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Heat Exchange > Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat > Liquid Fluent Heat Exchange Material > Utilizing Change Of State

Utilizing Change Of State

Utilizing Change Of State patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

12/20/07 - 20070289721 - Loop type heat pipe and waste heat recovery device
A loop type heat pipe includes an evaporator located to evaporate a refrigerant by heat-exchanging with a first fluid as a heat source, and a condenser located to liquefy and condense the evaporated vapor refrigerant by heat-exchanging with a second fluid to be heated. The condenser has a refrigerant condensation ...

12/13/07 - 20070284088 - Cooling apparatus of looped heat pipe structure
A coolant phase changeable cooling apparatus using a capillary action is provided. The cooling apparatus prevents a generation of bubbles inside a wick of an evaporator or an inverse flow of a vaporized gaseous coolant through a wick. Also, a thermal contact area can be widened by using at least ...

10/25/07 - 20070246193 - Orientation insensitive thermosiphon of v-configuration
The invention provides a heat exchanger assembly for cooling an electronic device wherein the upper portion of the housing includes a plurality of condensing tubes extending upwardly from the lower portion of the housing. A plurality of air heat transfer fins zigzag transversely to a primary axis (A) between adjacent ...

10/04/07 - 20070227702 - Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant
The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid surface and a ...

10/04/07 - 20070227701 - Thermosiphon with flexible boiler plate
A thermosiphon cooling assembly includes a housing having a lower portion and an upper portion. A refrigerant is disposed in the lower portion for liquid-to-vapor transformation. A boiler plate defines an outer bottom wall of the housing for transferring heat from the electronic device to the refrigerant. This transfer of ...

09/06/07 - 20070204974 - Heat pipe with controlled fluid charge
plus an amount of additional working fluid sufficient to have the rate of evaporation about equal to the rate of condensation for the particular heat pipe configuration. ...

08/09/07 - 20070181290 - Heat transfer apparatus
A self contained manually operated heat transfer apparatus and method of use is disclosed that includes a substantially sealed reservoir, an insulated handle that is adjacent to the reservoir, and a thermal fluid disposed within a portion of the reservoir. Wherein the heat transfer apparatus is operational to absorb or ...

08/02/07 - 20070175613 - Loop heat pipe
A loop heat pipe includes an evaporator and a closed loop. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, the closed loop includes a first ...

07/19/07 - 20070163754 - Thermosiphon having improved efficiency
The invention relates to an improved thermosiphon and to a method for transferring heat. The thermosiphon has a higher efficiency than existing thermosiphons because it does not rely on a pool-boiling evaporator but rather uses a forced-convection boiling evaporator. The inlet of the evaporator is located in its upper portion ...

07/05/07 - 20070151707 - Method and apparatus for cooling electrical equipment
A method is provided for cooling electrical equipment located in distinct regions in a cabinet. A first air flow is provided to a first region in the cabinet. A second air flow is provided to a second region in the cabinet. The temperature of the first and second air flows ...

06/07/07 - 20070125522 - Embedded heat pipe in a hybrid cooling system
One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated through the liquid channel to ...

03/29/07 - 20070068654 - Heat dissipation system and method for making same
A heat dissipation system and a making method thereof are disclosed in accordance with a preferred embodiment. The heat dissipation system mainly includes a body, a cover, and a working fluid. The body includes an evaporation chamber having a first side entryway and a first side outlet, a condensation chamber ...

03/15/07 - 20070056712 - Heat dissipation module and heat pipe thereof
A heat dissipation module includes a heat pipe and at least one fin, which is connected to and disposed on an external surface of the heat pipe. The heat pipe includes a casing, a wick and a working fluid. The casing has an accommodating space and a bottom portion. The ...

03/15/07 - 20070056711 - Heat pipe and method for manufacturing same
A thin and flat type heat pipe with aced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are ...

03/15/07 - 20070056710 - Apparatus for cooling communication equipment using heat pipe
The present invention is directed to an apparatus for cooling communication equipment using a heat pipe, which re-leases heat from a heat-emitting unit by a simple, reliable and safe scheme. The present invention provides an apparatus for releasing heat, which comprises: a heat pipe for transferring heat generated in a ...

