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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit)

Preformed Panel Circuit Arrangement (e.g., Printed Circuit)

Preformed Panel Circuit Arrangement (e.g., Printed Circuit) patent applications listed include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

10/09/14 - 20140299356 - Protective film with dye materials for laser absorption enhancement for via drilling
Embodiments of preventing unwanted damage to microelectronic substrates from laser drilling are generally described herein. In some embodiments, the method includes forming a microelectronic substrate, and adding a layer of protective material to dielectric material of the microelectronic substrate. The microelectronic substrate is configured for mounting one or more integrated...

10/09/14 - 20140299357 - Conductive sheet and touch panel
Provided are a conductive sheet and a touch panel having a high detection accuracy of touching with a finger. A conductive sheet includes: a first electrode pattern including first conductive patterns; and a second electrode pattern including second conductive patterns. The first conductive patterns and the second conductive patterns are...

10/02/14 - 20140290979 - Method of manufacturing a patterned transparent conductor
Method of manufacturing patterned conductor is provided, comprising: providing a conductivised substrate, wherein the conductivised substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of...

10/02/14 - 20140290980 - Touch screen and method of producing the same
A touch screen comprises a glass substrate, a first conductive layer, an insulating adhesive layer and a second conductive layer. The first conductive layer is directly formed on the glass substrate and comprises first conductive pattern areas; the insulating adhesive layer is attached to the glass substrate, and one side...

10/02/14 - 20140290981 - Printed circuit board
A printed circuit board includes a board body, a signal transmission line laid in the board body, and a metal bracket attached to the board body. The metal bracket tightly abuts side surfaces of the board body and shields electromagnetic interference of the signal transmission line when the signal transmission...

10/02/14 - 20140290982 - Printed circuit board and method for manufacturing the same
Disclosed herein is a printed circuit board including: an insulating layer having first and second surfaces; a first circuit layer formed on the first surface of the insulating layer and including at least one first circuit pattern; a second circuit layer formed on the first circuit layer and including at...

09/25/14 - 20140284079 - Conductive layer of touch screen
A conductive layer of a touch screen is disclosed including a mesh made of metal wire. The conductive layer includes a sensing area and a wiring area electrically connected to the sensing area, the sensing area includes at least one of the first sensing patterns and at least one of...

09/25/14 - 20140284080 - Printed circuit board and method of mounting integrated circuit packaging component on the same
A printed circuit board and a method of mounting an integrated circuit packaging component on the same are provided. The printed circuit board includes a substrate and a plurality of conductive contacts arranged on a surface of the substrate. Each of the conductive contacts has a soldering material layer formed...

09/25/14 - 20140284081 - Wiring substrate
A wiring board includes a substrate layer, an insulating layer laminated on the substrate layer and a connection terminal exposed from the insulating layer. The insulating layer has a first surface formed with an opening, a second surface located inside the opening and recessed toward the substrate layer and a...

09/18/14 - 20140262439 - Method of manufacturing electrical circuit traces
A method of manufacturing an electrical trace includes forming a continuous electrical trace strip having a plurality of electrical trace elements, stamping one or more electrical trace isolators onto the continuous electrical trace strip across select ones of the plurality of electrical trace members forming one or more electrical trace...

09/18/14 - 20140262440 - Multi-layer core organic package substrate
A multi-layer core organic package substrate includes: a multi-layer core comprising at least two organic core layers, wherein two of the at least two organic core layers are separated by a core metal layer; a first plurality of build-up layers formed on top of the multi-core layer; and a second...

09/18/14 - 20140262441 - Circuit board with signal routing layer having uniform impedance
A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes connector traces, chip traces, and signal traces connecting the two. A width of the signal traces is greater than a width of the chip traces, which is less than...

09/18/14 - 20140262442 - Module and method of manufacturing the same
A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and...

09/18/14 - 20140262443 - Hybrid patterned nanostructure transparent conductors
Disclosed herein are nanostructure patterned transparent conductors and methods of forming such transparent conductors including using a deposition method to form an active area and peripheral area and patterning method to pattern the active area....

09/04/14 - 20140246223 - Substrate
The present invention relates to a substrate comprising a build-up and a solder resist layer disposed on the build-up. The solder resist layer has an upper surface facing away from the build-up. The solder resist layer has a plurality of grooves on its upper surface. The grooves of the solder...

