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Heat Exchange > With Retainer For Removable Article > Electrical Component > Air Cooled, Including Fins Air Cooled, Including FinsAir Cooled, Including Fins patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/10/08 - 20080006391 - Apparatus and method for the application of prescribed, predicted, and controlled contact pressure on wires The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advantage of the characteristics of wires in packaging of a device, such ... 11/29/07 - 20070272391 - Heat dissipation device A heat dissipation device includes a first heat transferring body and a second heat transferring body extending from the first heat transferring body with a plurality of second fins mounted thereon. The first heat transferring body has a surface in thermal contact with a component to be cooled and a ... 11/22/07 - 20070267172 - Heat dissipation apparatus A heat dissipation apparatus (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12) and a centrifugal blower (14). The fin assembly includes a plurality of fins (121) for thermally connecting with the heat-generating electronic component to absorb heat therefrom. The centrifugal blower provides an airflow ... 11/08/07 - 20070256813 - Direction-adjustable diffusive device A direction-adjustable diffusive device is disclosed to include a heat sink, which has a rotating mechanism positioned on the outside of the heat sink, and a cowling, which has another rotating mechanism correspondingly coupled to the rotating mechanism of the heat sink, and a wind-guiding channel comprising a first wind-guiding ... 11/08/07 - 20070256812 - Multidirectional heat dissipating structure A multidirectional heat dissipating structure that joins and assembles a plurality of heat dissipating fins, length of each of which vary, and can be arranged and assembled to form a plurality of flow guiding plates, each of which assumes a certain angle in accordance with the direction of air, thereby ... 10/25/07 - 20070246190 - Heat dissipating structure having different compactness A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each of the heat dissipating fins is predetermined when assembling to constitute the ... 10/11/07 - 20070235162 - Radiator Disclosed is a radiator attachable to another radiator. The radiator includes a fin, a plurality of bent edges, a plurality of slots, a plurality of buckles and a plurality of lugs. The bent edges extend from the fin. The slots are defined in the fin, and each of them is ... 10/04/07 - 20070227696 - Heat dissipating structure A heat dissipating structure is proposed, which includes a frame, a heat dissipating element, and elastic elements. The frame encloses a central zone in which a heat generating element is disposed. The heat dissipating element has a bottom surface from which plates extend such that the heat dissipating element lies ... 09/20/07 - 20070215323 - Heat-dissipating structure A heat-dissipating structure is proposed, which can be attached to a heating member for dissipating heat energy produced by the heating member. The heat-dissipating structure includes a base and a plurality of heat-dissipating fins. The base is attached to the heating member. The plurality of heat-dissipating fins, configured as a ... 09/20/07 - 20070215322 - Heat dissipating device A heat dissipating device comprises a plurality of fins. An upper side and a lower side of each fin is folded with folding sheets. Each of two sides of each sheet is protruded with a buckling ear. The buckling ear is formed by a triangular sheet and a support plate. ... 09/20/07 - 20070215320 - Heat sink with combined fins A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an edge of the body. The main body has a thickness and defines ... 09/20/07 - 20070215319 - Heat dissipation device having a bracket A heat dissipation device (10) includes a first heat sink (20), a second heat sink (30) and a heat pipe (40) transferring heat from the first heat sink to the second heat sink. A bracket (50) includes a first end (51) attached to the first heat sink and a second ... 09/06/07 - 20070204972 - Method and apparatus for dissipating heat A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one ... 08/30/07 - 20070199678 - Surface coating film structure on heat dissipation metal and manufacturing method thereof This invention discloses a manufacturing method and the structure for a surface coating film on a heat dissipation metal. The surface coating film structure on the heat dissipation metal includes a heat dissipation metal and a thin film. The surface coating film structure on the heat dissipation metal is often ... 08/30/07 - 20070199677 - Heat sink fin structure and manufacturing method thereof This invention discloses a manufacturing method and the structure for a heat sink fin. This heat sink fin structure includes an attachment and a plurality of heat sink fins. The plurality of heat sink fins is often used in conducting the waste heat from a chip. The plurality of heat ... 08/23/07 - 20070193718 - Heat sinks and method of formation A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air ... 08/16/07 - 20070187069 - Heat pipe heat sink A heat sink (1), has heat pipes (3) which are disposed in a high temperature section (A) of a base plate (2) on which a heating element (4) is disposed so that the heat pipes (3) extend from the high temperature section (A) to low temperature sections (B) in different ... 08/09/07 - 20070181288 - Combination of a heat sink and a fan A combination includes an extruded heat sink and a fan secured to the heat sink. The heat sink includes a planar fin and an L-shaped fin. The planar fin and the L-shaped fin commonly define a channel and an entrance to the channel. The fan includes lead wires packed together. ... 08/09/07 - 20070181287 - Heat dissipation device A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and toward ... 08/09/07 - 20070181286 - Structure for air conduction in radiator device A structure for a heat-dissipating device includes a radiator, a heat dissipating plate and a fan. The radiator has plurality of radiating fins, flow passages are formed between these radiating fins which are divided into middle part and two-side parts. The lower ends of the radiating fins in two-side parts ... 