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Electricity: Conductors And Insulators > Conduits, Cables Or Conductors > Preformed Panel Circuit Arrangement (e.g., Printed Circuit) Preformed Panel Circuit Arrangement (e.g., Printed Circuit)Preformed Panel Circuit Arrangement (e.g., Printed Circuit) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/31/08 - 20080023216 - Method of forming low temperature cofired composite ceramic devices for high frequency applications and compositions used therein The invention relates to the use of and method of forming Low Temperature Cofired Ceramic (LTCC) circuits for high frequency applications. Furthermore, the invention relates to the novel LTCC thick film compositions and the structure itself. ... 01/17/08 - 20080011506 - Method of reducing noise induced from reference plane currents A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path references a voltage plane. The method further includes routing a second path for the electrical trace on the ... 01/10/08 - 20080006439 - Reference layer openings A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein. ... 01/03/08 - 20080000674 - Substrate-imprinting apparatus and methods A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may be formed by imprinting them simultaneously on one or both ... 12/20/07 - 20070289771 - Semiconductor device The present invention realizes high density mounting along with achieving power source sharing by a digital semiconductor element and an analog semiconductor element in a semiconductor device. An power layer for analog is connected to one end of an EBG layer, a power layer for digital is connected to the ... 11/01/07 - 20070251719 - Selective, hermetically sealed microwave package apparatus and methods A hermetically sealed package for an integrated circuit. In one exemplary embodiment, the package includes a dielectric substrate. At least one conductor is provided having a first conductor surface and a second conductor surface. The second conductor surface is disposed on the dielectric substrate. The first conductor surface comprises at ... 09/27/07 - 20070221399 - Electronic component and its manufacturing method An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The cap includes a top portion made of a flat ceramic member, and a leg portion made ... 09/20/07 - 20070215376 - Method for printing electrical and/or electronic structures and film for use in such a method The invention relates to a method for printing electrical and/or electronic structures, especially electrical conductors and/or electronic circuits onto a printing material, whereby the printing material is transported through a plurality of printing units of a printing machine that are disposed one after the other. A design of the electrical ... 08/30/07 - 20070199733 - Circuit board and method for manufacturing the same Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed ... 08/16/07 - 20070187136 - Printed circuit board, method of producing the same, and electronic unit A printed circuit board is disclosed that is able to prevent outflow of a potting resin out of a sealing region. The printed circuit board includes a conductive pattern formed on an insulating substrate, an electrode for connecting an electronic part to the conductive pattern, and a stripe-like resin-outflow-prevention dam ... 07/19/07 - 20070163801 - Patch panel with modules A patch panel includes a back plane having front mounted pairs of termination locations, and an interconnect location electrically connected to each pair of termination locations. The termination locations connect to two patch cords. The interconnect location defines an access device for selectively accessing the termination locations. An interconnect module ... 06/21/07 - 20070137886 - Method for partial replacement of a circuit board The present invention relates to a method for partial replacement of a circuit board, comprising: providing a first carrier board and a replaced board which has a second circuit board and a plurality of linkage arm which keeps the second circuit board at the replaced board; cutting a lifted board ... 05/31/07 - 20070119616 - Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor device A mounting substrate for mounting a semiconductor chip, having a plurality of passive elements which are connected to the semiconductor chip and are formed to be mutually electrically-independent, and a wiring part including a plurality of via plugs respectively independently connected to the plurality of passive elements and pattern wiring ... 05/31/07 - 20070119615 - Printed wiring board A printed wiring board including: a first VIA for allowing a second wiring to penetrate the printed wiring board from a front surface to a rear surface of the board; a second VIA for allowing the second wiring to penetrate the board from the rear surface to the front surface; ... 05/31/07 - 20070119614 - Wiring board and method for producing the same A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having ... 04/05/07 - 20070074895 - Printed circuit board and manufacturing method thereof A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof is disclosed. The printed circuit board manufacturing method includes the steps of: forming inner layer conductor circuits 32A on a core substrate 30; forming a recess part 31 on the core substrate ... 03/15/07 - 20070056764 - Transmission line apparatus A transmission line apparatus includes: a substrate 101 with a ground conductor plane; and first and second signal strips 102a, 102b supported on the substrate 101 in parallel with each other. The apparatus further includes at least one additional capacitance element 301 that connects the first and second signal strips ... 03/08/07 - 20070051534 - Wired circuit board The invention provides a wired circuit board that can prevent deterioration of a conductive pattern and short-circuiting of the conductive pattern. The wired circuit board is presented herein in the form of a suspension board with circuit which comprises an insulating base layer formed on a metal supporting board, a ... 03/08/07 - 20070051533 - Optical electronics integrated semiconductor package An optical electronics integrated semiconductor package is proposed. A circuit board with at least one through opening and at least one optical component with an active surface and a non-active surface opposite to the active surface are provided. The active surface has an optical activated area facing the through opening ... 02/15/07 - 20070034401 - Circuit board and manufacturing method thereof A circuit board may have a metal land supporting a pillar. The pillar may be fabricated by half-etching the metal land. An insulating layer may be provided on the circuit board so that the pillar of the metal land may be exposed through the insulating layer. ... 02/01/07 - 20070023202 - Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are ... 01/25/07 - 20070017694 - Wiring board and manufacturing method for wiring board The area of attaching portions 27b provided in the peripheral region of an insulating film 20 is made greater than that of attaching portions 27a provided in the inward region. In addition, the thickness of solder bumps 25b which are formed by providing solder to attaching portions 27b is made ... 01/25/07 - 20070017693 - Printed circuit board including pads with vacancies Methods and apparatuses for affecting the frequency behavior of connections within a printed circuit board or an integrated circuit are disclosed. Some embodiments include a printed circuit board comprising, a plurality of conductive layers each comprising at least one conductive pad, where each conductive pad on the conductive layers includes ... 01/04/07 - 20070000684 - Circuit board and visual inspection method of mount position of electronic component A circuit board is equipped with soldering lands for a hall element and visual inspection marks printed at a vicinity of the soldering lands. The visual inspection marks include a pair of slender marks arranged so as to sandwich the two soldering lands to which two terminal pins protruding from ... 12/28/06 - 20060289199 - Print wiring board The printed wiring board as claimed in any of claims 6 to 9, wherein the first interconnection pattern and the second interconnection pattern are formed meanderingly. ... 11/30/06 - 20060266544 - Printed circuit board (pcb) with electrostatic discharge protection A printed circuit board (PCB) with electrostatic discharge protection includes at least a lead wire having a first edge with an exposed copper, and a ground wire having a second edge with another exposed copper, in which the first edge faces the second edge with a predetermined spacing. By providing ... 11/16/06 - 20060254808 - Substrate precursor structures Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers a surface of the at least one aperture of the substrate blank. A mask pattern covers a portion of the at ... 10/19/06 - 20060231287 - Wiring structure and recording apparatus and electronic apparatus including wiring structure A wiring structure includes a substrate, a first circuit and a second circuit, provided on the substrate, a first wire, provided on the substrate, and connecting the first circuit and the second circuit, the first wire having a first length, and a second wire, provided on the substrate, and connecting ... 09/14/06 - 20060201701 - Circuit security A secure device (1) has a circuit board (2) with various exposed components such as an LCD (4) and keys (40). A secure circuit (10) is housed within an enclosure formed between the board (2) and a cover (11). The cover (11) has, on its inside surface, a security track ... 08/31/06 - 20060191707 - Circuit board and method for producing the same A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a ... 08/17/06 - 20060180340 - Printed-wiring board, printed-circuit board and electronic apparatus A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a ... 08/10/06 - 20060175081 - method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes ... 08/10/06 - 20060175080 - Conductive member, disk drive using same, and conductive member fabricating method Embodiments of the present invention provide a conductive member, in which electric characteristics can be improved by matching impedance all the way from a conductive wire to a pad. In one embodiment, a conductive member comprises: a back side metal layer; an insulating layer formed on the back side metal ... 08/03/06 - 20060169484 - Printed wiring board This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An outer edge of the pad ... 07/27/06 - 20060162955 - Test card assembly A space transformer and a method for making the space transformer. An electrically conductive material is placed in an inner region located in a silicon medium, the silicon medium defining both a first side and a second side at an outer region thereof Electrical contact is established between the electrically ... 07/20/06 - 20060157271 - Double-sided flexible printed circuits A double-sided flexible printed circuit comprises: an electrically insulating base; a first copper layer having a first conductive pattern; a second copper layer having a second conductive pattern, the second conductive pattern disposed offset from the first conductive pattern; and electrically insulating coverlays. A first area opposing a first contact ... 07/20/06 - 20060157270 - Printed wiring substrate and method for identifying printed wiring substrate A printed wiring substrate has a circuit wiring area that has a circuit wiring pattern formed thereon and a peripheral area that is placed in the periphery of the circuit wiring area. The peripheral area has a property display area that is provided with a display location specified in association ... 07/06/06 - 20060144616 - Printed circuit board with improved ground plane A ground plane of a printed circuit board (PCB) includes a number of tiles, wherein the tiles are so regularly arranged that no matter in which way a straight signal line segment is arranged on a signal plane of the PCB, a return current path on the tiles corresponding to ... 06/29/06 - 20060137902 - Semiconductor device and manufacturing method therefor A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central portion thereof; and a sealing resin configured to seal the semiconductor element in the cavity. A configuration is provided such that ... 06/29/06 - 20060137901 - Electronic device including a substrate structure and a process for forming the same An electronic device includes a first substrate including a first exposed conductor and a second exposed conductor. The electronic device also includes a second substrate and a conductive material that includes a first portion that contacts the first exposed conductor and a second portion that contacts the second exposed conductor. ... 06/22/06 - 20060131064 - Flexible printed wiring board An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist which would otherwise be caused during mounting of devices such ... 06/15/06 - 20060124346 - Current collection board for fuel cell A current collection board for a fuel cell is described. The current collection board includes a plate body having a substrate made of a printed circuit board, and at least one current collection circuitry disposed on the surface of the plate body. Furthermore, the current collection board is fabricated according ... 06/15/06 - 20060124345 - Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the ... 06/08/06 - 20060118328 - Printed circuit board and method of designing the same A printed circuit board (PCB) includes a base board, a conductive pattern arranged on the base board, and a number of metal pads arranged on the base board. The conductive pattern includes a number of vias and traces. The metal pads are evenly arrayed where there is a sparsity of ... 05/25/06 - 20060108142 - Vents with signal image for signal return path A method, structure, and method of design relating an electrical structure that includes a metal voltage plane laminated to a dielectric substrate. A determination is made as to where to place an opening for venting gases generated during fabrication of the dielectric laminate. An identification is made of a problematic ... 05/18/06 - 20060102382 - Manufacturing method of electronic part and wiring substrate A manufacturing method of an electronic part, comprises: sectioning a wiring substrate along a line intersecting a through hole, the wiring substrate having; a base substrate, a wiring pattern provided on a first surface of the base substrate, a reinforcement member provided on a second surface of the base substrate, ... 04/27/06 - 20060086532 - Pcb capable of releasing thermal stress A PCB comprises a slender substrate, a thermal compression area and at least a slit. The thermal compression area, placed on the slender substrate, has a plurality of bonding pads for a plurality of TCPs to be mounted thereon and a plurality of dummy pads placed between the TCPs. The ... 04/27/06 - 20060086531 - Electronic part manufacturing method and electronic part Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of ... 04/13/06 - 20060076157 - Hollow wire and method for making the same A hollow wire for enhancing the wires used in Liquid Crystal Display and a method for making the hollow wire which includes hollow portions in the wires so as to increase the cross sectional area and reduce the resistance. Isolation layer with low dielectric constant is filled in the hollow ... 04/06/06 - 20060070768 - Printed circuit board assembly A PCB assembly includes a main PCB having an accommodating slit part penetratingly formed therethrough and at least one main terminal part disposed at sides of the accommodating slit part, and a sub PCB having an inserting part which is insertable into the accommodating slit part, the sub PCB including ... 03/30/06 - 20060065431 - Self-reflowing printed circuit board and application methods A novel printed circuit board (PCB) 10 that incorporates embedded into its substrate an electric heater 14 is disclosed. This electric heater 14 becomes the only source of heat for simultaneously soldering components to pads 12. The PCB 10 is the key element that permits to create apparatuses and implement ... 03/23/06 - 20060060376 - Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies A substrate assembly is disclosed. The assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and defines a conductor plane. The structure further includes an oversized-in-diameter anti-pad formed through the substrate layer and the ... 03/16/06 - 20060054348 - Circuit substrate A circuit substrate comprising a base and a plurality of conductive traces is provided. The conductive traces are disposed on the base and on the same layer. The conductive traces include at least one first conductive trace. Wherein, the base has a cut region. The end of the first conductive ... 03/02/06 - 20060042824 - Printed wiring board and method of manufacturing the same A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion ... 03/02/06 - 20060042823 - Wired circuit board A wired circuit board which even when a conductive pattern is formed in the form of fine pitch can provide improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer, so as to prevent ... 03/02/06 - 20060042822 - Printed circuit board and inspection method therefor It is an object of the present invention to provide a printed circuit board and an inspection method therefor capable of electrically inspecting misregistration of a solder resist and a display by silk printing with respect to a wiring pattern on a printed circuit board. The present invention provides a ... 03/02/06 - 20060042821 - Memory modules and methods for manufacturing memory modules Memory modules and methods for manufacturing memory modules are disclosed herein. In one embodiment, a memory module includes a substrate, a microelectronic device carried by the substrate, and a plurality of external contact pads operably coupled to the microelectronic device. The substrate includes a first major surface with a first ... 02/16/06 - 20060032664 - Panel unit capable of avoiding contact between electrically conductive bodies thereon A first electrically conductive body and a first solid body are located on the same side of a first base member. A second electrically conductive body is located on a second base member at a position opposed to the first electrically conductive body. A second solid body is located on ... 02/09/06 - 20060027393 - Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a ... 01/12/06 - 20060005994 - Wiring board, method of manufacturing wiring board, and electronic device A method of manufacturing a wiring board includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink jetting so as to cover a part of the first wiring layer and expose an exposed section of the first ... 12/29/05 - 20050284653 - Condition display method and wiring board for wiring board design When designing and arranging an electronic part such as a PC card connector on a wiring board using a CAD device, it is an object of the present invention to provide a condition display method for a wiring board design with excellent practicability capable of efficiently arranging other electronic parts ... 11/03/05 - 20050241848 - Design and method for plating pci express (pcie) edge connector Embodiments of methods of plating a PCI Express edge connector are described. ... 10/27/05 - 20050236176 - Circuit board with identifiable information and method for fabricating the same A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit ... 10/06/05 - 20050217893 - Printed circuit board and manufacturing method thereof A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, ... 09/15/05 - 20050199421 - Printed circuit board and method of printing identification marks It is an object of the invention to provide a printed circuit board capable of easily connecting a plurality of ground patterns corresponding to a plurality of circuit blocks, and of easily selecting the combination of the connection of the plurality of ground patterns. The printed circuit board comprises a ... 09/15/05 - 20050199420 - Circuit board and method for manufacturing the same In a circuit board according to the present invention, on a substrate, in at least a portion of a phase change layer including a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, a conductive path is formed that has ... 09/15/05 - 20050199419 - Pcb based band-pass filter for cutting out harmonic of high frequency The present invention is to provide a PCB based band-pass filter for cutting out harmonic of high frequency wherein in manufacturing a circuit board of a wireless communication product technology of PCB production is utilized to mount an input microstrip line, an output microstrip line, an open circuit microstrip line, ... 09/08/05 - 20050194179 - Method for reducing voltage drop across metal lines of electroluminescence display devices A conducting device for a display device is disclosed. It comprises one or more non-conducting base lines formed in predetermined locations on a substrate layer, and one or more conducting line structures formed over the non-conducting base lines on the substrate layer, wherein the non-conducting base lines raise the conducting ... 08/25/05 - 20050183882 - Multi-layer circuit board with thermal diffusion and method of fabricating the same A multi-layer circuit board having an improved heat spreading performance is described. In a multi-layer circuit board structure configured such that insulating layers and interconnection conductive layers are alternately stacked, the interconnection conductive layers include a top interconnection conductive layer having a main surface on which circuit elements are mounted, ... 08/18/05 - 20050178582 - Circuit board with mounting pads for reducing parasitic effect A circuit board with mounting pads is described for improving the frequency response of routing traces. The present invention is used to etch an etching hole on ground layer corresponding to the surface-mounted devices (SMD) on a routing layer and therefore the parasitic effect from the stray capacitor is reduced, ... 08/18/05 - 20050178581 - Underfilling efficiency by modifying the substrate design of flip chips A substrate structure comprising a substrate; a solder mask is formed over the substrate; and a metal trace structure formed within the solder mask. The metal trace structure including a channel therein for the receipt of underfill. The metal trace structure further including a central portion with arms radiating outwardly ... 08/11/05 - 20050173151 - Substrate with via and pad structures This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a ... 08/11/05 - 20050173150 - Multi-layer printed board A multi-layer printed board including signal layers, each signal layer including a signal line, a through-hole, and a ground through-hole. The signal layer includes a land connecting the through-hole and the signal line. An external periphery of the land has a first portion farthest from a center of the land, ... 08/04/05 - 20050167154 - Printed wiring board The printed wiring board includes a substrate, an electrically conductive pattern formed on the substrate, and an electrical insulator covering the substrate and the electrically conductive pattern therewith, wherein a region of the electrically conductive pattern exposed through an opening formed throughout the electrical insulator is used as the pad, ... 07/28/05 - 20050161251 - Hybrid integrated circuit device and method of manufacturing the same To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a hybrid integrated ... 07/28/05 - 20050161250 - Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board A wiring circuit pattern of this invention is formed by forming a resin resist pattern film on a conductor layer of a base of a printed circuit board in which at least an insulating layer and the conductor layer are stacked on at least one surface of the base, and ... 07/21/05 - 20050155787 - Transparent small memory card A small memory card of present invention includes a substrate and at least one memory chip package, the substrate is formed with a placed region, a first terminal and a second terminal, the first terminal is formed with a plurality of golden fingers, the second terminal is formed with a ... 07/07/05 - 20050145413 - Method for fabricating a warpage-preventive circuit board A warpage-preventive circuit board and method for fabricating the same is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a plurality of discontinuous dummy circuit regions are disposed on the surface of the electrically-insulative core layer at area free of ... 07/07/05 - 20050145412 - Circuit carrier and package structure thereof A circuit carrier is provided. The circuit carrier comprises a substrate, a patterned circuit layer, and a solder mask layer. The patterned circuit layer is deposed on a surface of the substrate and has two passive component electrode pads. The solder mask layer covers the surface of the substrate, and ... 07/07/05 - 20050145411 - Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects The aim of the invention is to provide positioning and mounting options with improved handling characteristics even at places that are difficult to access or in other difficult conditions. Said aim is achieved by using functional elements comprising at least one area that can be foamed by supply energy. At ... 06/23/05 - 20050133249 - Printed wiring board and semiconductor device A printed wiring board has a large number of wirings formed substantially parallel to one another, a dummy pattern is formed along the wirings and a solder resist layer is formed by coating the wirings and the dummy pattern with a solder resist. The coating thickness of said solder resist ... 06/09/05 - 20050121224 - Circuit board having deposit holes The present invention relates to the structural design of a circuit board having deposit holes. The design is to allocate one or more deposit holes that are either caved in or penetrate through the board at locations specified by the spatial layout, as well as to set step-like holes on ... ### FreshPatents.com Support |