group IV, Group V, or Group VI in the Periodic Table...

04/14/11 - 20110083884 - Novel polyimide precursor composition and use thereof
An object of the present invention is to provide (a) a polyimide precursor solution which is curable at low temperatures (not more than 200° C.) and which has excellent long-term storage stability, (b) a photosensitive resin composition, a photosensitive resin film, a thermosetting resin composition, and a polyimide insulating film,...

03/24/11 - 20110067907 - Low temperature curable photosensitive resin composition and dry film manufactured by using the same
The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be...

02/17/11 - 20110036620 - Printed circuit board and method for fabricating the same
The invention provides a printed circuit board and method for fabricating the same. The printed circuit board includes a substrate having an internal circuit structure. An additional circuit structure is disposed on the substrate, electrically connected to the internal circuit structure. A solder mask insulating layer having an opening is...

02/10/11 - 20110031000 - Resin composition, carrier material with resin, multi-layered printed circuit board, and semiconductor device
There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups...

01/27/11 - 20110017498 - Photosensitive dielectric film
A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured...

09/09/10 - 20100224394 - Module substrate and production method
A module substrate includes a multilayer substrate that includes a plurality of layers, a bottommost of the layers being a ceramic layer. Solderable contacts, which include fired pads composed of a conductive paste, are applied to the bottommost ceramic layer. A covering layer overlies the pads. The covering layer covers...

08/19/10 - 20100206621 - Wiring board with built-in component and method for manufacturing wiring board with built-in component
A wiring board with a built-in component includes an insulating board, a first wiring pattern on an upper surface of the insulating board, plural electrodes on the upper surface of the insulating board, a solder resist on the upper surface of the insulating board, plural solders on the electrodes, respectively,...

07/15/10 - 20100175914 - Passive electrical devices and methods of fabricating passive electrical devices
A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening...

07/08/10 - 20100170706 - Electronic module and method for manufacturing an electronic module
An electronic module includes a first substrate having at least one electronic component, and a housing embedded in the substrate and designed as an injection molded housing or a transfer molded housing, and which includes electrical leads protruding from the housing, connected to the first substrate and designed as a...

06/10/10 - 20100139953 - Display device and manufacturing method thereof
According to the method, a plurality of pattern lines and a plurality of contact electrodes on a substrate are formed. Each pattern line and each contact electrode are connected each other. Anisotropic conductive films, in which a plurality of conductive balls are included, on the substrate are arranged. A plurality...

04/29/10 - 20100101839 - Display apparatus
A display apparatus includes a first substrate including a plurality of pixels, a first electrode arranged on the first substrate, a second substrate facing the first substrate, and a second electrode arranged on the second substrate and spaced apart from the first electrode, the second electrode to form an electric...

04/08/10 - 20100084170 - Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to...

03/25/10 - 20100071937 - Circuit board and process of fabricating the same
A circuit board includes a dielectric layer, a circuit layer, and an insulation layer. The circuit layer is disposed on the dielectric layer and has a pad region and a trace region. The insulation layer is disposed on the circuit layer and covers the trace region. Here, a thickness of...

03/25/10 - 20100071938 - Methods of treating a surface to promote metal plating and devices formed
Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the...

03/18/10 - 20100065309 - Electrical and optical hybrid board and manufacturing method of the same
To provide an electrical and optical hybrid board that has on one surface an optical waveguide and on the other surface an electrical interconnect pattern or the like, in which the core pattern and electrical interconnect pattern or the like are positioned in place with high accuracy, and a method...

03/18/10 - 20100065310 - Method for manufacturing metallized ceramic substrate chip
A method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of...

03/04/10 - 20100051331 - Circuit substrate for mounting electronic component and circuit substrate assembly having same
A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in...

03/04/10 - 20100051332 - Circuit substrate for mounting electronic component and circuit substrate assembly having same
A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer...

02/25/10 - 20100044083 - Build-up printed circuit board structure for increasing fine circuit density and method of manufacturing the same
A method of manufacturing a build-up printed circuit board structure for increasing fine circuit density includes providing a core carrier board; forming a plurality of first conductive pads on a top surface of the core carrier board; forming a first dielectric layer on the core carrier board in order to...

02/18/10 - 20100038119 - Metal deposition
Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include...

02/11/10 - 20100032192 - Interlayer dielectric film with carrier material and multilayer printed circuit board therewith
According to the present invention, there is provided an interlayer dielectric film with a carrier material comprising a carrier material comprised of a metal foil or resin film and an interlayer dielectric film formed on one side of the carrier material, wherein the interlayer dielectric film is comprised of a...

02/04/10 - 20100025088 - Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
The conductive pattern forming film provides a pattern formed on a film substrate having flexibility by pressurizing, under heating, a conductive paste in which powder or fine particles of metal or semiconductor are dispersed and filled. The conductive pattern forming apparatus comprises a sample installation table having a flat placement...

01/28/10 - 20100018758 - Printed wiring board
A printed wiring board which includes a core substrate and a plurality of buildup layer. The core substrate contains carbon fiber. The plurality of buildup layers is stacked on the core substrate. The buildup layer includes an insulating layer and a conductive wiring layer. The insulating layer contains a resin...

01/07/10 - 20100000770 - Conducting nanotubes or nanostructures based composites, method of making them and applications
An electromagnetic interference (EMI) shielding material includes a matrix of a dielectric or partially conducting polymer, such as foamed polystyrene, with carbon nanotubes or other nanostructures dispersed therein in sufficient concentration to make the material electrically conducting. The composite is formed by dispersing the nanotube material in a solvent in...

12/24/09 - 20090314528 - Wiring board and wiring board manufacturing method
A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes...

12/17/09 - 20090308643 - Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition
Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties....

12/03/09 - 20090294157 - Electro-optic device and method for manufacturing the same
Therefore, a uniform current can flow through the transparent electrode pattern by providing a supply voltage to the metal thin film pattern and thus it is possible to manufacture the electro-optic device having uniform luminance....

10/01/09 - 20090242246 - Printed circuit board and method for manufacturing same
A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles....

09/24/09 - 20090236128 - Printed wiring board with resin complex layer and manufacturing method thereof
A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed on the insulation layer, the uncured resin layer...

09/03/09 - 20090218118 - Board and manufacturing method for the same
A board includes a core board, an electronic component arranged on the core board, and an intermediate layer that includes resin containing carbon fibers and that surrounds the electronic component from the side....

08/20/09 - 20090205853 - Method for applying a metal on a substrate
There is disclosed a method for applying a first metal on a substrate, which method comprises the steps a) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7,...