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Heat Exchange > With Retainer For Removable Article > Electrical Component Electrical ComponentElectrical Component patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.08/16/07 - 20070187068 - Heat dissipation apparatus A heat dissipation apparatus used in a computer comprises a heat sink and an angularly shaped spring with multiple directional arms, wherein each of the directional arms extends in a corresponding direction and the tangent directions of the contact boundary between the heat sink and the multi directional arms on ... 06/21/07 - 20070137835 - Thermal conductive apparatus A thermal conductive apparatus includes a first electrode sheet, a second electrode sheet, a cooling sheet, and a polymer dielectric layer. The polymer dielectric layer physically contacts the first electrode sheet and the second electrode sheet via the top surface thereof, and the cooling sheet via the bottom surface thereof, ... 06/07/07 - 20070125517 - Cooling element for heat dissipation in electronic components A cooling element for heat dissipation in one or more electronic components includes a metal element with one or more slit-shaped receiving openings for one or more electronic components that are to be cooled. In its lengthwise extension, each receiving opening has a receiving bore that holds a helical spring ... 05/31/07 - 20070119565 - Cooling device A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels ... 04/26/07 - 20070089857 - Systems for discretized processing of regions of a substrate The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of new materials, processes, and process sequence integration schemes used in integrated circuit fabrication. A substrate having an array of differentially processed regions thereon is ... 02/01/07 - 20070023165 - Thermally conductive two-part adhesive composition The present invention relates to a two part thermally conductive adhesive composition comprising: a first part comprising: a polymerisable monomer component which is (meth)acrylate based; a peroxide-based curing agent component; one or more co-curative components selected from: primary, secondary or tertiary amines or compounds containing the group —CONHNH—; a stabilising ... 01/18/07 - 20070012421 - Grease protecting apparatus for heat sink A grease protecting apparatus (10) includes a heat sink (12), and a grease cover (14). The heat sink includes a bottom surface (122) for contacting with a heat-generating component. A layer of thermal grease (16) is spread on the bottom surface of the heat sink. The grease cover is attached ... 01/18/07 - 20070012420 - Fixing device for a radiator A fixing device for a radiator mainly provides a joining side extending outward from a lateral side of each of the elastic members thereof and has a plurality of locating parts in the elastic members. The joining side is inserted into two lower lateral sides of the radiator and locating ... 12/07/06 - 20060272797 - Cooling device for an electric component A cooling device has a cooling element (3) and a pressing device (4) which presses the component (1) against the cooling element (3). The pressing device (4) is resilient and is connected to the cooling element in a positive fit in order to produce fixing means which fix the component ... 11/23/06 - 20060260784 - Microjet module assembly Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal ... 10/05/06 - 20060219385 - System and apparatus for fixing a substrate with a heat transferring device A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: a substantially rod-shaped positioning member having a length generally symmetrically oriented about an axis and a generally constant lateral expanse substantially perpendicular with said axis substantially along said length; said positioning member ... 08/10/06 - 20060175041 - Foil slot impingement cooler with effective light-trap cavities A slot impingement cooler is formed of a plurality of sets of foils in a stacked and registered array. In each set of foils, a first foil has supply slots that direct a flow of coolant, a second foil has a plurality of effective light-trap cavities, a third foil has ... 07/20/06 - 20060157221 - Micro-scale cooling element The invention relates to a micro-scale cooling element (1) having a mounting surface (2) for a constituent part, in particular a semiconductor component, that is to be cooled, which element is configured, in particular, cuboidally and has in the interior a micro-scale cooling structure (3) that is connected via connecting ... 04/13/06 - 20060076121 - Heat sink A heat sink (10) includes a plurality of fins (12) joined with each other. In one embodiment, each fin includes a main body (13) with an elongated flange (14) and two shortened flanges (16) extending from each of two opposite sides thereof. The shortened flanges extend from the body in ... 04/06/06 - 20060070720 - Heat riser A heat riser for bridging the gap between a heat source and a heat dissipation device in an electronic component, the heat riser formed of a flexible graphite article having two operative surfaces, one of which is in operative contact with a surface of the heat source and the other ... 03/23/06 - 20060060328 - Heat-transfer devices Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide ... 12/29/05 - 20050284607 - Cooling-assisted, heat-generating electrical component and method of manufacturing same A cooling-assisted, heat-generating electrical component reduces heat generated during operation. The electrical component, typically a resistor, has a least one heat-removing element electrically associated therewith. Heat-removing element comprises a plurality of thermal vias therein and is fixedly attached to an end portion of the electrical component, typically on opposed end ... 12/15/05 - 20050274489 - Heat exchange device and method A heat exchange device comprising a fluid flow passage having a plurality of successive segments in fluid flow communication with one another, the segments being adapted to maintain a developing flow therein and thereby improve heat transfer. ... 12/15/05 - 20050274488 - Heat-pipe engine structure A heat-pipe engine structure applicable to heat-exchange system. The heat-pipe engine structure includes a metal mesh laminate composed of more than two metal meshes which are tightly laminated with each other to form numerous meshes several times the unlaminated meshes of any original metal mesh. An upper metal film and ... 12/15/05 - 20050274487 - Method and apparatus for reducing thermal resistance in a vertical heat sink assembly A method and apparatus for an electronic package includes a substrate; a heat source component operably coupled to the substrate, and in direct contact with and electrically connected to a top surface of the substrate; a heat sink assembly in thermal communication with the substrate. The heat sink assembly includes ... 12/01/05 - 20050263264 - Heat sink mounting device A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to the pole, and at least ... 11/24/05 - 20050257912 - Laser cooling system and method A folded sheet is used as a basis for a fin array to cool laser modules. The folded sheet has flat portions that are connected in thermal contact with the laser module, and fins formed by interconnecting portions. This arrangement is highly convenient for assembly, inexpensive, and provides for highly ... 11/17/05 - 20050252637 - Heat sink and method for making same A heat sink (5) for dissipating heat from an electronic component includes a base (50), and a plurality of fins (52) formed on the base. The base and the plurality of fins are integrally formed by sintering one or two metallic nano-powders. Since the heat sink is integrally formed by ... 10/06/05 - 20050217823 - Aluminum bonding member and method for producing same There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member 10 has an aluminum member 12 of aluminum or an aluminum alloy exposed to the outside, and a ... 08/25/05 - 20050183842 - Fastening device for a radiator A radiator with a securing device for cooling the heat generating unit, which is attached to a base plate. The securing device basically is a locating part with a locating opening and disposed beneath the radiator to support and locate the radiator. There are secure arms with fixing holes extending ... 08/18/05 - 20050178526 - Liquid cooling system, and electronic apparatus having the same therein In a cooling system of liquid type, dissolving a problem upon starting when applying a centrifugal pump therein, and being freely applicable into various kinds of electronic apparatuses, easily, for cooling a CPU in need of cooling thereof, which is mounted within a housing 100, the system comprises: a cooling ... 07/07/05 - 20050145365 - Guide flow heat sink A heat sink includes a heatsink board, and a cooling fan. The heatsink board includes a top plate, a bottom plate, and a plurality of separation plates forming a plurality of guide layers between the top plate, the separation plates and the bottom plate. Each of the guide layers is ... 06/16/05 - 20050126752 - Electronic apparatus A liquid cooling jacket and a system for use in an electronic apparatus, preferable in the cooling capacity or performance, with less in man-hour and manufacturing costs in need of process thereof, and applicable into a narrow space, wherein a plural number of lamination plates, each being formed through the ... ### FreshPatents.com Support |