08/28/14 - 20140238724 - Fabrication of three-dimensional printed circuit board structures
A method of fabricating components for a three-dimensional circuit structure includes providing a printed circuit board (PCB) having a top surface, an opposing bottom surface, and an end section. A first angled channel is formed in the top surface at the end section, with the first angled channel extending to...

08/14/14 - 20140224525 - Dummy structure for visual aid in printed wiring board etch inspection
A dummy structure for a printed wiring board (PWB) includes a unit shape defined on the PWB, the unit shape configured to, based on a visual inspection thereof, provide an indication of one of: etching of a PWB circuit element within a desired tolerance range, over etching of the PWB...

08/07/14 - 20140216784 - Making a conductive article having micro-channels
A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 μm. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in...

08/07/14 - 20140216785 - Patterned transparent conductive film
A patterned transparent conductive film is disclosed in the present invention, which includes a substrate, a first conductive layer, a second conductive layer, both the conductive layer includes a conductive area and an insulating area, the conductive area includes a metal mesh formed by a plurality of metal lines; the...

08/07/14 - 20140216786 - Lead electrode and preparation method thereof
A lead electrode and a preparation method thereof are provided. The lead electrode includes an inner terminal, a lead, and an outer terminal, which are sequentially connected. The lead includes: an insulating substrate; an adhesive material coated on the insulating substrate, the adhesive material defining a trenched mesh; and a...

08/07/14 - 20140216787 - Printed circuit board and fabrication method thereof
A method for forming a printed circuit board is disclosed. A substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region is provided. A first circuit is formed on the substrate. An insulating layer is...

07/31/14 - 20140209355 - Large-current micro-wire pattern
A pattern of micro-wires forming an electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. Each second micro-wire is electrically connected to at least two first micro-wires and at...

07/24/14 - 20140202735 - Method of manufacturing non-firing type electrode
A method of manufacturing a non-firing type electrode comprising steps of: (A) applying on a substrate a conductive paste comprising, (a) a conductive powder comprising, (i) a first conductive powder having Young's modulus of 60×109 Pa or higher; and (ii) a second conductive powder having Young's modulus of 5×109 to...

07/24/14 - 20140202736 - Lead frame and a method of fabrication thereof
Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar...

07/17/14 - 20140196933 - Method for fabricating thin sheets of glass
Fabrication of thin sheets of glass or other substrate material for use in devices such as touch sensor panels is disclosed. A pair of thick glass sheets, typically with thicknesses of 0.5 mm or greater each, may each be patterned with thin film on a surface, sealed together to form...

07/03/14 - 20140182887 - Three-dimensional structure for wiring formation
One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 μm or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring...

06/26/14 - 20140174789 - Touch panel and fabrication method thereof
The present disclosure relates to a touch panel, and more particularly, to a kind of touch panel which actualizes various touch response functions on a same surface and a fabrication method thereof. The touch panel includes an upper cover substrate, a first electrode array, a patterned mask layer, and at...

06/26/14 - 20140174790 - Wiring substrate
A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and...

06/12/14 - 20140158399 - Electrohydrodynamic (ehd) printing for the defect repair of contact printed circuits
A method is provided for repairing defects in a contact printed circuit. The method provides a substrate with a contact printed circuit formed on a substrate top surface. After detecting a discontinuity in a printed circuit feature, a bias voltage is applying to at least one of a first region...

06/12/14 - 20140158400 - Conductive films having low-visibility patterns and methods of producing the same
A patterned transparent conductor including a conductive layer coated on a substrate is described. More specifically, the transparent conductor has low-visibility patterns....

06/12/14 - 20140158401 - Display panel and wiring structure thereof
The present invention provides a display panel and a wiring structure thereof. The wiring structure comprises a plurality of metal wires extending across a first wiring region, a second wiring region, and a third wiring region. The first wiring region adjoins the second wiring region. The second wiring region adjoins...

06/12/14 - 20140158402 - Method of producing resonant patterns adapted to the implementation of rf passive functions
A method for producing one or more radio-frequency resonant patterns on a printed circuit includes a step of cutting one or more resonant patterns directly into the printed circuit whilst preserving means for mechanically securing the resonant patterns to said printed circuit. The method may be applied to the production...

06/12/14 - 20140158403 - Printed circuit board edge connector
A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact...

