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Cleaning And Liquid Contact With Solids > Liquid Treating Forms And Mandrels > For Metallic, Siliceous, Or Calcareous Basework, Including Chemical Bleaching, Oxidation Or Reduction For Metallic, Siliceous, Or Calcareous Basework, Including Chemical Bleaching, Oxidation Or ReductionFor Metallic, Siliceous, Or Calcareous Basework, Including Chemical Bleaching, Oxidation Or Reduction patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/24/08 - 20080017220 - Apparatus for cleaning a substrate having metal interconnects The present invention relates to a cleaning apparatus which can reduce a potential difference between metals or alloys used to form interconnects on a substrate for thereby minimizing corrosion which may occur during and after a substrate cleaning process. The cleaning apparatus for cleaning a substrate having metal interconnects comprises ... 01/10/08 - 20080006294 - Solder cooling system A system for processing a substrate having solder bumps includes a first region having a first pressure and adapted to receive the substrate for heating; a second region having a second pressure greater than the first pressure and adapted to receive the substrate for cooling; a support member constructed and ... 12/27/07 - 20070295357 - Removing metal using an oxidizing chemistry A method of removing a metal includes exposing at least a portion of a metal-to-metal removal chemistry, wherein the metal removal chemistry comprises a chlorine-rich superoxidizer. In one embodiment, the metal being removed is a metal, such as a noble metal, that did not react with the semiconductor device during ... 10/25/07 - 20070246065 - Ion sampling method for wafer An ion sampling method for wafer provides a wafer in a sampling chamber, wherein the wafer surface that is going to be sampled faces upward; spraying an extraction liquid continuously on the wafer surface to form a liquid film thereon; keeping the thickness of the film constant for dissolving the ... 10/11/07 - 20070235061 - Cleaning agent for substrate and cleaning method The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, ... 09/27/07 - 20070221245 - Cleaning and polishing rusted iron-containing surfaces A method for cleaning and polishing a rusted iron-containing metal surface is disclosed. The metal surface is contacted with a composition containing fluorometallate anions of a Group IVB metal. ... 08/30/07 - 20070199579 - Substrate treatment method, substrate treatment apparatus, and semiconductor device manufacturing method According to an aspect of the invention, there is provided a substrate treatment method including performing a treatment including intermittently supplying a cleaning fluid to a central area of a treatment substrate while continuously rotating the substrate, and continuously supplying a cleaning fluid to a peripheral area of the substrate, ... 08/09/07 - 20070181149 - Single wafer backside wet clean A method and apparatus for cleaning a backside of a substrate is disclosed. The method includes placing the substrate parallel to a platter, wherein the backside of the substrate is facing a top side of the platter in a spaced apart relation, thus defining a gap therebetween. Subsequently, a liquid ... 07/05/07 - 20070151576 - Treatment systems and methods Improved immersion vessel configurations for treatment of precision manufactured devices such as semiconductor wafers are provided. In one aspect, an immersion vessel is provided wherein the sidewalls of the immersion vessel are less than about 10 mm from the major surfaces of the wafer or wafers. In another aspect, an ... 06/21/07 - 20070137672 - Spin cleaning apparatus and wafer cleaning method To provide a wafer cleaning method capable of restricting breakage of fine structures disposed on a wafer, and a spin cleaning apparatus enabling such cleaning. The spin cleaning apparatus injects a cleaning liquid on a wafer surface while moving a nozzle, and at the same time, with an ultrasonic wave ... 06/14/07 - 20070131247 - Method and apparatus for surface tension control in advanced photolithography A method and apparatus for cleaning and drying a semiconductor wafer is disclosed. Within a sealable chamber, a wafer having photoresist features thereon is spun while a cleaning fluid is applied to the top surface of the semiconductor wafer to clean off excess photoresist. A rinsing solution is applied to ... 06/07/07 - 20070125400 - In-line wafer cleaning system and method A wafer cleaning system includes a wafer chuck for holding a wafer top side down and a stage having a top surface opposing the wafer. The top surface of the stage includes thereon a plurality of cleaning liquid nozzles, a plurality of rinsing liquid nozzles, a central drain funnel and ... 05/10/07 - 20070102021 - Solvent compositions comprising unsaturated fluorinated hydrocarbons Disclosed is a method for removing residue from a surface comprising: contacting the surface with a composition comprising at least one unsaturated fluorinated hydrocarbon selected from the group consisting of compounds having the formula E- or Z-R1CH═CHR2, wherein R1 and R2 are, independently, C1 to C6 perfluoroalkyl groups, or C1 ... 