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With Encapsulated Wire

With Encapsulated Wire patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

Related Categories:

Electricity: Conductors And Insulators


Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Encapsulated Wire



Method and system for producing a multilayer element and multilayer element
05/28/15 - 20150144379 - A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions....

Printed circuit board
05/21/15 - 20150136446 - Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a metal layer is interposed in the insulating layers, in order to improve warpage property of the board....

Multilayer wiring board
05/21/15 - 20150136447 - A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground...

Flexible printed wiring board and electronic apparatus
05/21/15 - 20150136448 - According to one embodiment, a flexible printed wiring board includes a first conductor layer formed on the first surface of an insulation base, a second conductor layer formed on the second surface of the insulation base, a first insulation layer covering the first conductor layer, and a second insulation layer...

Multilayered wiring substrate
05/21/15 - 20150136449 - [Means for Solution] A multilayer wiring substrate 10 includes a sheetlike capacitor element 101, a resin filler 92, and via conductors 43 and 47. A sheetlike capacitor element 101 has an element main-surface 102 and an element back-surface 103, is configured such that a dielectric layer 107 is sandwiched directly...

Shaped intneral leads for a printed circuit substrate
05/14/15 - 20150129284 - A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with...

Packaging substrate having embedded through-via interposer
05/14/15 - 20150129285 - A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with...

Printed wiring board
05/07/15 - 20150122530 - A printed wiring board includes a core substrate including a resin insulating layer and multiple conductor layers, a first wiring structure formed on a first surface of the core substrate and including a conductor layer and a resin insulating layer, and a second wiring structure formed on a second surface...

Printed circuit board
04/30/15 - 20150114686 - A printed circuit board includes a first dielectric layer, a first ground layer, a second dielectric layer, a first power layer, a first via hole, and a first ground hole. A first signal line is laid on the first dielectric layer. A third signal line is laid on the second...

Pcb trace connection of ion smoke sensor
04/30/15 - 20150114687 - Embodiments are directed to a method for manufacturing a smoke detector, comprising: manufacturing a substrate that comprises a guard ring configured to surround an ion chamber collector plate pin connection point, a surface mount component connection point, and a trace coupling the ion chamber collector plate pin connection point and...

Printed circuit board
04/30/15 - 20150114688 - Disclosed herein is a printed circuit board having an improved structure of a dummy part to improve warpage strength of the printed circuit board, the printed circuit board including: a plurality of insulating layers built-up therein, the plurality of insulating layers including copper clad layers; and a product zone and...

Flex-rigid wiring board and method for manufacturing flex-rigid wiring board
04/30/15 - 20150114689 - A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the...

Flex-rigid wiring board and method for manufacturing flex-rigid wiring board
04/30/15 - 20150114690 - A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the...

Core substrate and method for manufacturing the same
04/30/15 - 20150114691 - Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded...

Ecological method for constructing circuit boards
04/09/15 - 20150096788 - A method for fabrication of a circuit board using the disclosed embodiments relies on a CAD model of a multilayer circuit board with conductive elements defined by layer. A first granular conductive material layer is introduced into a mold. A fusion process element traverses across the mold to fuse selected...

Electronic component embedded printed circuit board and method for manufacturing the same
04/09/15 - 20150096789 - An electronic component embedded printed circuit board of the present invention includes a core having a cavity therein and internal circuit layers on upper and lower surfaces thereof; an electronic component inserted in the cavity and having an elastic body on an outer peripheral surface thereof; insulating layers laminated on...

Silver thick film paste hermetically sealed by surface thin film multilayer
04/02/15 - 20150090478 - A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms...

Transparent body for use in a touch screen panel manufacturing method and system
03/26/15 - 20150083464 - A process for manufacturing a transparent body for use in a touch screen panel is provided. The process includes: depositing a first transparent layer stack over a transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second...

Transparent conductive substrate, and method for manufacturing same
03/26/15 - 20150083465 - A transparent or conductive substrate and its manufacturing method are provided. The transparent or conductive substrate comprises a base substrate capable of light transmission; a transparent electroconductive layer formed by depositing a transparent electroconductive material; and an anti-reflection layer, wherein the anti-reflection layer is formed by using a dry etching...

Multilayer wiring board
03/19/15 - 20150075843 - A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component, a wire wiring layer that is arranged on an opposite side...

Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same
03/19/15 - 20150075844 - An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion...

Printed circuit board and method of manufacturing the same
03/19/15 - 20150075845 - Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a...

Printed wiring board
03/12/15 - 20150068788 - A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and...

Methods for shielding electronic components from moisture
03/05/15 - 20150060110 - Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as...

Printed circuit board and method of manufacturing the same
02/26/15 - 20150053457 - Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit...