06/12/14 - 20140158404 - Printed circuit board edge connector
A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact...

06/12/14 - 20140158405 - Material for packaging electronic components
The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a...

06/12/14 - 20140158406 - Printed wiring board
An object of the present invention is to provide a printed wiring board which does not require arranging signal lines oblique to the warp or weft threads constituting a substrate and is capable of reducing a difference in transmission rates between the signal lines. The present invention relates to a...

06/05/14 - 20140151089 - Printed circuit board and method for manufacturing the same
Disclosed herein are a printed circuit board, including: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern...

06/05/14 - 20140151090 - Stress relief structure
A stress relief structure is provided. The stress relief structure includes a stress relief body, at least one first stress relief base and at least one second stress relief base. The stress relief body has an upper surface and a lower surface opposite to each other. The first stress relief...

06/05/14 - 20140151091 - Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same
Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the...

05/29/14 - 20140144674 - Electrical components and methods of manufacturing electrical components
An electrical component includes a substrate having a circuit area and a sacrificial area. A lift-off layer is deposited on the substrate in the sacrificial area. A seed layer is deposited on the substrate in the circuit area and on the lift-off layer in the sacrificial area. A plating layer...

05/08/14 - 20140124240 - Test card with a cuttable goldfinger structure
A test card includes a substrate and a goldfinger structure disposed on a side of the substrate. The goldfinger structure includes a first conductive section and a second conductive section. The first conductive section is inserted into a slot of a socket for electrically connecting to the socket. The second...

05/08/14 - 20140124241 - Touch structure and manufacturing method for the same
A touch structure and a manufacturing method for the same are provided. The touch structure comprises first patterned electrodes, a second patterned electrode, a dielectric structure and a conductive bridge. The second patterned electrode is disposed between the first patterned electrodes, and separated from the first patterned electrodes. The dielectric...

05/08/14 - 20140124242 - Wiring substrate
A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery...

05/08/14 - 20140124243 - Wiring substrate and display panel comprising same
A display panel (100) of an embodiment of the present invention includes a wiring board (100a), a counter substrate (100b) which is provided on a viewer side of the wiring board (100a), and a display medium layer (32) which is provided between the wiring board (100a) and the counter substrate...

05/08/14 - 20140124244 - Conductive plate and film exhibiting electric anisotropy
A method for making a conductive film exhibiting electric anisotropy comprises forming a nanomaterial on a substrate, the nanomaterial having a cluster of interconnected nanounits, each of which being substantially transverse to the substrate and having one end bonded to the substrate. The method further includes stretching the nanounits along...

05/01/14 - 20140116753 - Wiring board and method of manufacturing the same
There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns...

05/01/14 - 20140116754 - Conductive structure of transparent conductive film, transparent conductive film and preparation method thereof
The present invention discloses a conductive structure of a transparent conductive film, the transparent conductive film and a preparation method thereof, wherein the transparent conductive film has a single-sided double-layer conductive structure, which includes a first metal embedded layer embossed on the substrate or on the polymer layer on the...

04/17/14 - 20140102762 - Protective film for touch panel and method for manufacturing the same
According to exemplary embodiments, the protective film may reduce input errors by increasing touch sensitivity while protecting the touch panel....

04/17/14 - 20140102763 - Rigid flexible circuit board with impedance control
A rigid-flexible circuit board includes at least one flexible circuit board and at least one rigid circuit board. The flexible circuit board includes a flexible-board substrate, a plurality of flexible circuit board differential mode signal lines, at least one flexible circuit board grounding line, a flexible circuit board insulation layer...

04/17/14 - 20140102764 - Conductive laminate, transparent conductive laminate with patterned wiring, and optical device
In a conductive laminate, a transparent conductive thin film laminate 2 including at least two transparent conductive thin films and a metal layer 3 are formed in this order on at least one surface of a transparent base. In the transparent conductive thin film laminate 2, a first transparent conductive...

04/10/14 - 20140097002 - Electrical components and methods and systems of manufacturing electrical components
A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer...

04/10/14 - 20140097003 - Electrical components and methods and systems of manufacturing electrical components
A method of manufacturing an electrical component includes providing a substrate, applying an insulating layer on the substrate, applying a circuit layer on the insulating layer, irradiating the insulating layer with an electron beam to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform...