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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Encapsulated Wire

With Encapsulated Wire

With Encapsulated Wire patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

08/28/14 - 20140238725 - Method of flattening surface of conductive structure and conductive structure with flattened surface
A method of flattening surface of conductive structure including a substrate, a dielectric layer on the substrate, and a conductive line formed in the dielectric layer is provided. A surface of the conductive line has a recess. A cover layer is formed on the substrate. A mechanical polishing process is...

08/28/14 - 20140238726 - External moisture barrier package for circuit board electrical component
Moisture barrier packages for electrical components mountable to a circuit board include a cover and a base configured to provide a metal to metal joint that hermitically seals an electrical component in an enclosure defined by the cover and the base. The base may include patterned metallizations using circuit board...

08/28/14 - 20140238727 - Transparent conductive multilayer electrode and associated manufacturing process
nanometric conducting or semiconducting fillers....

08/28/14 - 20140238728 - Plastic film having lines for a multi-modal input device and method for producing
A plastic film for a multi-modal input device has conductors that link a touch module and an operating element. Such input devices, for example, are in central consoles of motor vehicles, dishwashers, washing machines, telephones, or the like. Touch modules and operating element modules are interconnected by the layout of...

08/14/14 - 20140224526 - Multi-layer flexible circuit board and process for producing the same
The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a...

08/14/14 - 20140224527 - Flexible circuit board and process for producing the same
A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing...

08/07/14 - 20140216788 - Double-layered transparent conductive film and manufacturing method thereof
A double-layered transparent conductive film includes: a first substrate; a first imprint adhesive layer formed on the first substrate, the first imprint adhesive layer defining a first mesh-shaped groove, the first mesh-shaped groove forming a first mesh; a first conductive layer including conductive material filled in the first mesh-shaped groove;...

07/31/14 - 20140209356 - Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate
A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main...

07/24/14 - 20140202737 - Adhesive varnish, adhesive film and wiring film
An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate...

07/24/14 - 20140202738 - Nanostructure transparent conductors having high thermal stability for esd protection
Disclosed herein are transparent conductors having high thermal capacity and improved protection against electrostatic discharge....

07/24/14 - 20140202739 - Printed wiring board having metal layers producing eutectic reaction
A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer....

07/24/14 - 20140202740 - Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are...

07/03/14 - 20140182888 - Touch panel
A touch panel has a substrate on which a first conductive layer, an insulating layer, a second conductive layer and a protective layer are formed in order. The second conductive layer and the first conductive layer form a touch-sensing area. The protective layer and the substrate have the same refractive...

07/03/14 - 20140182889 - Multilayered substrate
Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the...

07/03/14 - 20140182890 - Electrical cable assembly
In accordance with an embodiment, an electrical cable can be configured to electrically connect to contact pads that are carried by a substrate. The electrical cable can include at least one, such as a pair, of electrical signal conductors and at least one, for instance a pair, of electrically conductive...

07/03/14 - 20140182891 - Geometrics for improving performance of connector footprints
In accordance with the various embodiments disclosed herein, an improved electrical connector footprint, such as on printed circuit boards (PCB), is described. For example, antipads can have a variety of sizes and pairs of differential signal traces can define centerlines that are spaced apart from each other....

07/03/14 - 20140182892 - Printed circuit board with embedded component and method for manufactruing same
A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of...

07/03/14 - 20140182893 - Printed circuit board
A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by...

07/03/14 - 20140182894 - Touch panel and manufacturing method thereof
A touch panel is partitioned into a sensing region and a circuit region and the circuit region is positioned around the edges of the sensing region. The touch panel comprises an electrode layer, a first wire layer, a second wire layer and an insulating layer. The electrode layer is disposed...

07/03/14 - 20140182895 - Multilayered substrate and method of manufacturing the same
A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending...

07/03/14 - 20140182896 - Substrate having electronic component embedded therein and method of manufacturing the same
A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up...

