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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > Convertible Shape (e.g., Flexible) Or Circuit (e.g., Breadboard) Convertible Shape (e.g., Flexible) Or Circuit (e.g., Breadboard)Convertible Shape (e.g., Flexible) Or Circuit (e.g., Breadboard) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/31/08 - 20080023217 - Flexible printed wiring board An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist which would otherwise be caused during mounting of devices such ... 07/26/07 - 20070169958 - Mask for exposure In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of ... 07/12/07 - 20070158100 - Insulated implantable electrical circuit The invention is directed to an implant able insulated electrical circuit that utilizes polyparaxylylene, preferably as Parylene, a known polymer that has excellent living tissue implant characteristics, to provide for chronic implantation of conductive electrical devices, such as stimulators and sensors. The device is thin, flexible, electrically insulated, and stable ... 06/14/07 - 20070131449 - Wired circuit board and producing method thereof A wired circuit board and a producing method thereof are provided which can precisely form an insulating layer and reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a ground layer and a positioning mark ... 05/03/07 - 20070095562 - Flexible circuit board with reinforcing board A flexible circuit board with a reinforcing board is provided, comprising: a flexible substrate, having an upper surface and a lower surface; and a reinforcing board disposed at a front end of the upper surface of the flexible substrate, wherein a part of the reinforcing board is combined with the ... 04/26/07 - 20070089900 - Flexible board A flexible board capable of being bent easily and precisely a plurality of times at desired positions has insulating layer exhibiting flexibility, a conductor layer and recessed angular portions situated in both side edges of the board so as to oppose each other. Three of more of these angular portions ... 03/22/07 - 20070062722 - Hinge board and method for producing the same A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the ... 12/07/06 - 20060272850 - Interlayer connection conductor and manufacturing method thereof An interlayer connection conductor 1 is formed of a substantially spherical interlayer connector that is formed by forced in through holes 108, in a thickness direction, on a flexible printed circuit board having wiring layers 106, 107 on at leas one surface of an insulating layer The interlayer connection conductor ... 10/19/06 - 20060231288 - Methods for embedding conducting material and devices resulting from the methods Methods of producing a composite substrate and devices made by the methods are disclosed. One of the methods comprises providing a flexible sacrificial layer, producing one or more patterned conducting layers on the flexible sacrificial layer, bending the sacrificial layer into a predetermined shape, providing a stretchable and/or flexible material ... 10/12/06 - 20060225914 - Double sided flexible printed circuit board A flexible printed circuit board includes a flexible substrate having a first region, a second region and a third region; a first conductive foil layer disposed on a lower surface of the flexible substrate, so as to cover the first region, the second region and the third region; a first ... 08/10/06 - 20060175082 - Flexible printed circuit board and connecting method of the same A flexible printed circuit board is provided which can make heights of components protruding from the plane of the FPC as low as possible and prevent the bending property of the FPC from being impaired. A foldable fold-back portion is provided at a part of the EPC, and at the ... 08/03/06 - 20060169486 - Wired circuit board assembly There is provided a wired circuit board assembly which allows effective prevention of the breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet (1), a plurality of wired circuit boards (2) each composed of a base insulating ... 08/03/06 - 20060169485 - Rigid-flex wiring board A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance ... 06/15/06 - 20060124347 - Electronic parts packaging structure and method of manufacturing the same An electronic parts packaging structure of the present invention, includes an insulating layer acting as a flexible substrate, an electronic parts buried in the insulating layer in a state that a whole electronic parts is covered with the insulating layer, and a wiring layer buried in the insulating layer and ... 05/04/06 - 20060090928 - Printed wiring board for plasma display and process for producing the same A printed wiring board for a plasma display, comprising: an insulating film having a folding slit(s) provided at its folding position; a wiring pattern provided on at least one surface of the insulating film; and a flame retardant solder resist layer provided so as for a terminal part to be ... 04/13/06 - 20060076158 - Flexible film wiring board and liquid discharge head In a flexible wiring board for use in, for example, a liquid discharge head, wires disposed on a substrate in parallel are covered with a film material. The flexible wiring board is bendable towards one of a front surface side and a back surface side of the substrate and includes ... 03/30/06 - 20060065432 - Mounting structure for electronic components A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed ... 02/16/06 - 20060032665 - Single layer flex circuit Novel single-layer flexible circuits are provided including a top flexible substrate, a bottom flexible substrate, and a conductive layer disposed therebetween. Signal traces and ground traces can be located in the conductive layer. ... 02/09/06 - 20060027395 - Flexible printed circuit board A flexible printed circuit board (FPC) is provided. The provided FPC includes: an insulating substrate, a conductor layer formed on the insulating substrate and having at least one circuit pattern thereon, an edge connecting layer mounted on at least one side of the insulating substrate, a ripple-shaped boundary formed between ... 01/05/06 - 20060000635 - Method for making a circuit plate A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the first holes; grinding the conductive layer such that the portion of the conductive layer remains in the ... 09/22/05 - 20050205291 - Flexible substrate having interlaminar junctions, and process for producing the same A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and ... 06/23/05 - 20050133250 - Packaging structure and packaging method of electronic components An electronic part mounting structure includes a printed circuit board, a plurality of electronic parts mounted on the printed circuit board, a folded portion of the printed circuit board bent and layered between the electronic parts, through holes formed in both sides of the folded portion, and a wiring connecting ... ### FreshPatents.com Support |