07/19/07 - 20070163749 - Component package having heat exchanger In an electrical component package (1) provided with a liquid-cooled heat exchanger (20), a main-body plate (1A) of the package and a crowning member (5) that are composed of metal plates are joined together, forming a hollow part (6) therebetween for use as a liquid-cooled heat exchanger in which a ... 07/05/07 - 20070151706 - Heat sink for dissipating a thermal load A heat sink for dissipating a thermal load is disclosed that includes one or more heat sink bases configured around a central axis of the heat sink so as to define an interior space, at least one heat sink base receiving the thermal load, a thermal transport connected to the ... 06/28/07 - 20070144706 - Heat sink and electronic equipment A heat sink for radiating heat of an electronic component is provided with a heat sink main body having an abutting face that abuts against the electronic component, and a heat-radiation member having a joint face that is jointed to a front side face opposite to the abutting face. Furthermore, ... 06/28/07 - 20070144705 - Heat sink A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular ... 06/14/07 - 20070131387 - Heat sink with heat pipes and method for manufacturing the same A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermally ... 06/14/07 - 20070131386 - Fin unit for a cooler A fin unit for a cooler includes a heat-conducting member, a plurality of helical elongate twisted fins and a fan. The heat-conducting member or a heat generator has its surface fixed with the plurality of helical elongated twisted fins. When the fan is started to operate, air convection is produced ... 06/07/07 - 20070125518 - Heat sink assembly In a cooling system for cooling power electronics on a locomotive where the cooling system includes a finned heat sink that has air passing therethrough an airway passage to reach a plurality of fins where reducing airborne debris clogging of the plurality of fins is preferred, the heat sink includes ... 05/31/07 - 20070119567 - Heat dissipation device A heat dissipation device includes a heat sink, a cooling fan having a frame arranged on the heat sink, and a fan holder disposed between the heat sink and the cooling fan. The fan holder includes a square shaped frame defining an opening therein. A pair of flexible fasteners extend ... 05/31/07 - 20070119566 - Heat dissipation device A heat dissipation device includes a fin set including a plurality of fins assembled together and a fan located beside the fin set. Pluralities of air passages are defined between the fins. Each fin has two spaced flaps extending from a main body thereof and dividing the main body to ... 05/17/07 - 20070107872 - Heat sink with increased cooling capacity and semiconductor device comprising the hear sink A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat ... 05/17/07 - 20070107871 - Heat sink A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The ... 05/10/07 - 20070102144 - Radiating module and the manufacturing method thereof A method for manufacturing a radiating module consisting of a plurality of radiating fins, at least one heat-transfer tube, and a seat includes the steps of forming through holes on the radiating fins, extending the heat-transfer tube through the through holes on the radiating fins, and positioning a seat in ... 05/10/07 - 20070102143 - Heat dissipation module and heat pipe thereof A heat dissipation module includes a heat pipe and a plurality of fins disposed around the heat pipe. The heat pipe includes a main body, a base, a first wick, a second wick and a working fluid. The main body has a top portion and a sidewall portion disposed around ... 05/10/07 - 20070102142 - Heat spreaders with vias Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush thermal vias. Graphite heat spreaders having surface layers covering the graphite material are provided. Graphite heat spreaders having a layer of cladding ... 05/10/07 - 20070102141 - Diversion component A diversion component connecting to a fixing base for heat sink at least includes a deformable piece and locating portions provided on the piece for connecting the diversion component to the fixing base for heat sink, wherein when the diversion component is connected to the fixing base for heat sink, ... 05/10/07 - 20070102140 - Structured thermal transfer article Structured thermal transfer article comprising a plurality of metal bodies and a plurality of interstitial elements disposed between and connecting the plurality of metal bodies to one another. The metal bodies comprise an inner portion comprising a first metal and an outer portion comprising an alloy comprising the first metal ... 04/19/07 - 20070084584 - Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device Each of fins is provided with an engage projection having a first width and a engage hole portion having a second width wider than the first width, and the fins are able to be slid while engaging with each other. Accordingly, in case of installing a heat sink to a ... 04/19/07 - 20070084584 - Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device Each of fins is provided with an engage projection having a first width and a engage hole portion having a second width wider than the first width, and the fins are able to be slid while engaging with each other. Accordingly, in case of installing a heat sink to a ... 04/19/07 - 20070084583 - Structure for connecting radiating fins A structure for connecting radiating fins includes a plurality of parallelly arranged and vertically spaced radiating fins and at least one connector. Each of the radiating fins is provided on at least one outer edge with at least one receiving section, so that at least one group of aligned receiving ... 04/19/07 - 20070084583 - Structure for connecting radiating fins A structure for connecting radiating fins includes a plurality of parallelly arranged and vertically spaced radiating fins and at least one connector. Each of the radiating fins is provided on at least one outer edge with at least one receiving section, so that at least one group of aligned receiving ... 04/05/07 - 20070074852 - Heat sink A heat sink includes a base, a set of fins mounted to the base and a plurality of fixing portions, wherein the fixing portions extend from a surface of the base and the set of fins are mounted on an opposite surface of the base. The heat sink is secured ... 