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Heat Exchange > Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat > Liquid Fluent Heat Exchange Material > Cooling Electrical Device Cooling Electrical DeviceCooling Electrical Device patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/31/08 - 20080023178 - Liquid cooling unit and heat exchanger therefor A heat exchanger allows establishment of first and second flat spaces, namely parallel flat spaces along a reference. The heat exchanger is inserted in a closed circulating loop for coolant. The first and second flat spaces have a cross-section larger than that of a cylindrical duct of the closed circulating ... 01/31/08 - 20080023177 - Electric motor with heat pipes An electric motor including a motor portion, a cooling portion and a plurality of heat pipes. The motor portion includes a stator and a rotor that when energized with electric current causes the rotor to rotate. The motor portion comprises a motor frame that encloses the rotor and stator from ... 01/17/08 - 20080011459 - Thermally conductive cover directly attached to heat producing component One embodiment of the apparatus may have: thermally conductive cover coupled to the heat producing component via a single interface; and cooling liquid in direct contact with the thermally conductive cover. One embodiment of the method may have the steps of: coupling a thermally conductive cover to the component via ... 11/29/07 - 20070272395 - Heat dissipation device A heat dissipation device includes a thermal attach block (10), a heat pipe (30) thermally attached to the block, and a fin unit (90) thermally attached to the heat pipe. The block includes a curve-shaped bottom surface (124) allowing it to be thermally attached to a heat generating component (80) ... 11/29/07 - 20070272394 - Method for cooling coils and shim iron A cooling system for electrical coils, such as a coil in a magnetic resonance tomography apparatus, has a heat dissipation device with a fluid and a tempered reservoir for the fluid. The fluid is thermally coupled to the coil and the tempered reservoir is temperature-regulated to maintain the fluid at ... 11/15/07 - 20070261822 - Heat-dissipating device having air-guiding structure A heat-dissipating device having an air-guiding structure includes a heat-conducting seat, a fin assembly, at least one heat pipe for serially connecting to the fin assembly and the heat-conducting seat, and a wind force unit. The fin assembly is positioned above the heat-conducting seat and formed by arranging a plurality ... 11/01/07 - 20070251675 - Thermal module A thermal module (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12), and a heat pipe (14) including an evaporator section (141) and a curve shaped condenser section (142). The evaporator section of the heat pipe thermally contacts with the heat-generating electronic component, and the ... 10/25/07 - 20070246197 - Low profile thermosiphon A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is ... 10/25/07 - 20070246196 - High performance thermosiphon with internally enhanced condensation A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may ... 10/25/07 - 20070246195 - Orientation insensitive thermosiphon with squirrel cage configuration An orientation insensitive heat exchanger assembly includes a housing having an upper portion including condensing tubes extending upwardly and intersecting a top wall of the lower portion. The condensing tubes are spaced equally from one another circumferentially and radially from the central axis and extend outwardly at a predetermined angle ... 10/11/07 - 20070235166 - Handle arrangement with integrated heat pipe Handle arrangements having an integrated heat pipe for use with a portable electronic device are presented including: a heat pipe, the heat pipe configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion; a handle disposed along an edge of the portable electronic device, the ... 10/04/07 - 20070227705 - Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components An electronic apparatus includes a main unit, support unit and display unit. The main unit has a heat-receiving portion thermally connected to a heat-generating component. The support unit has first and second edges. The first edge is coupled to the main unit. The second edge is located opposite to the ... 09/20/07 - 20070215327 - Heat dissipation device A heat dissipation device includes a heat sink (30) and a heat pipe (40) thermally attached to the heat sink. The heat sink includes a base (32) with an opening (3262) defined therethrough, and a plurality of fins (36) mounted on the base. The heat pipe comprises an evaporating portion ... 08/02/07 - 20070175616 - Loop heat pipe A loop heat pipe includes an evaporator and a sealed pipe. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, the sealed pipe includes at least ... 07/26/07 - 20070169919 - Heat pipe type heat dissipation device A heat pipe type heat dissipation device for an electronic component comprises a base, a bended heat pipe with an evaporating portion connected to the base and at least one condensing portion extending from the evaporating portion, and at least two heat sinks thermally combined together and sandwiching the condensing ... 07/26/07 - 20070169918 - Combination cooler module A combination cooler module is disclosed, which includes a plurality of radiating fins that are arranged in a stack, a plurality of heat tubes inserted through the radiating fins, and a heat conductive base affixed to the radiating fins by means of a dovetail joint, hook or scarf joint and ... 07/05/07 - 20070151712 - Heat sink for distributing a thermal load A heat sink for distributing a thermal load is disclosed that includes a base receiving the thermal load, the base having a front surface, a back surface, an inner surface, and an outer surface, the outer surface shaped generally as a cylinder and having a flat mounting region, and the ... 07/05/07 - 20070151711 - Heat sink and method for manufacturing the same A heat sink and a method for manufacturing the same. The heat sink is used to contact on a heat-generating source of an electronic device. The heat sink comprises a heat-conducting member and at least one heat pipe. With the bottom edge of a heat-absorbing end of the heat pipe ... 