05/03/07 - 20070095363 - Substrate cleaning apparatus and substrate cleaning method A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into ... 04/19/07 - 20070084482 - Apparatus and method for cleaning semiconductor wafer Method and apparatus for precisely removing dusts from a side edge of a wafer, improving a production yield of wafers, and reducing a manufacturing cost for semiconductor devices. The apparatus includes: a retaining table having a circular top plan view, capable of retaining the wafer disposed on the top surface, ... 04/19/07 - 20070084482 - Apparatus and method for cleaning semiconductor wafer Method and apparatus for precisely removing dusts from a side edge of a wafer, improving a production yield of wafers, and reducing a manufacturing cost for semiconductor devices. The apparatus includes: a retaining table having a circular top plan view, capable of retaining the wafer disposed on the top surface, ... 04/12/07 - 20070079848 - Method and apparatus for removing contamination from substrate A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid ... 04/05/07 - 20070074739 - Cleaning method of treatment equipment and treatment equipment In a state of the inside of a treatment chamber of treatment equipment being evacuated, therein a cleaning gas containing trifluoroacetic acid (TFA) as a cleaning agent is supplied. Metal such as copper used in the formation of an interconnection or an electrode and stuck on an inner wall surface ... 04/05/07 - 20070074738 - Cleaning method of semiconductor manufacturing apparatus and semiconductor manufacturing apparatus A cleaning method of a semiconductor manufacturing apparatus begins by introducing film forming gas include reaction gas not forming a film by itself to reaction chamber to form the film on a semiconductor substrate, decreasing pressure of the reaction chamber, solidifying or liquefying the reaction gas to form particles by ... 03/22/07 - 20070062560 - Process for cleaning wafers in an in-line cleaning process A wafer cleaning process includes the steps of supplying a cleaning liquid while rotating the wafer at a first rotational speed, supplying a rinsing liquid on the wafer at a second rotational speed substantially equal to the first rotational speed, supplying a rinsing liquid on the central area of the ... 03/22/07 - 20070062559 - Electronic device cleaning equipment and electronic device cleaning method An electronic device cleaning method includes the steps of: placing, on a processing face, a semiconductor substrate having an obverse face portion in which an electronic device is formed so that the processing face faces a reverse face of the semiconductor substrate; diselectrifying at least the reverse face of the ... 03/01/07 - 20070044817 - Wafer protection system employed in chemical stations Semiconductor wafers have ashed photoresist residue and/or post-etch residue thereon to be cleaned through the chemical wet station, and a pattern of exposed metal layer. Post-etch residue removing solvent such as EKC-270 is fed into the solvent tank through a first solvent valve and first liquid feeding conduit that connected ... 02/22/07 - 20070039631 - System and method for removing particles in semiconductor manufacturing A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path. ... 02/15/07 - 20070034229 - Silicon wafer cleaning method A silicon wafer cleaning method, comprising a first cleaning process, in which, after completion of mirror polishing of the surface, the silicon wafer is immersed in a non-ionic surfactant aqueous solution; a second cleaning process, in which the wafer, after completion of the first cleaning process, is immersed in a ... 02/08/07 - 20070028945 - High purification method of jig for semiconductor heat treatment A method for achieving high purity in a jig for semiconductor heat treatment includes subjecting a semiconductor heat treatment jig made of a substrate having a surface covered with a silicon carbide film grown by chemical vapor deposition or a semiconductor heat treatment jig made of a silicon carbide film ... 01/18/07 - 20070012338 - Methods and removers for removing anodized films A remover contains an alkaline component, a bivalent zinc ion, a ferric ion, a chelating agent, and a nitrate ion. By using this remover, an anodized film can be selectively removed from an aluminum or aluminum-alloy member. ... 01/11/07 - 20070006894 - Process solutions containing surfactants used as post-chemical mechanical planarization treatment Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP ... 12/28/06 - 20060289035 - Surface cleaner The present invention relates to methods of use for photocatalytic cleaning compositions and photocatalytic cleaning compositions effective to degrade soils deposited on a surface, to reduce the accumulation of soils on a surface, and to act as an antimicrobial agent. ... 12/07/06 - 20060272676 - Cleaning method and a cleaning device for cleaning an edge portion and back face of a wafer A method for cleaning a wafer includes measuring a cross-sectional shape of an edge portion of wafer cut along a radial direction, assigning the measured shape to one of a plurality of groups classified by the shapes, determining an amount of cleaning liquid to be supplied and rotational speed at ... 11/23/06 - 20060260647 - Cleaning method and solution for cleaning a wafer in a single wafer process The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present invention the cleaning solution ... 11/23/06 - 20060260646 - Method to address carbon incorporation in an interpoly oxide A method of removing a mask and addressing interfacial carbon chemisbored in a semiconductor wafer starts with placing the semiconductor wafer into a dry strip chamber. The dry stripping process is performed to remove the mask on the semiconductor wafer. The semiconductor wafer is then subjected to a cleaning solution ... 11/23/06 - 20060260645 - Methods and apparatus for processing wafers A method of processing wafers or batches of wafers sequentially in a vacuum chamber (10). The method involves removing a wafer (25) from a location on a support (11); chemically cleaning particles from the support to form volatile components; and placing the subsequent wafer on the cleaned support. The method ... 11/16/06 - 20060254617 - Etching residue removal method and semiconductor device fabrication method using this method An etching residue removal method includes a cleaning sequence. Preferably, the cleaning sequence has a first washing processing, first drying processing, stripper processing, rinsing processing, second washing processing and second drying processing. In the first washing processing, an insulation film and metal lines thereon are washed by pure water. In ... 11/16/06 - 20060254616 - Temperature control of a substrate during wet processes Embodiments of the invention provide methods of applying a liquid to a backside of a substrate to bring the substrate to the temperature of the liquid. By controlling the temperature of the substrate the temperature of the semiconductor processing liquid may be maintained at a particular temperature or a type ... 11/16/06 - 20060254615 - Treatment of substrate using functionalizing agent in supercritical carbon dioxide During the processing of substrates, the substrate surface may be subjected to a cleaning process using supercritical CO2. Surface matter may remain, for example, because it is only minimally soluble in the supercritical CO2. For example, an oxidation cleaning process causes the substrate structure to cleave at several points leaving ... 11/02/06 - 20060243301 - System and process for producing clean glass aggregate from recycled glass An apparatus and method for producing clean glass aggregate from recycled glass articles is described. The apparatus includes a crushing device, a screening device, and a specially designed screw washer. The screw washer includes an inclined housing and a rotating auger in the housing. A basin in the lower end ... 10/26/06 - 20060237033 - Cleaning apparatus and method In an embodiment, a cleaning apparatus and method can prevent adsorption of nano-size particles by wafers. The apparatus includes a cleaning chamber for filling with a cleaning solution for cleaning an object and a drying chamber disposed over the cleaning chamber for drying the object by supplying drying fluid from ... 10/26/06 - 20060237032 - Cleaning method for semiconductor elements A method for cleaning semiconductor elements includes steps of positioning the semiconductor elements; washing the semiconductor elements by high-pressure water steam or solvent steam from front, top and rear sides to blow out soldering flux or oil residue; and repeating washing by steam two or three times. As the steam ... 10/05/06 - 20060219259 - Method of cleaning a semiconductor wafer A method of cleaning a semiconductor wafer, including the steps of supplying a mixed solution of a dilute hydrofluoric acid solution and hydrogen peroxide solution to a bath; loading the semiconductor wafer into the bath such that the semiconductor wafer is dipped into the mixed solution, and rinsing the semiconductor ... 10/05/06 - 20060219258 - Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance Rinsing and drying a surface of a microelectronic device and the enhanced removal of rinse fluid from the surface of the microelectronic device while the microelectronic device is rotated is provided as part of a spray processing operation. Rinse fluid is generally directed to the surface of the microelectronic device ... 09/07/06 - 20060196527 - Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods A method of surface processing a substrate that enables deposit to be removed from a substrate so as to obtain a clean substrate. A substrate is cleaned with a liquid chemical. A deposit which is formed through the cleaning with liquid chemical is exposed to an atmosphere of a mixed ... 09/07/06 - 20060196526 - Methods of spin-on wafer cleaning A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 to 100 KPa. ... 08/31/06 - 20060191556 - Substrate processing apparatus and substrate processing method In a substrate processing apparatus (1), a ring-shaped cover part (61) opposed to an annular surface (51a) of a rotating part (51) is provided and the rotating part (51) rotates the substrate (9) while holding the substrate (9). An exhaust flow space (64) connecting with a gap space (62) between ... 