12/28/06 - 20060289146 - Thermal module incorporating heat pipe
A thermal module for dissipating heat generated by a heat source includes a heat pipe and a heat sink. The heat pipe includes a vaporized portion thermally connected to the heat source for collecting the heat, a condensed portion for receiving the heat transmitted from the vaporized portion, and a ...

12/14/06 - 20060278369 - Cooling method
In a display cabinet (21) articles such as food placed on a shelf (20) can be kept cooler by having a heat pipe in the shelf with one end of the heat pipe (20a) cooled by the cabinet's cooling system (22). ...

11/30/06 - 20060266499 - Cooling device of hybrid-type
The present invention provides a hybrid-type cooling device which can perform cooling by phase transition, ventilation and convection. ...

11/02/06 - 20060243424 - Heat pipe
A heat pipe (10) includes a metal casing (12) having a closed end (14) and a sealed end (16) located opposite to the closed end. The sealed end of the heat pipe includes a cramped section (16a) having a wave-shaped cross-section. A device for sealing an open end (16a) of ...

09/14/06 - 20060201654 - Heat pipe component deployed from a compact volume
A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sections (108) from a compact volume. ...

08/24/06 - 20060185825 - Loop type thermo syphone, heat radiation system, heat exchange system, and stirling cooling chamber
A natural circulation circuit includes an evaporator surrounding a heat radiating portion of a Stirling refrigerating machine to absorb heat of the heat radiating portion through evaporation of a coolant, a condenser arranged to be higher than the evaporator to condense the coolant having gas phase, a conduit guiding the ...

07/20/06 - 20060157228 - Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing
A method for fabricating a metal micro heat pipe with a polygonal cross-section including at least two concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe. The concave sides are each formed of a single metal layer via a ...

07/20/06 - 20060157227 - Cooling device of thin plate type for preventing dry-out
The present invention provides a thin plate type cooling device including at least one cavity formed on an inside wall of coolant circulation loop in order to prevent dry-out of the coolant. ...

06/22/06 - 20060131001 - Boiling and cooling device
A container composes the refrigerant tank 1 including: a block 13 made of copper, one face of which is exposed inside the refrigerant tank 1, the other face of which is contacted with the heating body 90; and a lamination plate 12 composed of three layer structural material in which ...

06/15/06 - 20060124279 - Evaporative cooling electromagnetic separator
This is an evaporative cooling electromagnetic separator. It includes a shell and an iron core installed inside the shell. A set of wire coil is winded around the iron core. Inside the shell is cooling medium, which is evaporative cooling medium or mixture of evaporative cooling medium and transformer oil. ...

05/18/06 - 20060102322 - Integrated heat exchangers in a rack for verticle board style computer systems
A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the ...

05/11/06 - 20060096739 - End sealing structure for heat pipe
An end sealing structure for heat pipe includes a sealed conical end formed at an end of the heat pipe, which is formed from a hollow metal pipe having a dead end opposite to the sealed conical end. The conical end is sealed at an outmost end thereof by more ...

05/04/06 - 20060090881 - Immersion cooling apparatus
A device for cooling a heat-dissipating component comprising a body having at least one sidewall, an enclosed volume, an expansion volume, a quantity of heat transfer fluid disposed within the enclosed volume, and means for releasing the heat transfer fluid from the enclosed volume to the expansion volume. Upon release ...

03/30/06 - 20060065385 - Heat transport apparatus and heat transport apparatus manufacturing method
A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary ...

03/16/06 - 20060054308 - Multiple fluid heat pipe
A heat pipe having a fluid conduit, a first working fluid, having a first boiling point, disposed in the fluid conduit, and a second working fluid, having a second boiling point being different than the first boiling point, disposed in the fluid conduit. The first and second working fluids are ...

02/02/06 - 20060021738 - Foam bumper and radiator for a lightweight heat rejection system
Methods and apparatus are provided for a lightweight heat rejection system suitable for spacecraft applications. The apparatus comprises a manifold configured with an array of heat pipes in thermal contact with a manifold coolant. The heat pipes transfer the coolant heat to associated bumper/radiators external to the manifold. The bumper/radiators ...

01/12/06 - 20060005947 - Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips ...

01/05/06 - 20060000582 - Flexible loop thermosyphon
A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the ...

01/05/06 - 20060000581 - Cylindrical heat pipes
A cylindrical heat pipe. The heat pipe includes a hollow body, a cover, and a tube. The hollow body includes a sealed bottom, a top portion and an inner wall. The cover includes an elevated portion near the top portion. The tube penetrates the cover. The cover seals the hollow ...