07/03/14 - 20140182897 - Circuit board and method of manufacturing the same
A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on...

06/26/14 - 20140174791 - Circuit board and manufacturing method thereof
A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the...

06/19/14 - 20140166343 - Electronic component embedded substrate and method of manufacturing electronic component embedded substrate
An electronic component embedded substrate and a method of manufacturing an electronic component embedded substrate, The substrate includes a first via passing through a part of an insulating portion of the substrate to an electrode of the electronic component, and a second via passing through a part of the insulating...

06/19/14 - 20140166344 - Multilayer substrate
A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side...

06/12/14 - 20140158407 - Printed circuit board with visible triangular shaped traces
A printed circuit board includes a transparent base layer, a conductive trace layer, and a transparent cover layer. The conductive trace layer is formed on a first surface of the base layer, and includes two conductive pads and a grid-shaped conductive trace pattern. the grid-shaped conductive trace pattern includes a...

06/12/14 - 20140158408 - Multi-layer wiring board and method of manufacturing the same
A multi-layer wiring board comprises: a plurality of multi-layer wiring units each having a plurality of printed wiring boards stacked therein via an adhesive layer, the printed wiring board having a wiring layer formed on an insulating base therein and having flexibility, and the wiring layers being connected to each...

06/05/14 - 20140151092 - Pcb with visible circuit and method for making and using pcb with visible circuit
A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the...

05/29/14 - 20140144675 - Multi-layer printed circuit board and method for manufacturing same
An exemplary multi-layer printed circuit board includes a multi-layer substrate with a recess, and a first high density wiring substrate received in the recess. The multi-layer substrate includes a base layer, a first wiring layer arranged on the base layer, first insulating layers, and third wiring layers. The first insulating...

05/29/14 - 20140144676 - Electronic component embedded substrate and manufacturing method thereof
The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component inserted in the cavity; a first metal pattern formed on a lower surface of the first insulating layer to mount the electronic component thereon and including at least one...

05/22/14 - 20140138123 - Circuit stack structure
A circuit stack structure is provided. The circuit stack structure includes a conductor layer having metal wires arranged at intervals, propping portions respectively disposed in a gap between any two of the neighboring metal wires, and a protective layer covering the metal wires and the propping portions. The propping portions...

05/22/14 - 20140138124 - Method of manufacturing an electronic high-current circuit by means of gas injection technology and sealing with an insulating polymer
An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer...

05/22/14 - 20140138125 - Circuit board and method of manufacturing the same, touch panel sensor sheet and screen printing plate
Disclosed is a method of manufacturing a circuit board, which includes a stand-by process setting a screen printing plate so as to be opposed with a base, where the screen printing plate has a line pattern formed therethrough, and the line pattern is configured by a plurality of dot-like through-holes...

05/22/14 - 20140138126 - Method of manufacturing multilayer printed wiring board and multilayer wiring board obtained thereby
In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper...

05/15/14 - 20140131067 - Transparent conductor and preparation method thereof
A transparent conductor includes a transparent substrate, a conductive mesh, and an insulating protective layer, which are laminated in that order, wherein the conductive mesh is formed on the transparent substrate, and a surface of the insulating protective layer away from the transparent substrate is flat. Such transparent conductor avoids...

05/15/14 - 20140131068 - Circuit board and method for manufacturing the same
Disclosed herein is a circuit board including: a core layer; first and second layers sequentially stacked on the core layer, wherein prominence-depressions having different sizes are formed on a surface of the first layer in each region of the core layer....

05/15/14 - 20140131069 - Touch-sensing electrode structure and method of manufacturing the same
The present disclosure provides a touch-sensing electrode structure, which includes a plurality of touch-sensing electrodes. Each of the touch-sensing electrodes includes a main body and a connecting portion connected to an end of the main body; wherein the width of the connecting portion is not less than a half width...

05/15/14 - 20140131070 - Touch panel structure and manufacturing method thereof
A manufacturing method of a touch panel structure includes the following steps. A first conductive layer is formed on a mounting surface of a substrate, and the first conductive layer has multiple first electrodes. A first electrical-insulation layer is formed on the mounting surface of the substrate, and the first...

05/08/14 - 20140124245 - Embedded printed circuit board and method for manufacturing same
A method for manufacturing an embedded printed circuit board includes the following steps. First, a circuit substrate is provided. The circuit substrate includes a base, a first wiring layer, and a second wiring layer. The first wiring layer includes a number of electrode connection wires. Second, an opening is defined...

05/08/14 - 20140124246 - Molded product and in-mold transfer foil
Provided is a molded product including a primary molded layer, a transfer layer that includes at least a decorating layer and a print layer for foil flow prevention including one of polyester, polyurethane, polyimide and cellulose, or a mixture obtained by combining two or more of polyester, polyurethane, polyimide and...

05/08/14 - 20140124247 - Transparent conductive film
There is provided a transparent conductive film which comprises: a film substrate; a plurality of transparent conductor patterns formed on the film substrate; and a pressure-sensitive adhesive layer wherein the transparent conductor patterns are embedded. The plurality of transparent conductor patterns respectively have a two-layer structure wherein a first indium...

05/01/14 - 20140116755 - Laminate circuit board structure
A laminate circuit board structure which includes a first circuit metal layer, a first insulation layer, at least one second circuit metal layer, at least one second insulation layer and a support frame is disclosed. The total thickness of the laminate circuit board structure is less than 150 μm. The...

04/24/14 - 20140110152 - Printed circuit board and method for manufacturing same
A printed circuit board includes a first outer electrically conductive pattern layer, a first insulation layer, a first inner electrically conductive pattern layer, a connection adhesive sheet, a second inner electrically conductive layer, a second insulation layer, a second outer electrically conductive pattern layer, and a identification mark, which are...

04/24/14 - 20140110153 - Wiring board and method for manufacturing the same
A wiring board includes an insulating resin layer, wirings, and a via-hole conductor. The wirings are disposed through the insulating resin layer therebetween and formed of copper foils. The via-hole conductor penetrates through the insulating resin layer and electrically connects the wirings together. The via-hole conductor includes a resin portion...

04/24/14 - 20140110154 - Bus apparatus for use with circuit interrupters or other devices
An improved bus apparatus includes a generally rigid substrate and a conductor apparatus. The conductor apparatus includes a number of bus elements that are embedded within the substrate and which are electrically connected with connection elements that each have an end that is situated external to the substrate. Additional connection...

04/24/14 - 20140110155 - Flexible multilayer substrate
A flexible multilayer substrate includes a stacked body including a plurality of stacked resin layers and defining a flexible portion. The stacked body includes an innermost surface that is a surface located inside when the stacked body is bent in use, and an outermost surface that is a surface located...

04/17/14 - 20140102765 - Multilayer electronic structures with improved control of dielectric thickness
A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures, and pressing to pressures of 200 to 600 PSI against a release film having a higher hardness than the resin of the prepreg but a...

04/17/14 - 20140102766 - Multi-layer type coreless substrate and method of manufacturing the same
Disclosed herein is a multi-layer type coreless substrate, including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated on one surface or both surfaces of the first insulating layer, each including at least one circuit layer and at least another pillar connected to...

04/17/14 - 20140102767 - Multi-layer type printed circuit board and method of manufacturing the same
Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to...

04/17/14 - 20140102768 - Wiring board and method for manufacturing the same
A wiring board includes a first insulation layer, a first conductive pattern structure formed on the first insulation layer, a wiring structure formed on the first insulation layer and including a second insulation layer and a second conductive pattern structure on the second insulation layer, and a third insulation layer...

04/17/14 - 20140102769 - System for depositing microwire
A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a...