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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) > With Encapsulated Wire

With Encapsulated Wire

With Encapsulated Wire patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

10/09/14 - 20140299358 - Multilayer circuit substrate
A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The...

10/09/14 - 20140299359 - Structures with surface-embedded additives and related manufacturing methods
Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes....

10/09/14 - 20140299360 - Conductive sheet and method for fabricating the same
In a conductive sheet using a metal nanofiber, metal migration in a visible conductive pattern is eliminated. Also, the intervals of the conductive portion (separate sheet terminal) are shortened. On a substrate (26) is a conductive sheet (10), formed from a transparent conductive pattern (11) and a visible conductive pattern...

10/02/14 - 20140290983 - Stacked multilayer structure
Disclosed is a stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first...

10/02/14 - 20140290984 - Transparent conductive film
A transparent conductive film includes a substrate, a transparent conductive layer, a lead electrode, and a first connecting wire, the substrate includes a first region and a second region located on the edge of the substrate; the transparent conductive layer is embedded in the first region, the lead electrode is...

10/02/14 - 20140290985 - Embedded metal structures in ceramic substrates
The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and...

09/25/14 - 20140284082 - Touchscreen and conductive layer thereof
The present invention relates to a conductive layer of a touch screen, the conductive layer is a mesh composed of metal wires, the mesh comprises a plurality of mesh cells, the mesh cell comprises a plurality of mesh edges and nodes formed by connecting two adjacent edges, the conductive layer...

09/25/14 - 20140284083 - Patterned transparent conductors and related manufacturing methods
A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions....

09/18/14 - 20140262444 - Circuitry with high aspect ratio traces
Imprinting tools and processes for making such tools, circuitry that includes narrow, high aspect ratio traces having reduced parasitic capacitance to adjacent circuit features and processes for making such circuitry using the imprinting tools are described....

09/18/14 - 20140262445 - Methods and circuit structures for mitigating voltage stresses on printed circuit board (pcb) in high voltage devices
A method for mitigating voltage stress on a PCB includes applying AC voltage to a multi-terminal condenser structure of a multi-layered PCB. The terminal condenser structure is formed by overlapping a plurality of conductive traces between board layers of the multi-layered PCB. A corresponding dielectric layer is disposed between the...

09/18/14 - 20140262446 - Systems and methods for providing surface connectivity of oriented conductive channels
An electrically conductive composite is disclosed that includes a dielectric material having a first side and a second side, conductive particles within the dielectric material layer, and a discontinuous layer of a conductive material on a first side of the dielectric layer. The conductive particles are aligned to form a...

09/18/14 - 20140262447 - Multilayer printed wiring board for mounting semiconductor element
A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second...

09/18/14 - 20140262448 - High-frequency signal line, method for producing same, and electronic device
A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground...

09/11/14 - 20140251655 - Stabilization agents for silver nanowire based transparent conductive films
Boric acid has been found to provide anticorrosion properties when incorporated into silver nanowire containing films. Such compounds may be incorporated into one or more silver nanowire containing layers or in one or more layers disposed adjacent to the silver nanowire containing layers....

09/11/14 - 20140251656 - Wiring board and method for manufacturing the same
A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive...

09/11/14 - 20140251657 - Printed circuit board and method of manufacturing the same
Embodiments of the invention provide a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the...

09/04/14 - 20140246224 - Substrate for suspension, and production process thereof
The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting...

08/28/14 - 20140238725 - Method of flattening surface of conductive structure and conductive structure with flattened surface
A method of flattening surface of conductive structure including a substrate, a dielectric layer on the substrate, and a conductive line formed in the dielectric layer is provided. A surface of the conductive line has a recess. A cover layer is formed on the substrate. A mechanical polishing process is...

08/28/14 - 20140238726 - External moisture barrier package for circuit board electrical component
Moisture barrier packages for electrical components mountable to a circuit board include a cover and a base configured to provide a metal to metal joint that hermitically seals an electrical component in an enclosure defined by the cover and the base. The base may include patterned metallizations using circuit board...

08/28/14 - 20140238727 - Transparent conductive multilayer electrode and associated manufacturing process
nanometric conducting or semiconducting fillers....

08/28/14 - 20140238728 - Plastic film having lines for a multi-modal input device and method for producing
A plastic film for a multi-modal input device has conductors that link a touch module and an operating element. Such input devices, for example, are in central consoles of motor vehicles, dishwashers, washing machines, telephones, or the like. Touch modules and operating element modules are interconnected by the layout of...

08/14/14 - 20140224526 - Multi-layer flexible circuit board and process for producing the same
The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a...

08/14/14 - 20140224527 - Flexible circuit board and process for producing the same
A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing...

08/07/14 - 20140216788 - Double-layered transparent conductive film and manufacturing method thereof
A double-layered transparent conductive film includes: a first substrate; a first imprint adhesive layer formed on the first substrate, the first imprint adhesive layer defining a first mesh-shaped groove, the first mesh-shaped groove forming a first mesh; a first conductive layer including conductive material filled in the first mesh-shaped groove;...