12/29/05 - 20050284611 - Cooling device for electric circuit
A cooling device to which an electric circuit may be mounted includes a cooling body provided with a front edge having bores forming V-shaped channels inside the body. Intersecting V-shaped channels are closed by plugs to thereby define a continuous cooling circuit inside the cooling body. ...

12/15/05 - 20050274494 - Method for forming end surface of heat pipe and structure thereof
A method for forming an end surface of a heat pipe and the structure thereof are disclosed. Firstly, the mold module is provided for placing the heat pipe therein. The mold module includes a mold chamber to receive the heat pipe. Then, an extruding shaft is pushed forward into the ...

12/01/05 - 20050263266 - Ventilator
Ventilator including a case having a first flow passage and a second flow passage therein, at least one fan in the case for supplying room air to a room through the first flow passage, and guiding outdoor air to the room through the second flow passage, and a heat exchanger ...

12/01/05 - 20050263265 - Heat dissipating device with heat pipe
A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of ...

11/24/05 - 20050257915 - Cooling device
The invention relates to a cooling device (1) with a plurality of evaporation chambers (10) being positioned adjacently and having one open side and boundary walls (11) of a thermally conductive material, on the inner surfaces (13) of which a fleece (15) soaked with a liquid is arranged, and the ...

11/10/05 - 20050247434 - Heat dissipating device
A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow ...

11/03/05 - 20050241806 - Radiator plate rapid cooling apparatus
A radiator plate rapid cooling apparatus includes a base deck and radiation fins located thereabove formed integrally by extrusion, forging or soldering. The base deck is located at the bottom end of the radiator plate and has passages formed by machining that house a capillary device placed therein or integrally ...

10/13/05 - 20050224214 - System and method for cooling electronic assemblies
A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined intervals, wherein the one or more heat pipes intersects the plurality of thermal plates, and an opening ...

09/08/05 - 20050194122 - Heat pipe component deployed from a compact volume
A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sections (108) from a compact volume. ...

08/11/05 - 20050173096 - Heat dissipating device
A heat dissipating device includes a fluid container made of a heat conductive material and having a heat-dissipating wall opposite to a heat-absorbing wall, and a surrounding wall cooperating with the heat-absorbing and heat-dissipating walls so as to confine a sealed vapor chamber. A heat exchanger member is disposed in ...

07/21/05 - 20050155745 - Vapor chamber
A vapor chamber, in which a condensable fluid, which evaporates and condenses depending on a state of input and radiation of a heat, is encapsulated in a hollow and flat sealed receptacle as a liquid phase working fluid; and in which the wick for creating the capillary pressure by moistening ...

07/07/05 - 20050145372 - Method and thermally active multi-phase heat transfer apparatus and method for abstracting heat using liquid bi-phase heat exchanging composition
Apparatus for abstracting heat comprises a container charged with a first liquid and with small auxiliary containers free to circulate in the first liquid. Each of the small auxiliary containers is charged with a second liquid. The first and second liquids each have a selected temperature of transformation that facilitates ...

07/07/05 - 20050145371 - Thermal solution for electronics cooling using a heat pipe in combination with active loop solution
Cooling techniques to cool electronic devices in a computer system are disclosed. For one embodiment, the cooling technique utilizes a combination of an active cooling component with a passive cooling component. The active cooling component includes a heat exchanger, a pipe loop, and a pump. A liquid coolant is to ...

06/30/05 - 20050139346 - Cooling apparatus for light valve
A cooling apparatus for a light valve of the present invention includes a control box disposed on the back of the light valve to actuate the light valve, followed by a heat pipe and a heat-conducting component pasted upon the inner surface of the control box. The heat-conducting component is ...

06/16/05 - 20050126759 - Plate-type heat pipe and method for manufacturing the same
A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is thermally connected and another plate member forming a cavity inside thereof in combination with said plate member, and said ...

06/16/05 - 20050126758 - Heat sink in the form of a heat pipe and process for manufacturing such a heat sink
In a heat sink designed as a heat pipe, there is an interior space in a body of the heat sink that is closed toward the outside with at least one vapor channel or vapor space and at least one fluid space that is connected with the vapor space and ...



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