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Adhesive Bonding And Miscellaneous Chemical Manufacture > Methods > Making Electrical Conductors Of Indefinite Length > Covering Of Conductor > With Preformed Material > Wrapping Of Sheet Material (e.g., Tape) About Conductor And/or Conductor Assembly Wrapping Of Sheet Material (e.g., Tape) About Conductor And/or Conductor AssemblyWrapping Of Sheet Material (e.g., Tape) About Conductor And/or Conductor Assembly patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.06/28/07 - 20070144652 - System for manufacturing an inlay panel using a laser A method for manufacturing a laser-cut, inlayed panel uses a computerized laser-cutting technique that includes the steps of: providing an art master rendering that is desired to constitute a decorative design for the inlaid panel; scanning electronically the art master to form an art master data file; transferring the art ... 02/22/07 - 20070039675 - Fluoropolymer-based material in tape or varnish form suitable for laser marking The present invention relates to a fluoropolymer-based coating material in tape or varnish form suitable for laser marking and containing as additive from 0.5% to 5% by weight of at least one polyimide comprising repeating units which include at least one group Ar—X—Ar′, in which Ar and Ar′ represent independently ... 06/08/06 - 20060118228 - Method and apparatus for producing a wiring board, including film-peeling A method for manufacturing a wiring board offering efficient operations of peeling and collection of a protective film as well as preventing a lowered yield. A method for manufacturing a build-up multilayer resin wiring board, which includes a taping process S2 and a peeling process S3. In the taping process ... 02/23/06 - 20060037687 - Methods for cable sealing Methods for providing a cable closure enclosing a cable splice include wrapping a flexible wrap including a gel layer and a flexible support layer around the cable splice with the gel layer adjacent the cable splice. The gel layer may have an adhesion-reducing substance applied on at least part of ... ### FreshPatents.com Support |