Insulating film for printed circuit board and products having the same
02/26/15 - 20150053458 - Disclosed herein are an insulating film for a printed circuit board and products having the same. In detail, in the insulating film according to a representative embodiment of the present invention, an insulating material in which a content of an inorganic filler in an insulating layer has a concentration gradient...

Patterning of electrically conductive films
02/26/15 - 20150053459 - Articles and methods of making them, the methods comprising providing a conductive film comprising a first region exhibiting a first conductivity and a second region exhibiting a second conductivity, the first region and the second region each comprising a plurality of conductors, forming a first pattern in the conductive film...

Wiring board, semiconductor device, and method for manufacturing wiring board
02/26/15 - 20150053460 - A wiring board includes first and second insulating layers, first and second through holes, a via, a plane layer, and signal wirings. The first insulating layer covers a first wiring layer. The first through hole opens on a surface of the first insulating layer and exposes a surface of the...

Panel
02/26/15 - 20150053461 - A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device area and the bonding area. The wirings extend from the device area to the bonding area through...

Masking layer formed by applying developable photosensitive resin compositions on panel structure
02/19/15 - 20150047881 - The invention relates to a masking layer. The masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a transparent substrate, developing the white-color photosensitive resin composition to obtain a patterned composition layer, coating a gray-color photosensitive resin composition on the cured composition layer and...

Chip board package structure
02/12/15 - 20150041183 - A chip board package structure includes a circuit board part, a chip board part and a solder used to solder the circuit board part and the chip board part. A chip on the chip board part is connected to an electrical circuit by wiring or soldering. A surface treatment metal...

The printed circuit board and the method for manufacturing the same
02/12/15 - 20150041184 - A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove...

Circuit with flat electromagnetic band gap resonance structure
02/12/15 - 20150041185 - Circuit with flat electromagnetic band gap resonance structure, includes a plurality of flat units formed at a conductor layer; each flat unit spirally revolves inward from a first end to an internal point following a rotation direction, and spirally revolves outward from the internal point to a second end following...

Flexible printed circuit board and method for making same
02/05/15 - 20150034364 - An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening...

Method for manufacturing wiring board and wiring board
02/05/15 - 20150034365 - A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer is covering the conductive pattern and exposing a conductive pad portion of the conductive pattern, applying microwave plasma on the wiring...

Circuit board
02/05/15 - 20150034366 - One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface...

Flexible circuit board with planarized cover layer structure
01/29/15 - 20150027751 - A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal...

Printed circuit board and method of manufacturing same
01/29/15 - 20150027752 - A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A...

Panel structure
01/29/15 - 20150027753 - A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the...

Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same
01/29/15 - 20150027754 - A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90°...

Device components with surface-embedded additives and related manufacturing methods
01/15/15 - 20150014022 - Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing...

Conductive film and touch panel including the same
01/15/15 - 20150014023 - A conductive film may be provided that includes a base member, a first hard coating layer formed on a surface of the base member, and a conductive layer formed on the first hard coating layer. The conductive layer may include conductors composed of a nano-material forming a network structure....

Conductive film and preparation method thereof
01/08/15 - 20150008014 - A conductive film includes a transparent insulating substrate and a conductive mesh formed on the transparent insulating substrate, one of them is imprinted to form a meshed-like grooves on a surface thereof, it is simple and quick, having high efficiency; the grooves is printed and filled with metal slurry and...

Printed circuit board and method of fabricating the same
01/01/15 - 20150000958 - The present invention discloses a printed circuit board including a lower wiring layer, an insulating layer which buries the lower wiring layer, and an upper wiring layer formed on the insulating layer to improve reliability of interlayer electrical connection between the wiring layers, wherein the interlayer connection between the upper...

Multilayer printed circuit board having anisotropy condictive film and method for manufacturing same
01/01/15 - 20150000959 - A multilayer printed circuit board (PCB) includes a first and second PCB component, and an anisotropic conductive film (ACF). The first PCB component includes a first base isolative layer, additional circuited layers and isolative layers alternately stacked on the first base isolative layer, and a number of conductive posts protruding...

Composite conductive films with enhanced surface hardness
01/01/15 - 20150000960 - A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of inorganic nanowires. The plurality of inorganic nanowires is embedded throughout at least a region of the layer of cross-linked polymer. The region is continuous from the...

Hermetically-sealed electrical circuit apparatus
12/25/14 - 20140374145 - Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions....

Metal nanonetwork and method for producing the same, and conductive film and conductive substrate using metal nanonetwork
12/25/14 - 20140374146 - A metal nanonetwork includes metal nanostructures that are joined by metallic bond. The joined part between the metal nanostructures includes a fillet part. In the joined part between the metal nanostructures, the distance between the central axis of one metal nanostructure and the central axis of another metal nanostructure is...

Insulating resin composition for printed circuit board, insulating film, prepreg and printed circuit board
12/18/14 - 20140367147 - Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so...

Touch panel and manufacturing method thereof
12/18/14 - 20140367148 - Disclosed are an optical member, a display device including the optical member and a method of fabricating the optical member. The display device includes a light source; a wavelength conversion member into which light generated from the light source is incident; and a display panel into which light is incident...

Wiring board and method for manufacturing the same
12/11/14 - 20140360759 - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second...

Wiring substrate and manufacturing method of wiring substrate
12/11/14 - 20140360760 - A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of...

Printed circuit board and method of manufacturing the same
12/11/14 - 20140360761 - Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns...

Multilayer circuit board and method for manufacturing same
12/04/14 - 20140353006 - A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring layer. The first adhesive sheet is adjacent to the first wiring layer. The first adhesive sheet defines a...

Wired circuit board
12/04/14 - 20140353007 - A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side...

Printed circuit board structure
11/27/14 - 20140345909 - A printed circuit board structure comprises a base layer, an insulation layer, and a signal layer sandwiched between the base layer and the insulation layer. The insulation layer includes a plurality of conductive regions. The conductive regions are used for providing a current reflowing path. Each of the conductive regions...

Method of forming conductive line, and device comprising the same
11/27/14 - 20140345910 - The present invention relates to a method for forming a conductive line, and a device comprising the conductive line. The method for forming a conductive line comprises: (A) providing a metal oxide composition which comprises a metal oxide, and a reducing agent; (B) applying the metal oxide composition on a...

Rigid flexible printed circuit board and method of manufacturing the same
11/27/14 - 20140345911 - A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay...

Electric multilayer printed circuit board
11/27/14 - 20140345912 - The invention relates to an electric multilayer printed circuit board which satisfies the PICMG specification EXP.O, comprising a first signal layer and a second signal layer. The first signal layer comprises at least one first conductive path (33) and a first shielding region. The second signal layer comprises at least...

Method and device of manufacturing printed circuit board
11/27/14 - 20140345913 - Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer...

Printing circuit board and the application the same of
11/20/14 - 20140338957 - A Printing Circuit Board is disclosed, a preferred embodiment in accordance with the present invention includes: an insulator, and a trace(s) which is embedded therein, wherein both the upper surface and a portion of the lower surface of said trace exposed out of said insulator, nevertheless, another portion of the...

Printed circuit board and method of manufacturing the same
11/20/14 - 20140338958 - A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A...

Carrier substrate and manufacturing method thereof
11/13/14 - 20140332252 - A carrier substrate includes an insulation layer, conductive towers and a circuit structure layer. A diameter of each of the conductive towers is increased gradually from a top surface to a bottom surface, and the conductive towers include first conductive towers and second conductive towers surrounding the first conductive towers....

Carrier substrate and manufacturing method thereof
11/13/14 - 20140332253 - A carrier substrate includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer has a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface and the blind vias extend from...

Laser patterning of silver nanowire - based transparent electrically conducting coatings
11/13/14 - 20140332254 - A transparent electrical conductor (10; 20), comprising a transparent substrate (14; 201); a composite layer (18; 28) comprising an electrically conductive layer (12) disposed on at least a portion of a major surface of the transparent substrate (14; 201) and comprising a plurality of interconnecting metallic nanowires, and a polymeric...

Printed circuit board and method of manufacturing the same
11/13/14 - 20140332255 - Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by...

Printed circuit board with shallow solder pad and method for manufacturing the same
11/06/14 - 20140326485 - An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height relative to the base are formed on the outer surface of the base. The solder pads having a second height relative to the base are...

Printed wiring boards having thermal management features and thermal management apparatuses comprising the same
10/30/14 - 20140318829 - A printed wiring board includes an insulator substrate, an electrical conductor at least partially embedded in the insulator substrate, and a thermal conductor at least partially embedded in the insulator substrate. The printed wiring board also includes a temperature-insensitive component mounting region and a temperature-sensitive component mounting region. The insulator...

Wiring board
10/23/14 - 20140311771 - A wiring board includes first insulating layers and second insulating layers formed on a core layer in this order; a third insulating layer and a solder resist layer formed on another surface of the core layer in this order, first wiring layers and second wiring layers formed in the first...

Printed wiring board and method for manufacturing multilayer core substrate
10/23/14 - 20140311772 - A printed wiring board includes: a multilayer core substrate including first and second insulation layers and a double-sided board between the first and second insulation layers. The core substrate has a cylindrical through-hole structure including a cylindrical conductor through the insulation layers and the board, a resin filler filling inside...

Multi-layer wiring board and method of manufacturing the same
10/23/14 - 20140311773 - A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an...

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