04/05/07 - 20070074851 - Heat sink A heat sink includes a base, a set of fins and at least an elastic fixing member mounted on a surface of the base. The elastic fixing member includes an elastic sheet mounted on the base, a supporting portion disposed on the elastic sheet and a fixing portion disposed on ... 04/05/07 - 20070074850 - Heat sink A heat sink assembly comprises a base having one or more slots, and further comprises one or more fins, each having an end configured for insertion into a respective one of the slots. Each fin end has a first surface that is configured for conformally engaging a first slot sidewall ... 04/05/07 - 20070074849 - Heat sink with multiple coolant inlets The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about the central axis of ... 03/08/07 - 20070051496 - Cooling device The invention relates to a cooling device, which comprises a cooling fan and a heatsink. The heatsink is directly attached to the heating element to absorb its heat and the cooling fan is disposed on top of the heatsink to dissipate the heat. The heatsink includes a central heat dissipation ... 03/08/07 - 20070051495 - Heat-dissipating device with thin fins A heat-dissipating device with a base and multiple fins is described. The base has multiple grooves formed periodically thereon. Each of the fins has an end formed with a folded portion. The ends with the folded portions are thicker than the fins themselves and fixed within the grooves of the ... 03/01/07 - 20070044941 - Heatsink having porous fin A heatsink for electronic component is provided. The heatsink has its fins made from metallic plates having multiple cavities of irregular shapes and dimensions dispersed within the metallic plates. For fins made from these porous metallic plates, the cavities or pores significantly increase the surface areas of the fins exposed ... 02/08/07 - 20070029068 - Heat sink A heat sink has a base and multiple fins. The fins are attached to the base, and each fin has a radiating surface and a conducting surface. The conducting surface is formed on the radiating surface and has at least one side abutting the base. The base is attached to ... 02/01/07 - 20070023166 - Heat-dissipating device and method The invention provides a heat-dissipating device and method. The heat-dissipating device comprises a transmitting device, at least a fin, and a fan. The transmitting device comprises a heat-dissipating channel and a passage. The passage comprises a converging intersection connecting to the heat-dissipating channel and the channel. The heat-dissipating method comprises ... 01/18/07 - 20070012422 - Heat radiating fin The present invention provides a type of heat radiating fin, particularly one having multiple-face jutted snaps, said multiple-face jutted snaps are snapped to and pulled through matching snap holes provided on matching snap fold sides on the same heat-radiating fin, thereby to enhance high heat-radiating efficiency. ... 01/04/07 - 20070000643 - Heat sink A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element includes a heat conductive plate and a heat ... 01/04/07 - 20070000642 - Thermally conductive member and cooling system using the same A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the sheet is provided. The thermally conductive elastomer piece includes at least one base portion fitting with the inner periphery of ... 12/21/06 - 20060283572 - Heat sink and plasma display device having the same A plasma display device having a heat sink. The heat sink includes a heat sink base adapted to contact a semiconductor device and a plurality of fins extending from the base. Each fin has a fin base and a fin tip distal from the semiconductor device. The fin base is ... 11/30/06 - 20060266496 - Method and apparatus for dissipating heat There is provided a heat dissipation device comprising a base, a base element positioned within the base, protrusions extending from the base, and protrusion elements positioned within the protrusions. Also provided are methods of dissipating heat, comprising passing fluid across and/or through such devices. ... 11/23/06 - 20060260785 - Heat sink A heat sink includes a plurality of fins, each of which includes a first vent and a first baffle. Each baffle is extended at one side of the first vent, and each of the first vents of the fins is located corresponding to the first vent of an adjacent fin. ... 11/16/06 - 20060254751 - System and method for using a flexible composite surface for pressure-drop free heat transfer enhancement and flow drag reduction A flexible composite sheet (FCS) comprising a membrane, a substrate coupled to the membrane, and a plurality of ridges coupled between the membrane and the substrate, wherein a vibratory motion is induced from the flow to at least one segment of a membrane spanning a distance s, wherein the vibratory ... 11/16/06 - 20060254750 - Heat-emitting element cooling apparatus and heat sink A heat-emitting element cooling apparatus 1 includes a heat sink 7 and a fan unit 5. The heat sink 7 has a base 33 onto which a heat-emitting element is to be mounted, radiation fins of a first type 35, and radiation fins of a second type 37. The radiation ... 10/12/06 - 20060225866 - Cooling fin assembly A cooling fin assembly includes a plurality of fins, each having a latching element on the top edge and the bottom edge, to couple with each other in series, forming an annular arrangement. The fins coupled in the annular fashion are surrounded and confined by a strapping ring. The fins ... 10/05/06 - 20060219386 - Heat dissipating assembly with composite heat dissipating structure A heat dissipating assembly includes a fan and a composite heat dissipating structure. The composite heat dissipating structure includes a first heat sink and a second heat sink disposed adjacent to the first heat sink. The first and the second heat sinks include a plurality of first fins and a ... 09/28/06 - 20060213643 - Cooling apparatus and electronic equipment The rotation of axial-flow blades permits air entered through an inlet port to exit directly to outside of a case in the axial direction, and the rotation of centrifugal blades permits air entered through the inlet port to exit through a side surface outlet port to the outside of the ... 09/28/06 - 20060213642 - Method of combining heat sink and heat conductor and combination assembly of the same A method of combining a heat sink and a heat conductor and the combination assembly of the same includes the steps of preparing a heat sink and a heat conductor, wherein the heat sink includes a sleeve, a plurality of cooling fins, and an increasing inner diameter, and the heat ... 09/28/06 - 20060213641 - Heat sink A heat sink includes a plurality of plate members stacked one by one. The plate member has a plurality of mounting holes at the body thereof and a plurality of bottom mounting lugs each having a through hole such that the mounting lug is elastically deformable. The bottom mounting lugs ... 09/21/06 - 20060207748 - Cooling apparatus and electronic equipment The rotation of axial-flow blades permits air entered through an inlet port to exit directly to outside of a case in the axial direction, and the rotation of centrifugal blades permits air entered through the inlet port to exit through a side surface outlet port to the outside of the ... 09/21/06 - 20060207747 - Isothermal plate heat-dissipating device An isothermal plate heat-dissipating device is arranged on a heat-generating element of computer and includes an isothermal plate body and at least one fin plate set. The isothermal plate body comprises an upper panel and a lower panel to define a hollow chamber therein. The hollow chamber contains heat-conducting structure ... 09/21/06 - 20060207746 - Cooling assembly with impingement cooled heat sink The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto the ... 09/07/06 - 20060196638 - System and method for thermal management using distributed synthetic jet actuators One embodiment of the device comprises a device for thermal management. More particularly, one embodiment comprises a synthetic jet actuator (60) and a tube (61). The synthetic jet actuator (60), though not required, typically comprises a housing (47) defining an internal chamber (45) and having an orifice (46) in a ... 09/07/06 - 20060196637 - Heat sink A heat sink includes: a first end; a second end; an exterior surface; a plurality of fins including a first fin and a second fin adjacent the first fin, each of the first fin and the second fin being substantially annular in form with an opening formed therethrough; a fin ... 09/07/06 - 20060196636 - Cooling mechanism A cooling mechanism according to the present invention comprises a heat conductive unit having a plurality of heat radiating fins extended outward in the radial direction thereof and a fan. The heat radiating fins and the air gaps among the heat radiating fins define a circular attachment face, on which ... 08/24/06 - 20060185822 - System and method for thermal management using distributed synthetic jet actuators One embodiment of the device comprises a device for thermal management. More particularly, one embodiment comprises a synthetic jet actuator (60) and a tube (61). The synthetic jet actuator (60), though not required, typically comprises a housing (47) defining an internal chamber (45) and having an orifice (46) in a ... 08/24/06 - 20060185821 - Thermal dissipation device A thermal dissipation device includes a heat sink; and at least a heat pipe that pastes on the surface of the heat sink to conduct the thermal to the heat sink efficiently for thermal dissipation. ... 08/24/06 - 20060185820 - Radiator structure A radiator structure includes a base and at least a conductive component. Several fins extend from the base and the conductive component is associated with the base and the fins. The conductive component is locally located at the base and the fins. The base and the fins are made of ... 08/10/06 - 20060175042 - Heat dispensing device A heat dispensing device includes a base made of copper and a plurality of aluminum fins integrally extend from the base. The fins are made by way of skving so that no agent and gap between the fins and the base. Heat can be directly transferred from the base to ... 08/03/06 - 20060169437 - Radiator for semiconductor A radiator for a semiconductor includes a main body which is provided for radiating heat from the semiconductor mounted to a substrate, and a plate member attached to the main body. The plate member is provided to have an elasticity relative to the substrate. The plate member includes a plate ... 07/20/06 - 20060157224 - Heat sink with combined parallel fins and the method for assembling the same A heat sink for removing heat from a heat-generating device includes a fin combination (10). The fin combination includes a plurality of fins interconnected together, each fin including a body (12), a flange (14) extending from the body and bent from an edge of the body, a tab (16) extending ... 07/20/06 - 20060157223 - Heterogeneous thermal interface for cooling The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat ... 07/20/06 - 20060157222 - Heat sink A heat sink includes a plurality of first fins each having a flat base and two parallel sidewalls perpendicularly extending from two sides of the flat base in same direction and having a first height, and a plurality of second fins each having a flat base arranged in parallel to ... 07/06/06 - 20060144561 - Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same A heat-dissipating device with an isothermal plate assembly of predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation groove is defined therein. A flattened heat pipe is bent into the predetermined shape and placed ... 07/06/06 - 20060144560 - Clip assembly structure for heat dissipating fins A clip assembly structure for heat dissipating fins encompassing a plurality of mutually connected heat dissipating fins, which are disposed in a perpendicular and parallel fashion atop a heat dissipator base. Wherein a top edge and a bottom edge of a lamina of each of the heat dissipating fins is ... 07/06/06 - 20060144559 - Heat dissipating device A heat dissipating device includes multiple self-aligning, interconnecting fins linked together. Each self-aligning, interconnecting fin has a first side edge, a second side edge, an inside surface, an outside surface, multiple alignment arms, and multiple outer connecting tabs. The alignment arms perpendicularly extend respectively from the first side edge and ... 07/06/06 - 20060144558 - Fan-driven heat dissipating device with enhanced air blowing efficiency A fan-driven heat dissipating device with enhanced air blowing efficiency is proposed, which is designed for use in conjunction with an integrated circuit device for dissipating the heat produced by the integrated circuit device during operation, and which is characterized by the provision of a secondary air outlet on the ... 06/22/06 - 20060131000 - Heat-dissipating module A heat-dissipating module comprises a conductive part, a fan and a flow-guiding shield. The conductive part has a receiving plane being connected to the fan and fits with the flow-guiding shield. The fan has a fan wheel with a circular area measured with the diameter thereof greater than the receiving ... 06/15/06 - 20060124278 - Heat dissipation device A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a first section with a first surface, a second section with a second surface parallel to the first surface, and a connecting portion. The connecting portion connects the first and second sections and extends ... 06/08/06 - 20060118276 - Heat sink A heat sink comprises a plurality of stacked fins being combined. Each fin comprises a plate body with two pairs of locking structures formed symmetrically on two opposite edges of the plate body. Each locking structure comprises an interval part extending integratedly from the plate body, a bearing part depending ... 06/08/06 - 20060118275 - Radiation module capable of resisting backward hot fluid flow A radiation module capable of resisting backward hot fluid flow comprises a fan, a radiator and a retaining tool. The fan provides an inlet and an outlet. The radiator is connected to the outlet of the fan. The retaining tool secures the radiator to a heat generation part. At least ... 06/01/06 - 20060113062 - Radiating fin assembly A radiating fin assembly comprises a plurality of radiating fins stacked together, wherein a folding edge is formed on opposite sides of the radiating fins, at both ends of the folding edge is formed a locking protrusion and a neck portion, a flexible slot is defined in the folding edge ... 05/18/06 - 20060102320 - Heat sink A heat sink is disclosed. A plurality of fins is radially and uniformly connected to a central base. Each fin comprises a plurality of protrusions. The protrusions are uniformly formed on each fin around the circumference of the central base. ... 05/18/06 - 20060102319 - Heat dissipation enhancing device A heat dissipation enhancing device includes a cooling fan and a radiator. The radiator is attached with the cooling fan and has cooling fins with flow passages being formed between the cooling fins for fluid driven by the cooling fan passing through the flow passages performing heat exchange heat in ... 05/11/06 - 20060096737 - Heat exchanger A heat exchanger having a plurality of fin plates (2) provided in parallel on a face (1a) of a base (1), wherein the fin plate (2) is provided with a rectifier portion (2b) having a tapered cross sectional shape at, at least, one tip (2a) thereof. ... 04/27/06 - 20060086481 - Heat sink A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting ... 04/20/06 - 20060081357 - Radiation module A radiation module comprises a rectangular radiator and a fan. The rectangular radiator provides two long lateral sides and two short lateral sides, The fan is attached to the radiator and has an annular frame with a fan wheel being received therein. The annular frame has a plurality of engaging ... 04/06/06 - 20060070721 - Heat dissipating device with heat conductive tubes A heat dissipating device with heat conductive tubes comprises a heat dissipating unit including a plurality of fins; a bottom edge of each fin having a plurality of concave portions; a seat; a surface of the seat having a plurality of protruding surfaces; a top of the seat having a ... 03/16/06 - 20060054307 - Heat sink A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first ... 03/02/06 - 20060042784 - Heat dissipation appatatus and method A heat dissipation apparatus and method for dissipating heat from a heat source includes a thermal conductive element bonding to the heat source to transfer heat energy generated by the heat source and a vibration source located on the thermal conductive element to accelerate heat transfer to the edges of ... 03/02/06 - 20060042783 - Heat sink for electronic device A heat sink has a substrate with first pivoting portions thereon. A heat scattering member has a plurality of fins on a top thereof, a protrusion on a periphery thereof and a pressing portion between the protrusion and the distal fin. A clip member has connection portions, second pivoting portions ... 03/02/06 - 20060042782 - Heat sink structure A heat sink structure comprises: a heat conducting base being provided thereon with a plurality of heat sinking fins arranged longitudinally and transversely to mutually cross each other; with the help of the blowing air blown by an above installed fan, the heat sink can make a fast exchange of ... 02/23/06 - 20060037735 - Bi-level heat sink A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is ... 02/16/06 - 20060032610 - Cooling fin assembly The present invention relates to a cooling fin assembly suitable for heat sinks. In one embodiment, the cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. ... 02/02/06 - 20060021736 - Pin type heat sink for channeling air flow A pin heat sink has a plurality of pins arranged on a base plate. The plurality of pins includes a first plurality of pins arranged to create one or more funnels of air flow directed to one or more hot spots created by electronic or other heat generating devices located ... 02/02/06 - 20060021735 - Integrated cooler for electronic devices An integrated cooler comprises a heatsink integrated with a centrifugal blower. The heatsink comprises a base and heat exchanging means. The centrifugal blower comprises an electric motor, a casing with inlet and at least one outlet, a radial impeller and an axle. The electric motor comprises a magnetized rotor and ... 02/02/06 - 20060021734 - Heat sink and heat spreader bonding structure A heat sink and heat spreader bonding structure includes a metal heat sink, a metal heat spreader, and an eutectic structure formed between the heat sink and the heat spreader by heating the heat sink and the heat spreader to a specific temperature of the eutectic temperature of the heat ... 02/02/06 - 20060021733 - Fan module for a heat dissipating device A heat dissipating device includes a fin unit disposed on a supporting seat, and an anchoring frame disposed on the fin unit and engaging detachably the supporting seat for anchoring the fin unit between the supporting seat and the anchoring frame. A fan module includes a fan unit having a ... 