07/31/14 - 20140209356 - Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate
A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main...

07/24/14 - 20140202737 - Adhesive varnish, adhesive film and wiring film
An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate...

07/24/14 - 20140202738 - Nanostructure transparent conductors having high thermal stability for esd protection
Disclosed herein are transparent conductors having high thermal capacity and improved protection against electrostatic discharge....

07/24/14 - 20140202739 - Printed wiring board having metal layers producing eutectic reaction
A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer....

07/24/14 - 20140202740 - Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are...

07/03/14 - 20140182888 - Touch panel
A touch panel has a substrate on which a first conductive layer, an insulating layer, a second conductive layer and a protective layer are formed in order. The second conductive layer and the first conductive layer form a touch-sensing area. The protective layer and the substrate have the same refractive...

07/03/14 - 20140182889 - Multilayered substrate
Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the...

07/03/14 - 20140182890 - Electrical cable assembly
In accordance with an embodiment, an electrical cable can be configured to electrically connect to contact pads that are carried by a substrate. The electrical cable can include at least one, such as a pair, of electrical signal conductors and at least one, for instance a pair, of electrically conductive...

07/03/14 - 20140182891 - Geometrics for improving performance of connector footprints
In accordance with the various embodiments disclosed herein, an improved electrical connector footprint, such as on printed circuit boards (PCB), is described. For example, antipads can have a variety of sizes and pairs of differential signal traces can define centerlines that are spaced apart from each other....

07/03/14 - 20140182892 - Printed circuit board with embedded component and method for manufactruing same
A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of...

07/03/14 - 20140182893 - Printed circuit board
A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by...

07/03/14 - 20140182894 - Touch panel and manufacturing method thereof
A touch panel is partitioned into a sensing region and a circuit region and the circuit region is positioned around the edges of the sensing region. The touch panel comprises an electrode layer, a first wire layer, a second wire layer and an insulating layer. The electrode layer is disposed...

07/03/14 - 20140182895 - Multilayered substrate and method of manufacturing the same
A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending...

07/03/14 - 20140182896 - Substrate having electronic component embedded therein and method of manufacturing the same
A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up...

07/03/14 - 20140182897 - Circuit board and method of manufacturing the same
A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on...

06/26/14 - 20140174791 - Circuit board and manufacturing method thereof
A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the...

06/19/14 - 20140166343 - Electronic component embedded substrate and method of manufacturing electronic component embedded substrate
An electronic component embedded substrate and a method of manufacturing an electronic component embedded substrate, The substrate includes a first via passing through a part of an insulating portion of the substrate to an electrode of the electronic component, and a second via passing through a part of the insulating...

06/19/14 - 20140166344 - Multilayer substrate
A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side...

06/12/14 - 20140158407 - Printed circuit board with visible triangular shaped traces
A printed circuit board includes a transparent base layer, a conductive trace layer, and a transparent cover layer. The conductive trace layer is formed on a first surface of the base layer, and includes two conductive pads and a grid-shaped conductive trace pattern. the grid-shaped conductive trace pattern includes a...

06/12/14 - 20140158408 - Multi-layer wiring board and method of manufacturing the same
A multi-layer wiring board comprises: a plurality of multi-layer wiring units each having a plurality of printed wiring boards stacked therein via an adhesive layer, the printed wiring board having a wiring layer formed on an insulating base therein and having flexibility, and the wiring layers being connected to each...

06/05/14 - 20140151092 - Pcb with visible circuit and method for making and using pcb with visible circuit
A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the...

05/29/14 - 20140144675 - Multi-layer printed circuit board and method for manufacturing same
An exemplary multi-layer printed circuit board includes a multi-layer substrate with a recess, and a first high density wiring substrate received in the recess. The multi-layer substrate includes a base layer, a first wiring layer arranged on the base layer, first insulating layers, and third wiring layers. The first insulating...

05/29/14 - 20140144676 - Electronic component embedded substrate and manufacturing method thereof
The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component inserted in the cavity; a first metal pattern formed on a lower surface of the first insulating layer to mount the electronic component thereon and including at least one...

05/22/14 - 20140138123 - Circuit stack structure
A circuit stack structure is provided. The circuit stack structure includes a conductor layer having metal wires arranged at intervals, propping portions respectively disposed in a gap between any two of the neighboring metal wires, and a protective layer covering the metal wires and the propping portions. The propping portions...

05/22/14 - 20140138124 - Method of manufacturing an electronic high-current circuit by means of gas injection technology and sealing with an insulating polymer
An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer...

05/22/14 - 20140138125 - Circuit board and method of manufacturing the same, touch panel sensor sheet and screen printing plate
Disclosed is a method of manufacturing a circuit board, which includes a stand-by process setting a screen printing plate so as to be opposed with a base, where the screen printing plate has a line pattern formed therethrough, and the line pattern is configured by a plurality of dot-like through-holes...

05/22/14 - 20140138126 - Method of manufacturing multilayer printed wiring board and multilayer wiring board obtained thereby
In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper...