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Adhesive Bonding And Miscellaneous Chemical Manufacture > Methods > Surface Bonding And/or Assembly Therefor > With Vitrification Or Firing Ceramic Material > Forming Electrical Article Or Component Thereof > Elemental Metal Or Alloy Containing > Copper Containing

Copper Containing

Copper Containing patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

11/15/07 - 20070261778 - Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a ...



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