01/26/06 - 20060016578 - [high-performance two-phase flow evaporator] A high-performance two-phase flow evaporator is disclosed to include an electronic device, a non-metal casing, a heat sink device provided at the topside of the non-metal casing and defining with the non-metal casing an enclosed chamber, a working fluid contained in the enclosed chamber, and a heat conductivity member formed ... 01/19/06 - 20060011325 - Micro-channel heat sink A heat sink with an arrangement of a plurality of micro-fins, spaced apart to form microchannels through which a gas can flow. The heat sink includes a conductive apparatus for conducting heat from a heat source to the arrangement of micro-fins. The conductive apparatus includes a post, with a bottom ... 01/19/06 - 20060011324 - Wound, louvered fin heat sink device A heat sink device (10,60) is provided for cooling an electronic component (12) having a surface (14) that rejects heat. A fan (22) overlies the surface (14) to direct an airflow (24) towards the surface (14), the fan having a rotational axis (29). The heat sink device includes a fin ... 01/12/06 - 20060005945 - Cooling module A cooling module includes a thermal conductive member. An endoergic chamber, a radiative chamber and a circulation pump chamber are defined along the thermal conductive member. The thermal conductive member contacts a heat generating object outside the endoergic chamber. The thermal energy is transferred to the coolant in the endoergic ... 01/12/06 - 20060005944 - Thermoelectric heat dissipation device and method for fabricating the same A method for fabricating a thermoelectric heat dissipation device including the steps of providing a base plate, a thermoelectric semiconductive element connected to the base plate and a heat sink in form of plates or fins with one surface coated an electric insulation coating and patterned conductive lines, and adhering ... 12/29/05 - 20050284608 - Aluminum extruded fin set with noise reduction functionality An aluminum extruded fin set includes a substrate and a plurality of dissipation fins mounted upright on it. There are gaps between heat dissipation fins. Each dissipation fin is divided into three child dissipation fins by two slanted cutouts. The child dissipation fin between two slanted cutouts is bent toward ... 12/22/05 - 20050279486 - Fan duct A fan duct includes an immovable cylinder and a movable cylinder. The movable cylinder is capable of sliding in an axial direction of the immovable cylinder. One of the immovable cylinder and the movable cylinder defines at least one groove in an axial direction thereof. Each groove defines at least ... 12/15/05 - 20050274490 - Heatsink assembly and method of manufacturing the same A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from ... 12/08/05 - 20050269060 - Heat dissipation device assembly with fan cover A heat dissipation device assembly comprises a heat sink having a columniform conductive core and a plurality of fins arranged radially around the conductive core, a columnar fan cover housing the heat sink and defining a first open end and a second open end, and a fan located at the ... 12/08/05 - 20050269059 - Heat sink and its assembly The present invention discloses a heat sink assembly comprising a plurality of heat sinks having the same shape and being latched by at least one fixing bar, so that the heat sinks and the fixing bar can be connected together to form the heat sink assembly, enabling each heat sink ... 11/24/05 - 20050257914 - Skived-fin annular heat sink A skived-fin annular heat sink is manufactured via a skived-fin technology and includes at least one bottom board and a plurality of fins. The at least one bottom board is bended to form a closed-shaped. The fins are extended outwardly from the at least one bottom board, wherein each of ... 11/24/05 - 20050257913 - Heat sink with fins fitted and bonded thereto by applying conductive glue Disclosed is a heat sink used for telecommunication equipment, a high power amplifier or a CPU of a computer in order to emit heat having a high temperature to an exterior for properly maintaining operational characteristics of equipment. Instead of fabricating the heat sink through an extruding process by using ... 11/17/05 - 20050252642 - Finned heat dissipation module with smooth guiding structure A heat dissipation module includes an airflow generation device that generates airflow into an air channel in which a fin module is received and fixed. The fin module includes a plurality of fin plates substantially parallel to and spaced from each other to define air passages extending from an inlet ... 11/17/05 - 20050252641 - Heat dissipation device having thermally conductive cover board A heat dissipation device includes a casing forming a receptacle for receiving and retaining a fan module and a finned structure that includes spaced fins to define channels through air flows for primary exchange of heat with the heat dissipation device. The heat dissipation device further includes a thermally conductive ... 11/17/05 - 20050252640 - Finned heat dissipation module having flow guide A heat dissipation module includes an airflow generation device that generates airflow into an air channel in which a fin module is received and fixed. The fin module includes a plurality of fin plates substantially parallel to and spaced from each other to define air passages extending from an inlet ... 11/17/05 - 20050252639 - Radiation fin having an airflow guiding front edge A radiation fin formed by aluminum extrusion or a thin blade arranged in a plurality of number on a radiator to disperse operation heat of electronic equipment includes undulate or bent indented openings formed regularly or irregularly on one or both surfaces of the front edge or top edge of ... 11/17/05 - 20050252638 - Cpu heat dissipating unit A CPU heat dissipating unit for assembly into a 1 U industrial computer, wherein, used to improve the effect of dissipating heat, mainly consisting of a cover unit, a tunnel unit and a heat dissipating fin. The cover unit is assembled to an upper side of a power supply unit, ... 11/10/05 - 20050247432 - Heat dissipation element for cooling electronic devices A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality ... 11/03/05 - 20050241801 - Lightweight heat sink A heat sink disposable on a heat transfer surface of a heat-generating source such as an electronic component. The heat sink includes a base portion and a body portion. The base portion has a first surface disposable on the heat transfer surface, and a second surface opposite the first surface. ... 11/03/05 - 20050241800 - Twin fin arrayed cooling device A cooling device including a core with a plurality of twin fins connected with a plurality of grooves on the core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the ... 10/27/05 - 20050236142 - High surface area heat sink A heat sink is built including a three dimensional array of cylindrical openings for air to flow through instead of fins. By having a larger surface area than heat sinks with fins, this high surface area heat sink results in increased heat transfer to the surrounding air than a similarly ... 10/20/05 - 20050230082 - Thermal interface material and method for manufacturing same A thermal interface material (10) includes a shape memory effect thin film (12), and a thermal grease (13) attached on the film. The film is composed of a shape memory alloy, and is formed on a base (21) of a heat sink (20) at an operating temperature of a heat-generating ... 10/20/05 - 20050230081 - Heat dissipation device and manufacturing method thereof A heat dissipation device is made by skived-fin technology and has a thermal conductive portion and a plurality of fins. The fins are integrally formed with the thermal conductive portion. Each of the fins has a plurality of through holes, a top portion, and a bottom portion. The bottom portion ... 10/06/05 - 20050217825 - Heat dissipating sheet and heat dissipating module made of the heat dissipating sheet A heat dissipating sheet is a metal thin sheet. The heat dissipating sheet comprises a plurality of adjacent wave-like plates. Each wave-like plate is formed by a plurality of projections. Lower sides of all the wave-like plates are formed as a base surface. All the projections are protruded from the ... 10/06/05 - 20050217824 - Cooling element for an electronic device The invention relates to a cooling element to be used as a heat sink for an electronic device (1, 11, 21, 31), as a microprocessor, which contains a base member (2, 12, 22, 32) attached in one side to the electronic device (1, 11, 21, 31) and in other side ... 09/29/05 - 20050211416 - Heat sink with fins and a method for manufacturing the same A heat sink with fins comprising a pillar-shaped base member, and a plurality of fins which are inserted into a plurality of grooves formed in the side face of said base member and then both sides of each of said grooves are plastic-deformed to joint said fins in said base ... 09/22/05 - 20050205240 - Finned heat sink A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil ... 09/22/05 - 20050205239 - Ebullition cooling device for heat generating component The invention provides an ebullition cooling device 1 for a heat generating component B which device comprises a boiling unit 2 for boiling a refrigerant A contained therein with the heat generated by the heat generating component B as attached to an outer surface of the unit, a condensing unit ... 09/15/05 - 20050199371 - Heat sink and method of making the same A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base ... 09/15/05 - 20050199370 - Heat dissipation module for cpu A heat dissipation module for CPU has a heat dissipation device, a fan-fixing frame and a fan. The fan-fixing frame is located on the heat dissipation device and has a top plate, four posts and a plurality of elastic pressing components. The posts extend downwardly from four comers of the ... 09/15/05 - 20050199369 - Dual centrifugal fan structure and heat dissipation device having the fan structure A dual centrifugal fan structure having a first centrifugal fan, a second centrifugal fan, and a housing is disclosed. The housing is a hollow enclosure divided into a first chamber and a second chamber for installing the first and second centrifugal fans, respectively. The first and second chambers have first ... 09/15/05 - 20050199368 - Laminated fin heat sink for electronic devices A heat sink may transfer heat from electronic devices. A heat conductive base may have integrally attached thereto a plurality of parallel fins. The fins may be made up of two sheets of material. One sheet may be a metal having significant structural integrity and the other sheet of material ... 09/15/05 - 20050199367 - Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device The present invention relates to a method for heat dissipation in mobile radio devices, with heat-radiating electrical components, whereby the heat-radiating components are brought into heat-dissipating contact with a metal film. The present invention further relates to a mobile radio device with heat-radiating electrical components, whereby each component is in ... 09/01/05 - 20050189088 - Circulation structure of heat dissipation device A heat dissipation device includes a heat conducting plate, a fin set, a mask enclosing the fin set, and a fan. The fin set is located on the heat conducting plate. The mask has an air inlet formed on a front side and an air outlet formed on a top ... 08/25/05 - 20050183843 - Heat sink A heat sink, which comprises a plurality of flat fins erected on a surface of a base portion, and an air passage defined by the flat fins. In the heat think, at least one of the side end portions of one of the flat fins protrudes outwardly from a peripheral ... 08/18/05 - 20050178528 - Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof In an electronic apparatus having a liquid cooling system, and enabling to obtain the optical cooling characteristic or capacitor with an aid of a radiator, which can be disposed or located fitting to a narrow space within a housing thereof, wherein a CPU 200 in deed of cooling thereof is ... 08/18/05 - 20050178527 - Heat dissipation device for electronic device A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation ... 08/04/05 - 20050167085 - Graphite-based heat sinks and method and apparatus for the manufacture thereof One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint ... 08/04/05 - 20050167084 - Graphite-based heat sinks and method and apparatus for the manufacture thereof One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint ... 08/04/05 - 20050167083 - Heat sink including redundant fan sinks A cooling device for electronic devices is built comprising at least two fan sinks thermally coupled together such that when one fan sink fails, the remaining fan sinks are able to compensate for the failed fan sink. Optionally, the remaining fan sinks may be controlled to speed up upon detection ... 08/04/05 - 20050167082 - Heat sink-type cooling device for an integrated circuit A heat sink-type cooling device for an integrated circuit having a base and plurality of fin extended upward. The plurality of fins are divided into more than one heat zones and said plurality of heat zones have a height drop between each two zones wherein a rectangular hole can also ... 07/28/05 - 20050161196 - Heat radiator for a cpu A heat radiator for a CPU is composed of a metal piece, a columned radiating piece and a fan. The metal piece has a top surface, a bottom surface, and a conical surface formed between the top surface and the bottom surface, wherein a diameter of the top surface is ... 07/28/05 - 20050161195 - System for reliably removing heat from a semiconductor junction The system includes a heat sink member which is permanently attached to a semiconductor integrated circuit which is part of an integrated circuit board assembly, which in turn is part of an electronic equipment unit. A mounting member is positioned in the equipment chassis, adjacent to the integrated circuit board ... 07/21/05 - 20050155743 - Composite heat sink with metal base and graphite fins A composite heat sink apparatus includes a metal base which has a thermal conductivity of at least about 150 W/m° K. The metal base is preferably constructed either of copper of aluminum. The heat sink apparatus further includes a plurality of fins attached to the base, the fins being constructed ... 07/21/05 - 20050155742 - Heat sink combining assembly The present invention discloses a heat sink combining assembly, which comprises a plurality of metallic heat dispersing fins and a fixing bar, wherein each metal heat dispersing fin at its top surface has a groove, and a securing hole is disposed in the groove for connecting the metallic heat dispersing ... 07/14/05 - 20050150634 - System for cooling environmentally sealed enclosures A system for cooling an environmentally sealed enclosure. The system includes an air channel extending generally vertically from a top surface of the enclosure to a bottom surface of the enclosure, at least one interior heat sink forming a barrier between the air channel and an interior portion of the ... 07/14/05 - 20050150633 - Heat sink and method for manufacturing the same A heat sink and a method for manufacturing a heat sink are described. A plate-like base is manufactured with a plurality of parallel grooves and a plurality of fins by an impact extrusion process. A high temperature heat treatment is performed to soften the plate-like base. The fins are positioned ... 07/07/05 - 20050145367 - Thermal interface An apparatus including an interface having a number of nanostructures is described. The apparatus comprises heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface a substrate has a number of nanostructures to facilitate heat transfer and adhesion between ... 07/07/05 - 20050145366 - Heat-sink with large fins-to-air contact area A heat sink adapted for cooling a heat generating component, operative with an air moving means to generate airflow and remove the generated heat. The heat sink comprises a heat conducting element in thermal contact with the heat generating component, which is also in thermal contact with a plurality of ... 06/23/05 - 20050133199 - Heat sink with heat pipes A heat sink for dissipating heat generated by an integrated circuit package includes a flat base 10, two vertical U-shaped heat pipes 20 and a heat dissipation body. The heat dissipation body includes a pair of side plates 40 and a plurality of fins 50 sandwiched between the side plates ... 06/23/05 - 20050133198 - Folded fin heat sink assembly A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one ... 06/23/05 - 20050133197 - Heat dissipating device A heat dissipating device comprises a turbine-type fan having a plurality of blades; a cover covering the blades; a wind collecting mask installed below the cover; and a wind outlet formed in the wind collecting mask. A heat dissipating seat is installed below the turbine-type fan; and a plurality of ... 06/16/05 - 20050126755 - Method and apparatus for improved flame stabilization A method and apparatus is provided for flame stabilization immediately downstream of a plurality of discrete fuel and air streams, prior to the mixing of the fuel and air, thereby preventing auto-ignition and flashback events. Coplanar and interspersed discrete fuel and air streams are introduced into a multiple channel monolith ... 06/16/05 - 20050126754 - Heat exchanger A heat exchanger which has a base plate and several carrier plates projecting from the base plate. At least one cooling element is located on each carrier plate. The cooling elements have a substrate with an underside and an upper side. Webs project from the upper side of the substrate ... 06/16/05 - 20050126753 - Heat dissipation assembly with resilient fastener A heat dissipation assembly includes a heat sink (20), a backplate (50), a pair of posts (60) and a fastener (10). The heat sink is attached on a CPU (30) which is mounted on a PCB (40). The backplate is disposed below the PCB. The fastener includes a main body ... 06/09/05 - 20050121173 - Stacked type cooler A stacked type cooler 1 for cooling a plurality of electronic components 6 from two surfaces of each component includes a plurality of cooling tubes 2 having a flat shape and coolant flow passage 21 for allowing a coolant to flow, and a connecting pipe 3 for communicating these cooling ... 06/09/05 - 20050121172 - Composite heatsink for cooling of heat-generating element A composite heatsink for cooling of heat-generating element comprises upper and lower components. The upper component comprises a cover plate and a first set of heat-exchanging means thermally connected with one side of the cover plate. The lower component comprises a base and a second set of heat-exchanging means thermally ... 06/09/05 - 20050121171 - Jet flow generating apparatus, electronic apparatus, and jet flow generating method A jet flow generating apparatus that suppresses noise as much as possible and effectively radiates the heat generated by a heat generating member, an electronic device that is equipped with the jet flow generating apparatus, and a jet flow generating method are provided. According to the present invention, a jet ... ### FreshPatents.com Support |