06/28/07 - 20070144710 - Method for manufacturing heat pipe cooling device A method for manufacturing a heat pipe cooling device. The heat pipe cooling device includes a U-shaped heat pipe, which is embedded within a heat conductor. The heat conductor includes a rectangular base and an upper cover connected to the base. The base includes many retaining grooves which allow the ... 06/28/07 - 20070144709 - Heat dissipation device with heat pipes A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting to a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set therebetween and thermally ... 06/21/07 - 20070137838 - Heat sink for distributing a thermal load A heat sink for distributing a thermal load is disclosed that includes two or more base plates connected and oriented around a central axis of the heat sink, at least one base plate receiving the thermal load, each base plate having thermal transport paths, the thermal transport paths oriented among ... 06/14/07 - 20070131390 - Heat dissipating module and method of fabricating the same A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin ... 06/14/07 - 20070131389 - Heat dissipating device and method of fabricating the same A heat dissipating device includes thermal conductive pipes and a plurality of thermal fin modules. Each thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. A retainer is located between each two thermal fin modules to compress the thermal fin module, so that a ... 06/07/07 - 20070125524 - Hybrid heat sink with recirculating fluid and interleaving fins A method and incorporated hybrid air and liquid cooled heat sink that is provided for cooling electronic components. The heat sink comprises a finned structure having fins positioned for air to pass easily through them. The finned structure is flanked by a heat source plate on one side (closer to ... 06/07/07 - 20070125523 - Low profile liquid cooled server heat sink A computer assembly including a casing having a bottom and end walls and side walls and a lid and a variety of computer components are supported on the bottom. A partition extends between the side walls and a plurality of fans is disposed in the partition for moving air through ... 05/31/07 - 20070119575 - Synthetic jet heat pipe thermal management system A thermal management system (201) is provided which comprises a first heat spreader (205) comprising a heat pipe material, a plurality of fins (217) disposed on said first heat spreader, and a synthetic jet actuator (209) adapted to direct a synthetic jet between at least a pair of said plurality ... 05/24/07 - 20070114009 - Heat dissipation device A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and ... 05/17/07 - 20070107880 - Heat sink structure The invention relates to a heat sink structure, which includes a central heat conducting body having a plurality of cooling fins extending from the periphery of the central heat conducting body, a through hole therein penetrating both sides thereof, and a cover plate and a bottom plate enclosing both openings ... 05/03/07 - 20070095510 - Heat-pipe type heat sink A heat-pipe type heat sink (10) includes a plurality of fins (140) each defining at least a through hole (143) therein, at least a heat pipe (16) extending through the through holes of the fins, and soldering material filled in spaces formed between the heat pipe and the fins. A ... 05/03/07 - 20070095509 - Heat dissipation having a heat pipe A heat dissipation device includes a heat sink (10) and a heat pipe (20). The heat sink includes a base (12), a fins group (16) extending from the base, and a cover (14) contacting with the fins group. The heat pipe surrounds top and bottom and two opposite sides of ... 05/03/07 - 20070095508 - Heat dissipation device having louvered heat-dissipating fins A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of spaced fins, a first end and a second end opposite to the first end. Pluralities of passages are defined between the fins and extending from the first end ... 04/05/07 - 20070074857 - Heat sink with heat pipes A heat sink with heat pipes includes a base (10). The base includes a bottom surface contacting a heat-generating component (40), an upper surface opposite to the bottom surface, and a plurality of grooves (14) defined on the upper surface of the base. The heat sink further includes two heat ... 04/05/07 - 20070074856 - Multi-layered micro-channel heat sink The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the channels decreasing in ... 04/05/07 - 20070074855 - Liquid cooling device A liquid cooling device (10) includes a heat sink (12), a panel (14) distant from the heat sink, a heat transfer member includes a heat exchanger (22) thermally engaging with the heat sink and at least one heat pipe (24), a duct (16) connecting with the panel, a flexible tube ... 03/29/07 - 20070068658 - Heat pipe type cooler To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler ... 03/22/07 - 20070062676 - Heat sink module A heat sink module includes a base having a metal heat dissipating fin set, and the base includes a planar base member comprised of a plurality of graphite layers, and said planar base member embeds a vertical insert having a high thermal conductivity, and the insert comprises a graphite compound ... 03/08/07 - 20070051501 - Heat dissipation device A heat dissipation device includes a base (10), a first heat sink (20) disposed on the base (10), a second heat sink (30) attached on top of the first heat sink and a first heat pipe (40) connecting the base and the first heat sink and a pair of second ... 03/08/07 - 20070051500 - Magneto-hydrodynamic heat sink A heat sink uses a pump assembly to generate a radial magnetic field. Pipes arranged to house a portion of a first channel and a portion of a second channel are formed in the heat sink. The direction of fluid flow in the first channel and the direction of fluid ... 03/01/07 - 20070044944 - Radiator module structure A radiator module structure includes at least a heat guide pipe, a frame member, a fan and at least two cooling fin sets. The guide pipe has a heat receiving section joined to a base and at least two heat dissipation sections extending upward and being away the base. The ... 03/01/07 - 20070044943 - Liquid cooling device A liquid cooling device (10) includes a heat sink (12), a reservoir (14) distant from the heat sink, a duct (16) connecting with the reservoir, a flexible tube (18) connected to the duct and the heat sink, and a heat-transfer member (19) in the liquid cooling device. The liquid cooling ... 03/01/07 - 20070044942 - Bottom plate of a radiator for a cpu A bottom plate of a radiator for a CPU in a computer includes a lower surface contacting with the CPU and an upper surface provides elongated protrusion parts and elongated grooves corresponding to a heat pipe. The radiator further includes a cooling core composed of a plurality of cooling fins, ... 02/22/07 - 20070039720 - Radial flow micro-channel heat sink with impingement cooling A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins ... 02/15/07 - 20070034360 - High performance cooling assembly for electronics An assembly for high performance cooling of electronics is described that includes a container for heat transfer liquid in which complex electronic assemblies are immersed. The electronics are sealed inside the liquid container such that an electrical connector protrudes to the exterior of the container. A thermally conductive plate is ... 02/08/07 - 20070029072 - Heat dissipation device A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a ... 02/08/07 - 20070029071 - Thermal module A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another side opposite to the one side of the base plate, and ... 01/18/07 - 20070012429 - Heat transfer device A heat transfer device includes a vapor chamber that houses a phase change material such as water. The heat transfer device may be selectively formed from a combination of polymeric and non-polymeric materials. In one embodiment, the vapor chamber is formed from a polymer layer surrounding a sealing layer formed ... 01/18/07 - 20070012428 - Heat dissipation device with heat pipe A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The ... 01/11/07 - 20070006997 - Heat sink structure A heat sink has a first vent and a second vent. The heat sink includes at least a first heat-dissipating fin having a first wall positioned at the first vent. ... 01/11/07 - 20070006996 - Cooler for electronic equipment [Means for Solving Problems] A cooling device includes first and second cooling panels (1, 2) wherein a passage (11, 21) is formed by bonding together a top heat radiation panel and a bottom heat radiation panel each having a groove therein, and a circulation pump (3) for circulating refrigerant within ... 01/04/07 - 20070000648 - Systems for low cost coaxial liquid cooling According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis. ... 01/04/07 - 20070000647 - Systems for integrated cold plate and heat spreader According to some embodiments, systems for an integrated cold plate and heat exchanger may be provided. In some embodiments, a device may comprise a cold plate to transfer heat to a fluid and a heat spreader integral with the cold plate, the heat spreader to accept heat from an electronic ... 01/04/07 - 20070000646 - Heat dissipation device with heat pipe A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes ... 12/28/06 - 20060289150 - Heat dissipation device A heat dissipation device includes a heat sink (10) and at least a serpent heat pipe (22). The heat sink (10) comprises a base (12) contacting with an electrical component, a heat dissipation fins group (14) secured to the base (12) and a cover (16) attached to a top of ... 12/28/06 - 20060289149 - Heat dissipating device with heat reservoir A heat dissipating device includes a heat sink (10), a heat pipe (20), a heat reservoir (30) thermally connecting with the heat sink through the heat pipe, and a fan (40) generating an airflow through the heat sink. The heat pipe includes an evaporating portion (202) attached to the heat ... 12/21/06 - 20060283579 - Integrated liquid cooled heat sink for electronic components A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper portion of the cooling housing from the lower ... 12/14/06 - 20060278375 - Heat sink apparatus with operating fluid in base thereof An exemplary heat sink apparatus (10) includes a base (12) and a number of fins (14) extending from an upper external first surface (124) of the base. The base defines a sealed cavity (122) therein. Operating fluid (18) is filled in the cavity. The operating fluid is liquid form. In ... 12/14/06 - 20060278374 - Heat dissipation device A heat dissipation device includes a fin unit (50), and at least a heat pipe (30) including an evaporating section (32) and at least a condensing section (34) extending through the fin unit. The fin unit includes a plurality of fins stacked together. Each fin comprises a wavy and a ... 12/14/06 - 20060278373 - Microchannel cooling device with magnetocaloric pumping The invention discloses a microchannel cooling device, adapted for dissipating heat generated from an electronic device, which comprises: a heat sink, being arranged on the electronic device and having an inlet, an outlet and a plurality of microchannels embedded thereon for receiving a ferrofluid to flow therein; a condenser, having ... 12/14/06 - 20060278372 - Heat dissipation device A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member (10) thermally connecting ... 12/14/06 - 20060278371 - Compliant thermal interface structure with vapor chamber A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one spring element comprises a spring portion, provides a ... 12/14/06 - 20060278370 - Heat spreader for cooling electronic components A unitary heat spreader for cooling electronic components comprising an evaporator section comprising a plate configured for heat exchange communication with electronic components and a plurality of elongated evaporator channels therein, and a liquid phase-change refrigerant in the evaporator channels, and first and second condenser sections configured to substantially avoid ... 12/07/06 - 20060272799 - Supporting seat for supporting weight of heat dissipating fins to avoid deformation of heat dissipating tubes extending through the heat dissipating fins A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to engage with a bottom ... 12/07/06 - 20060272798 - Loop-type heat exchange device A loop-type heat exchange device (10) includes an evaporator (20), a vapor conduit (30), a condenser (50) and a liquid conduit (70). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condenser includes a housing ... 11/30/06 - 20060266500 - Heat dissipating apparatus A heat dissipating apparatus (10) includes a base (20), a plurality of stacked fins (30), and at least a heat pipe (40). The base absorbs heat from a heat-generating component. Each of the fins includes a main body (32), and a plurality of projection members (33) extending from the main ... 11/23/06 - 20060260787 - Flattened contact cooling module A flattened contact cooling module for cooling an electronic element. The cooling module has a reduced height (thickness), such that the overall thickness of an electronic product is reduced. The cooling module includes a heat conducting plate having a sagged portion, an elastic member disposed on the heat conducting plate, ... 11/16/06 - 20060254755 - Radiation board A radiation board consists of a case and a lid. The case has a plurality of circulation channels formed on an inner wall. The lid seals the case to confine an operation fluid in the circulation channels of the case. The lid has miniature flutes corresponding to the circulation channels. ... 11/16/06 - 20060254754 - Panel-type radiating system A panel-type radiating system includes a panel being provided on at least one side with a plurality of fins, and a plurality of heat conducting tubes having a heat-dissipating end and a heat-absorbing end each. The heat-dissipating ends of the heat conducting tubes are connected to the fins, and are ... 11/09/06 - 20060249280 - Electronic device with improved cooling mechanism An electronic device includes a substrate, a processor, and a cooling mechanism. The processor is disposed on the substrate. The cooling mechanism includes a conductive medium, a cooling plate and a protrusion. The conductive medium contacts the processor. The cooling plate contacts the conduction medium. The protrusion protruding from the ... 11/02/06 - 20060243428 - Heat pipe heat exchanger and method of fabricating the same A heat pipe heat exchanger and a method for fabricating the same are disclosed. A heat pipe heat exchanger 1 is provided with a heat pipe 2, and a heat block 3 having a heat pipe-holding hole 3A, and a fin 4 having a fin base portion 4A, to which ... 11/02/06 - 20060243427 - Heat pipe heat sink and method for fabricating the same A heat pipe heat sink and a method for making the same are disclosed. A heat pipe heat sink 1 has a heat block 2 which is heat exchangeably mounted to a heat exchange object, and the heat block 2 is composed of a first heat block unit 5 and ... 10/26/06 - 20060237169 - Aerodynamically enhanced cooling fan A cooling fan comprising a fan housing that connects to a chassis supporting an electronic device. A motor is disposed within the fan housing. A blade assembly is rotatably coupled to the motor. The fan housing has a length at least 10 mm longer than a distance between a leading ... 10/26/06 - 20060237168 - Air mover with thermally coupled guide vanes An air mover comprising a housing and a plurality of blades rotatably disposed within the housing. A plurality of guide vanes are fixed within the housing. The guide vanes are thermally coupled to an electronic component such that heat generated by the electronic component is transferred through the guide vanes ... 10/19/06 - 20060231238 - Integrated thermal exchange systems and methods of fabricating same Thermal exchange systems integrate a thermal transfer unit (22); a fluid cooling assembly (24); a pump (26); and a fan (28). The thermal transfer unit (22) interfaces with a body to be thermally conditioned and transfers thermal energy to a fluid. The fluid cooling assembly (24) cools the fluid obtained ... 10/05/06 - 20060219392 - Heat dissipating apparatus A heat dissipating apparatus (10) includes a plurality of fins (20) stacked together along a predetermined direction, and a plurality of projection members (23) extending from each fin. Each of the fins includes a main body (22). The main bodies of two adjacent fins define an air passage (29) therebetween. ... 09/28/06 - 20060213648 - Method for manufacturing heat dissipation apparatus A method for manufacturing a heat dissipation apparatus comprises the following steps: A substrate is provided. A pressure is exerted on the substrate by a roller mold to form a plurality of grooves on one surface of the substrate. A sealed chamber is formed out of the substrate so that ... 09/21/06 - 20060207752 - Micro liquid cooling device A micro liquid cooling device including a radiator, a thermal conductor, an actuator, and a circular path is proposed. The actuator includes a cavity sealed with a thin film, an inlet diffusion port connected to the cavity, an outlet diffusion port connected to the cavity, a magnetic body connected to ... 09/14/06 - 20060201657 - Heat-dissipating fin set in combination with thermal pipe A heat-dissipating fin set in combination with thermal pipe includes a plurality of fin plates and each of the fin plates has at least one closed through hole at same location. Each of the thermal pipe passes through the through hole. Each of the fin plate has an accommodating section ... 09/07/06 - 20060196643 - Cooling system and electronic apparatus A cooling system includes a heat receiving portion thermally connected to a heating element, a heat radiating portion which radiates a heat of the heating element, and a circulation path circulating a liquid coolant between the heat receiving portion and the heat radiating portion. The circulation path includes a reservoir ... 08/31/06 - 20060191669 - Liquid-cooled heat dissipation module A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump; and a guide part disposed ... 08/31/06 - 20060191668 - Radiator An improved radiator includes a casing unit, a fan unit, a power component, a fin unit, a conductive plate and a heat guiding pipe. The casing unit provides a front shield and a rear cover. The fan unit is received in the front shield and provides a swirl blade and ... 08/24/06 - 20060185831 - Heat exchanger assembly A heat exchanger assembly for use in an electronic assembly having a heat source comprises a heat transfer section and heat dissipation fins. The heat transfer section includes a first portion attachable to the heat source and a second portion extending away from the first portion. The heat dissipation fins ... 08/24/06 - 20060185830 - Cooling plate module A cooling plate module includes a cooling plate and a liquid driving module. The liquid driving module includes an accommodation chamber and a liquid driving unit used to driving cooling liquid. The liquid driving module includes a liquid inlet communicated to the accommodation chamber and a first liquid outlet is ... 08/24/06 - 20060185829 - Liquid-cooling heat dissipation apparatus A liquid-cooling heat dissipation apparatus includes a casing, a first compartment defined in the casing for assembling a liquid driving unit, a cooling plate module on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling ... 08/17/06 - 20060180297 - Conductor pipe of a temperature conductor The conductor pipe of a temperature conductor generally includes a conduction seat frame and a complex group of conductor pipes. And, the conduction seat frame is provided with an expanded surface and a narrow surface, whereas a mounting surface at one side can be mounted onto some heating units. The ... 08/10/06 - 20060175046 - Heat dispensing device A heat dispensing device includes a tubular body with a contact end and a dispensing end. A plurality of fins is integrally connected on outside of the dispensing end so as to increase the area for dispensing heat. The heat is absorbed from the contact end and quickly and directly ... 08/10/06 - 20060175045 - Heat dissipation device An integrated heat dissipation device includes a heat sink portion having a base with a plurality of posts formed thereon, a fin portion with a plurality of stacked fins, individually formed over the heat sink portion, and at least two L-shaped heat pipes installed in the heat sink portion and ... 08/03/06 - 20060169440 - Methods and apparatus for an integrated fan pump cooling module An integrated fan pump includes a fan, a pump, and an electrical drive mechanism such as an electric motor configured to simultaneously drive both the fan and pump with respect to the housing. A heat exchanger is preferably connected to the pump and the component to be cooled. In one ... 07/20/06 - 20060157230 - Cooling device A cooling apparatus includes a heat receiving casing thermally joined to a heating object directly or indirectly, a first device having hoses which communicate inside of the heat receiving casing, a fluid medium inside the heat receiving casing and in the hoses. The cooling apparatus also includes a solution sending ... 07/06/06 - 20060144574 - Chemically compatible, lightweight heat pipe The present invention provides an apparatus including a magnesium alloy vessel that is substantially free of aluminum and zinc, but including magnesium in combination with a gettering metal and a method for making such apparatus. The magnesium alloy vessel has a hollow interior cavity containing a working fluid, with a ... 07/06/06 - 20060144573 - Cooling device and electronic device In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on another side of the heat pipe, a first fan unit that sends an airflow to ... 07/06/06 - 20060144572 - Heat dissipating device A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20) and a second heat sink (22). The first heat ... 07/06/06 - 20060144571 - Isothermal plate assembly with predetermined shape and method for manufacturing the same An isothermal plate assembly with predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation space is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. ... 07/06/06 - 20060144570 - Systems for low cost liquid cooling According to some embodiments, systems for low cost liquid cooling may be provided. In some embodiments, a system may comprise a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends, a plurality of fins extending outwardly from ... 07/06/06 - 20060144569 - Systems for improved heat exchanger According to some embodiments, systems for an improved heat exchanger may be provided. In some embodiments, a heat exchanger may comprise a core defining a cavity, a plurality of fins extending outwardly from the core, and an element disposed within the cavity of the core, wherein the element is to ... 07/06/06 - 20060144568 - Systems for integrated pump and cold plate According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move ... 06/29/06 - 20060137863 - Liquid cooling device A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank ... 06/29/06 - 20060137862 - Heat dissipating device with metal foam A heat dissipating device for removing heat from a heat-generating electronic component includes at least one heat transfer device and metal foams combined to the heat transfer device. The heat transfer device may be a heat pipe. The heat generated by the electronic component is transferred to the metal foams ... 06/29/06 - 20060137861 - Heat dissipation device A heat dissipation device for electronic devices on a substrate comprises a base contacting one of the electronic devices for absorbing heat therefrom. A plurality of fins arranged on the base for dissipating heat. A plurality of airflow channels is defined between the fins, and each channel defines an intake ... 06/29/06 - 20060137860 - Heat flux based microchannel heat exchanger architecture for two phase and single phase flows An apparatus, system, and method to cool a non-uniform heat source using a micro-channel heat exchanger. ... 06/22/06 - 20060131003 - Apparatus and associated method for microelectronic cooling An apparatus and associated method to provide liquid cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling solution including Potassium Formate in combination with inhibitors is processed through a cooling system to remove heat from a microelectronic device. ... 06/08/06 - 20060118280 - Cooling device incorporating boiling chamber A cooling device includes a boiling chamber containing working fluid therein. The chamber includes a bottom wall for contacting with a heat generating component and a cover hermetically connected with the bottom wall. The cover includes a top wall and a bulge formed at a periphery thereof. The bulge includes ... 06/08/06 - 20060118279 - Water cooling system for computer components The water cooling system for computer components is a system for removing heat from the heat-producing components of a computer, or other electronic, system. The water cooling system for computer components employs one or more water-block type heat exchangers to remove heat from electronic circuit components, transferring heat to a ... 06/01/06 - 20060113066 - Heat exchanger configuration for pumped liquid cooling computer systems A cooling system using counter-flow air and fins with thermal isolation sections is disclosed. The cooling system includes a pump and a liquid coolant. Counter-flow air is applied in a direction generally opposite to a direction of the liquid coolant. The thermally isolation fins help reducing conduction of heat. ... 05/25/06 - 20060108104 - Heat-dissipating fin set in combination with thermal pipe A heat pipe structure, having a tubular member, a support member and a wick structure. The tubular member is hollow to accommodate the support member and the wick structure therein. The wick structure is located between the tubular member and the support member. The wick structure is supported by the ... 05/18/06 - 20060102326 - Cooling device of electronic device A disclosed cooling device of an electronic device includes a cooling section thermally connected to the heat-generating electronic device so as to cool the electronic device with cooling water forcibly supplied from a pump, and a heat exchanging section thermally connected to the cooling section to radiate heat transferred from ... 05/18/06 - 20060102325 - Guiding fin heat sink The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating ... 05/18/06 - 20060102324 - Cooling device using multiple fans and heat sinks The present invention is directed to a method of constructing a semiconductor chip cooling device consists of multiple fans and heat sinks to provide redundant cooling capability. Heat coming from a semiconductor chip is first distributed to several heat sinks using multiple heat pipes. The heat sinks are placed around ... 05/18/06 - 20060102323 - Radially shaped heat pipe A radial heat pipe is disclosed. In one embodiment, the radial heat pipe is to be wrapped around a perimeter edge of a thermally conductive member, the heat pipe having a circular shape, the heat pipe having a cross-section radius equal to or less than a height of the thermally ... 05/11/06 - 20060096743 - Liquid cooling device A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a base (11) and a liquid inlet port (18) in communication with the container (14). The base (11) comprises a heat-absorbing surface and a rough surface for exchanging heat with liquid, and the rough ... 05/11/06 - 20060096742 - Cooling assembly with sucessively contracting and expanding coolant flow A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear ... 05/11/06 - 20060096741 - Twin fin arrayed cooling device with heat spreader A cooling device including a split-core with a plurality of twin fins connected with a plurality of grooves on the split-core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the ... 05/04/06 - 20060090885 - Thermally conductive channel between a semiconductor chip and an external thermal interface An apparatus is described comprising a chamber containing liquid. A side of the chamber is thermally coupled to a semiconductor chip. The side of the chamber has thermally conductive carbon nanotubes oriented perpendicular to the side's surface. The carbon nanotubes transfer heat drawn from the semiconductor chip into the liquid, ... 04/27/06 - 20060086484 - Twin fin arrayed cooling device with liquid chamber A cooling device for dissipating heat from a component is disclosed. The cooling device includes a core with a plurality of twin fins connected with the core and a liquid chamber in thermal communication with the component. The liquid chamber includes a reservoir with a liquid therein and the core ... 03/30/06 - 20060065386 - Self-actuating and regulating heat exchange system A self-actuating and self regulation heat exchange system comprising: evaporator 16, condenser 34, bladder sub-system 42, phase-change fluid 24 and connecting tubes, is a device and an apparatus useful to transport thermal energy from a relatively hot zone to a relatively cold zone, over distance, and around or through obstructions. ... 03/23/06 - 20060060333 - Methods and apparatuses for electronics cooling Methods and apparatuses for cooling a device are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid that near or above its critical pressure and at least one heat exchanger. At least two configurations are disclosed: ... 03/23/06 - 20060060332 - Heat dissipating device A heat dissipating device for a CPU includes a chassis (10), a heat sink (20), a fan cover (50) and a fan (60). The heat sink includes a coin-shaped connecting piece (22) and a plurality of cooling fins (30) arranged radially and defining an inter space for receiving the connecting ... 02/23/06 - 20060037739 - Circulation-type liquid cooling apparatus and electronic device containing same A cooling apparatus comprises a tank for keeping a coolant liquid therein and having an air layer, a heat receiving element in contact with a heat generating part to receive heat therefrom, a radiator for radiating heat absorbed by a coolant liquid, and a circulating mechanism for circulating the coolant ... 02/23/06 - 20060037738 - Heat-dissipating device with heat pipe A heat-dissipating device with heat pipe includes a base having a plurality of pipe spaces therein; a plurality of heat pipes vertically mounted on the base and connected to the pipe spaces respectively; a working fluid filled in the pipe spaces; and a plurality of heat-dissipating fins attached to the ... 02/16/06 - 20060032617 - Heat sink electronic components A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having ... 02/16/06 - 20060032616 - Compound heat-dissipating device A compound heat-dissipating device is used to help a chip or a CPU to dissipate excessive heat. The compound heat-dissipating device has two heat sinks, two fans respectively arranged on the two heat sinks, and a heat pipe connected between the two heat sinks for increasing efficiency of heat dissipation. ... 02/02/06 - 20060021740 - Vacuum condenser heat sink The Vacuum Condenser Heat Sink has many thin metal fins on the top, which makes it easier for the fan to blow way the heat. But the key to this heat sink is that there is a mini condensation cycle inside the heat sink that speeds up the heat transfer ... 02/02/06 - 20060021739 - Method and system for evaluating fluid flow through a heat exchanger A heat exchanger evaluation system (84) includes a refrigeration subsystem (126) and a platform (94) in communication with the subsystem (126) for attachment of a heat exchanger (32). The system, (84) further includes a thermal imaging camera (168) and a monitor (100). A method (180) entails routing a fluid (38) ... 01/26/06 - 20060016581 - Double-acting device for generating synthetic jets A double-acting device for generating a synthetic jet is provided. The double-acting device includes a chamber having a cavity for a working fluid, a separating element for dividing the chamber into at least two sub-chambers, a control system connected to the chamber for controlling the separating element to act reciprocatingly, ... 01/19/06 - 20060011329 - Heat pipe heat sink with holeless fin module A heat pipe heat sink with a holeless fin module is disclosed in the present invention. Because of the holeless arrangement the heat pipe heat sink is much more convenient for manufacturing. The heat generated by an electrical component can quickly be transferred into the heat pipe and uniformly distributed ... 01/12/06 - 20060005953 - Liquid cooling device A liquid cooling device includes a casing (10), a liquid inlet port (18) and a liquid outlet port (19) in communication with the casing (10). The casing (10) includes a heat-absorbing base (11). The base (11) includes a porous layer interior of the casing (10). ... 01/05/06 - 20060000584 - Advanced microelectronic heat dissipation package and method for its manufacture Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial ... 01/05/06 - 20060000583 - Heat dissipating device A heat dissipating device includes a first fluid container containing an amount of working fluid therein, a heat-conductive second fluid container placed in contact with a heat source, a first check valve unit for permitting flow of the working fluid from the first fluid container into a first accommodating space ... 12/29/05 - 20050284616 - Advanced microelectronic heat dissipation package and method for its manufacture Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial ... 11/24/05 - 20050257920 - Heat dissipating device A heat dissipating device includes a heat receiver, a fin member including a plurality of spaced fins defining aligned holes, and at least one heat pipe connecting the heat receiver with the fin member. Some of the fins adjacent the heat receiver define enlarged openings each communcating with a corresponding ... 11/10/05 - 20050247437 - Heat dissipating device A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body ... 11/03/05 - 20050241809 - Pump, cooling system, and electronic apparatus A cooling pump includes a rotor including a rotation axis, a disc fixed with the rotation axis, an impeller fixed with the disc for pressurizing a liquid coolant, and a plurality of permanent magnets arrayed to be fixed with the disc in a ring shape; a case including a pump ... 11/03/05 - 20050241808 - Heat dissipation device A heat dissipation device includes a first heat sink (10), a second heat sink (20) and at least one heat pipe (30). The first heat sink includes a first base (12) and a plurality of fins (14). The second heat sink includes a second base (22) and a plurality of ... 10/27/05 - 20050236144 - Liquid-cooled projector A liquid-cooled projector incorporates a means for cooling a component that to be cooled by means of a cooling liquid, and moreover, can constantly maintain the temperature of the component to be cooled at a prescribed temperature or below. A liquid-cooling jacket for cooling either one or both of the ... 10/20/05 - 20050230086 - Water-cooling heat dissipation system A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the ... 10/13/05 - 20050224217 - Multiple evaporator heat pipe assisted heat sink A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions received in parallel channels in ... 10/06/05 - 20050217829 - Low-profile thermosyphon-based cooling system for computers and other electronic devices This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser ... 09/15/05 - 20050199377 - Heat dissipation module with heat pipes A heat dissipation module including heat pipes. The heat dissipation module includes a seat with grooves, heat pipes and two fin assemblies. The heat pipes are secured in the grooves at a first end and extend at the second end thereof. A first fin assembly with parallel first fins is ... 08/25/05 - 20050183849 - Heat radiating apparatus A heat radiating apparatus is provided which includes at least two radiating portions positioned adjacent to one another, each of the radiating portions comprising a plurality of radiating fins, at least one heat pipe thermally connecting the radiating portions to each other, and a fan unit provided at a position ... 08/25/05 - 20050183848 - Coolant tray of liquid based cooling device A liquid based cooling device includes a pump for driving a coolant through a coolant tray that is positionable on a heat generating device and a radiator that dissipates the heat into the surrounding. The coolant tray includes a housing on which coolant inlet and outlet are formed for receiving ... 08/25/05 - 20050183847 - Microchannel flat-plate heat pipe with parallel grooves for recycling coolant Heat from a heat generating device such as a CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed ... 08/25/05 - 20050183846 - Heat dissipation interface for semiconductor chip structures The present invention is directed to a modular heat dissipating device that consists of a plurality of sheet and beam members which are connected together by heat pipes. The sheet or support fin member is constructed by folding a piece of heat conducting material which is then mounted on a ... 08/18/05 - 20050178533 - Liquid cooling system and an electronic apparatus having the same therein In a liquid cooling system, comprising: a heat-receiving jacket for receiving heat from a heat-generation body therein; a heat-radiator for radiating the heat therefrom, which is received within the heat-receiving jacket; and a tank for accumulating refrigerant therein, which is connected with the heat-receiving jacket and the heat-radiator through flow ... 08/18/05 - 20050178532 - Structure for expanding thermal conducting performance of heat sink A structure for expanding thermal conducting performance of a heat sink includes a bottom plate, a top plate, a hollow filling tube, a wick structure and a hollow thermal expansion conductor. The top and bottom plates are covered with each other to form a planar shell, in which an upper ... 08/11/05 - 20050173098 - Three dimensional vapor chamber A three dimensional vapor chamber is disclosed which has a horizontal vapor chamber portion and a vertical flat heat pipe portion. The interiors of the two portions are in fluid communication and can have a wick material saturated with a working fluid such as water. The vertical flat heat pipe ... 08/11/05 - 20050173097 - Liquid circulation type cooling system A liquid circulation type cooling system includes a circulating pump for circulating a liquid, a heat exchanger disposed in a heat radiation space and for radiating heat outside the system. The heat exchanger contains a core unit, a liquid reservoir for storing the liquid positioned on the upstream side of ... 08/04/05 - 20050167087 - Heat dissipating device with heat pipe A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the ... 07/28/05 - 20050161199 - Heat-dissipating device A heat-dissipating device is provided. The heat-dissipating device is capable of cooperating a cross-flow type fan, mainly comprising a heat-conductive base plate attached with at least one heat-conductive pipe, and fixedly provided with a plurality of fins on the heat-conductive pipe. An air-outlet gap is naturally formed between any two ... 07/21/05 - 20050155746 - Heat-pipe type heat-sink structure and its sealing method The heat-pipe type heat sink structure of the present invention comprises a heat conducting part stackable on an article to be heat sunk and multiple heat-sinking fins on the heat conducting part; wherein the heat conducting part has a through hole, two plug holes of larger diameters are provided on ... 07/14/05 - 20050150637 - Heat sink and multi-directional passages thereof A heat sink comprises a plurality of heat-dissipating units, and each heat-dissipating unit provides a base and a plurality of parallel fins disposed thereon, respectively. The fins of any two adjacent heat-dissipating units extend in different directions. ... 07/14/05 - 20050150636 - Heat pipe radiator for eliminating heat of electric component A kind of heat pipe radiator for eliminating heat of exothermic electronic elements includes a tubular shell with a tubular, thin-wall fluid passage, which is set inside the said shell, and the edge of which, by an end plate, is airtight sealed with the edge of the said shell, in ... 06/30/05 - 20050139348 - Hot swap fan A hot swap fan includes a fan and a holding member. The fan has an air inlet, an air outlet, and a sidewall connected between the air inlet and the air outlet. The holding member is bent to form a top portion and at least one side portion and affixed ... 06/30/05 - 20050139347 - Heat dissipation device A heat dissipation device includes a fin member (16), a fan (30), a fan holder (40) and at least one heat pipe (20). The fan holder includes a support plate (42) which is sandwiched between the fin member and the fan, and ears (46) perpendicularly extending from the support plate. ... 06/23/05 - 20050133203 - Minimal fluid forced convective heat sink for high power computers A heat removal system for a computer has a heat sink and a spool rotatably disposed in the heat sink. The spool includes fluid inlets and outlets, and water circulates in a closed loop from the inlets, through the spool, through the outlets, past the computer component to be cooled, ... 06/16/05 - 20050126763 - Radiator with seamless heat conductor A radiator with seamless heat conductor at least consists of two heat sink modules and a heat conductor. The two heat sink modules can be jointed with each other. At jointing edges of the heat sink modules, arc slots are provided corresponding to the heat conductor thereby forming penetrating holes ... 06/16/05 - 20050126762 - Radiating module and the manufacturing method thereof A method for manufacturing a radiating module consisting of a plurality of radiating fins, at least one heat-transfer tube, and a seat includes the steps of forming through holes on the radiating fins, extending the heat-transfer tube through the through holes on the radiating fins, and positioning a seat in ... 06/16/05 - 20050126761 - Heat pipe including enhanced nucleate boiling surface A device may include a boiling structure and a wick structure adjacent the boiling structure. The boiling structure may convert a coolant from liquid to vapor and may have a first thermal resistance. The wick structure may bring the coolant to the boiling structure and may have a second thermal ... 06/09/05 - 20050121175 - Structurally sealed heat sink A structurally sealed heat sink is composed of a main body, at least one sealing member, and at least one solder unit. The main body includes a chamber inside, a capillary layer adhered to a peripheral surface of said chamber, and at least one opening having a predetermined depth to ... 06/02/05 - 20050115698 - Structure of heat sink An improved structure of heat sink is combined with the base and the structure of closed pipeline. By way of the cooling effect produced when solution in the pipeline of the structure of closed mini pipeline inside the base circulate and change mutually in the liquid state and steam, which ... ### FreshPatents.com Support - Terms & Conditions |