08/24/06 - 20060185688 - Semiconductor wafer cleaning method and wafer cleaned by same method A semiconductor wafer cleaning method has steps of cleaning a surface of a semiconductor wafer with a cleaning solution that has an etching function; and cleaning the surface of the semiconductor wafer with a high-purity organic solvent while circulating the high-purity organic solvent so as to remove Ca and Mg ... 08/17/06 - 20060180177 - Semiconductor substrate cleaning system A modular semiconductor substrate cleaning system is provided that processes vertically oriented semiconductor substrates. The system features a plurality of cleaning modules that may include a megasonic tank-type cleaner followed by a scrubber. An input module may receive a horizontally oriented substrate and rotate the substrate to a vertical orientation, ... 08/17/06 - 20060180176 - Wafer chucking apparatus for spin processor A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer ... 08/10/06 - 20060174913 - Apparatus for and method of wet processing semiconductor substrates A wet processing apparatus includes a bath in which a plurality of semiconductor substrates are to be seated, and which bath has drain valves defining drain openings between a bottom wall and the lower portions of side walls of the bath. Each of the drain valves also includes a gate ... 07/13/06 - 20060151003 - Brush for cleaning wafer In a formulation of a wafer cleaning brush, forming a polymer solution with a plurality of nano-scale porogens or with a synthetic pore forming agent and curing the polymer solution to form a porous polymeric material. ... 07/06/06 - 20060144421 - Semiconductor substrate treating method, semiconductor component and electronic appliance A semiconductor substrate treating method is disclosed that can selectively remove contaminants or unnecessary substances present on the surface of a semiconductor substrate. Also disclosed are a semiconductor component of enhanced reliability produced by this method and an electronic appliance incorporating the semiconductor component. The semiconductor substrate treating method comprises ... 07/06/06 - 20060144420 - Apparatus and method for manufacturing semiconductor device An apparatus for manufacturing a semiconductor device performs wet cleaning of a semiconductor wafer in a cleaning chamber, transfer of the wet-cleaned semiconductor wafer into a drying chamber and drying of the semiconductor wafer in the drying chamber. The apparatus includes an atmosphere control means for controlling the atmosphere near ... 07/06/06 - 20060144419 - Method of degasification in semiconductor cleaning A method of improving the effectiveness of semiconductor cleaning solvents is provided. Insoluble gas bubbles, typically air, hinder wet chemical cleaning methods. Preferred embodiments include purging a first, insoluble gas from the cleaning system and replacing it with a second, soluble gas. After replacing the first gas with the second ... 06/29/06 - 20060137714 - Apparatus for removing edge bead in plating process for fabricating semiconductor device An apparatus for removing an edge bead in, e.g., a plating process for fabricating a semiconductor device is provided, by which a wafer surface may be prevented from being oxidized by a chemical used in an edge bead removal (EBR) process. The apparatus may includes a spin chuck; a wafer ... 06/29/06 - 20060137713 - Apparatus for cleaning wafer and method of pre-cleaning wafer for gate oxide formation An apparatus and a method for cleaning a wafer are described. A wafer is inserted into a bath by a loader, is supported by a guide in the bath, and is rotated by a roller. A cleaning solution such as dilute HF may remove impurities from the wafer by an ... 06/29/06 - 20060137712 - Cleaning apparatus and method for electronic device A method for cleaning electronic devices including the step of cleaning a target substrate placed in a cleaning chamber by etching using a cleaning solution which is circulated for reuse in a cleaning solution circulation path including at least the cleaning chamber and a cleaning solution circulation line, the method ... 06/15/06 - 20060124153 - Enhanced wafer cleaning method A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface ... 06/01/06 - 20060112971 - Method of eliminating galvanic corrosion in copper cmp A method for cleaning a semiconductor wafer surface comprises sweeping the semiconductor wafer surface and applying a first cleaning solution having a first pH, stop applying the first cleaning solution and applying a first rinsing solution to the semiconductor wafer surface, the first rinsing solution having a second pH that ... 05/25/06 - 20060107970 - Method and apparatus for cleaning semiconductor substrates According to one aspect of the present invention, a method and apparatus for cleaning a semiconductor substrate is provided. The method may include supporting a semiconductor substrate, the semiconductor substrate having a surface, and dispensing an amount of semiconductor substrate processing liquid onto the surface of the semiconductor substrate, the ... 05/18/06 - 20060102198 - Rotational thermophoretic drying A method that includes rotating a wafer, heating the wafer, applying a first liquid through one or more nozzles to a center of a topside of the wafer that is cooler than the heated wafer, and translating the one or more nozzles to an outer diameter edge of the wafer. ... 05/11/06 - 20060096613 - Semiconductor wafer washing system and method of supplying chemicals to the washing tanks of the system A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, ... 05/11/06 - 20060096612 - System and method for aligning wafers within wafer processing equipment Systems and methods for aligning wafers within wafer processing equipment. In a first embodiment, a wafer alignment nozzle comprises a fixed cylindrical member. A moveable cylindrical member is disposed with the fixed cylindrical member in a sliding fit. The moveable cylindrical member comprises a plurality of angled fluid orifices for ... 04/20/06 - 20060081270 - Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the ... 04/20/06 - 20060081269 - Method and apparatus for cleaning and drying wafers The present invention is directed to a method and an apparatus for cleaning and drying wafers. The apparatus includes an injection unit having first and second injection ports configured for injecting different fluids and arranged in a moving direction of the rose or on a line adjacent to the moving ... 04/13/06 - 20060076034 - Cleaning method and cleaning apparatus for performing the same A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the ... 03/30/06 - 20060065289 - Method of cleaning a film-forming apparatus and film-forming apparatus A method of cleaning a film-forming apparatus to remove a silicon-based material deposited on a constituent member of the film-forming apparatus after being used to form thin films includes introducing a first gas including fluorine gas and a second gas including carbon monoxide gas into the film-forming apparatus, and heating ... 03/30/06 - 20060065288 - Supercritical fluid processing system having a coating on internal members and a method of using A processing system utilizing a supercritical fluid for treating a substrate is described as having internal members having a coating. For example, the coating in internal members can reduce particulate contamination during processing. Additionally, a method for using the processing system is described. ... 03/30/06 - 20060065287 - Cluster tool process chamber having integrated high pressure and vacuum chambers A cluster tool includes a transfer chamber connected to a plurality of vacuum chambers. An additional process chamber connected to the transfer chamber includes a high pressure chamber assembly seated on a housing. The high pressure chamber assembly, which is adjustable between an open position and a closed position, includes ... 03/23/06 - 20060060213 - Manufacture of ultra-clean surfaces by selective A method and apparatus for removing surface impurities from a surface of a material, particularly silicon wafers, includes identifying the location of at least one impurity particle on a surface of the material and applying a liquid to the surface in the vicinity of the at least one impurity particle. ... 03/09/06 - 20060048792 - Substrate cleaning method and developing apparatus A cleaning method highly effectively cleans a surface of a semiconductor wafer by removing a dissolution product, produced when a surface of a semiconductor wafer is processed by a developing process that develops an exposed film formed on the semiconductor wafer by wetting the exposed film with a developer, from ... 03/02/06 - 20060042654 - Semiconductor wafer treatment method and apparatus therefor In the ozone water treatment process, the silicon wafer is treated with the first ultra-pure water that includes ozone. The first ultra-pure water is refined by the ultraviolet ray sterilization method. The first ultra-pure water includes total organic carbon content of more than 1 μg/liter and not more than 20 ... 02/23/06 - 20060037627 - Process for treating solid surface and substrate surface Ruthenium, osmium and their oxides can be etched simply and rapidly by supplying an atomic oxygen-donating gas, typically ozone, to the aforementioned metals and their oxides through catalysis between the metals and their oxides, and the ozone without any damages to wafers and reactors and application of the catalysis not ... 01/19/06 - 20060011215 - Method and reducing water spotting and oxide growth on a semiconductor structure The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel. ... 01/19/06 - 20060011214 - System and method for pre-gate cleaning of substrates A system and method for cleaning semiconductor wafers wherein the use of SCI and SC2 is eliminated and replaced by the use DIO3 and dilute chemistries. In one aspect, the invention is a method comprising: (a) supporting in a process chamber at least one semiconductor wafer having a silicon foundation ... 01/12/06 - 20060005857 - Apparatus and method for cleaning glass substrates using a cool hydrogen flame Contaminants from surfaces of temperature sensitive substrates, such as glass substrates are removed by exposing the surfaces to a hydrogen Surface-mixed diffusion flame for a predetermined duration of time. The predetermined duration of time being insufficient to heat up the surfaces substantially thereby causing damage to the temperature sensitive substrates. ... 12/29/05 - 20050284502 - Rinse and resist patterning process using the same A rinse comprising a water-soluble polymer is suited for use in a lithographic process. In the lithographic process for the fabrication of semiconductor integrated circuits involving the exposure of resist to various types of radiation (e.g., UV, deep UV, vacuum UV, electron beams, x-rays, and laser beams), the invention can ... 12/22/05 - 20050279382 - Method for cleaning a process chamber A method for cleaning silicon-containing deposits in process chamber is described. Fluorine-containing compounds and additional compounds are used for the cleaning. The deposits are removed using a cleaning gas contains fluorine-containing compounds, at least 50% of which have more than one carbon atom and are C4F8 or C2F6 molecules, and ... 12/22/05 - 20050279381 - Method for cleaning microstructure The present invention provides a method for cleaning a microstructure capable of efficiently removing pollutants such as resist residue without causing damage to a substance such as a low-k film which is necessary for a semiconductor wafer. The cleaning method includes fluidizing a cleaning agent composition essentially containing carbon dioxide ... 12/15/05 - 20050274393 - Wafer clean process A novel process for cleaning a semiconductor wafer is disclosed. The process of the invention reduces or eliminates charge-up damage caused by friction which is generated between the wafer and rinsing water or other fluid as the wafer is rotated during the cleaning process. In one embodiment of the invention, ... 12/08/05 - 20050268939 - Wet cleaning apparatus and methods Apparatus for wet cleaning is disclosed. In one example, such an apparatus includes first and second Sulfuric Acid Peroxide Mixture (SPM) baths for removing photoresist on semiconductor wafers that are sequentially provided; a Hot Quick Dump Rinse (HQDR) bath for cleaning the wafers conveyed from the first and second baths; ... 12/08/05 - 20050268938 - Method and system for supplying carbon dioxide to a semiconductor tool having variable flow requirement Provided is a novel method and system for supplying high-pressure carbon dioxide to an application having a variable carbon dioxide flow requirement. The method includes providing a high-pressure carbon dioxide feed stream to a buffer volume and determining the amount of carbon dioxide to be delivered to the application tool. ... 11/17/05 - 20050252526 - Single wafer cleaning apparatus and cleaning method thereof The single wafer cleaning method according to an embodiment of the present invention is a single wafer cleaning method of performing cleaning by a chemical liquid 8 and a rinse liquid 14 while rotating a substrate-to-be-cleaned 30, in which after chemical liquid treatment is performed by moving a chemical liquid ... 11/17/05 - 20050252525 - Method of cleaning a semiconductor substrate and cleaning recipes A cleaning method and cleaning recipes are disclosed. The present invention relates to a method for cleaning a semiconductor substrate and cleaning recipes. The present invention utilizes a first cleaning solution including diluted hydrofluoric acid and a second cleaning solution including hydrogen chloride and hydrogen peroxide (H2O2) to clean a ... 11/17/05 - 20050252524 - Permeable membrane clean station Disclosed in a cleaning apparatus (e.g., clean station) used during the production of semiconductor wafers. The clean station includes a holder for holding and rotating a semiconductor wafer, a shield surrounding the semiconductor wafer, and a dispenser positioned to dispense a cleaning fluid on the semiconductor wafer. The surface of ... 10/20/05 - 20050229947 - Methods of inserting or removing a species from a substrate Methods of inserting and removing species from substrates utilizing pressure-vent cycling are revealed in embodiments of the invention. Various embodiments introduce a fluid to a vessel containing the substrate while setting pressure at an elevated level. The pressure is maintained at the elevated level for a predetermined period of time, ... 10/13/05 - 20050224094 - Apparatus and methods for isolating bioreactive materials on a microarray substrate surface Apparatus and methods of isolating functionalizing reagents and unreacted bioreactive material in an array of microscopic sense site wells in a substrate surface and to scrub clean the sense site substrate surface. The disclosed apparatus and methods improve systems for detecting biochemical reactions to any of a variety of microarray ... 10/06/05 - 20050217697 - Aqueous stripping and cleaning composition The present invention relates to aqueous compositions used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. The compositions are comprised of a water soluble organic solvent, a sulfonic acid and water. ... 10/06/05 - 20050217696 - Methods using a peroxide-generating compound to remove group viii metal-containing residue A method for cleaning substrates to remove Group VIII metal-containing, particularly platinum-containing, residue using a cleaning composition that includes a peroxide-generating compound. ... 10/06/05 - 20050217695 - Apparatus for applying disparate etching solutions to interior and exterior surfaces Described are methods, systems, and chemistries for cleaning various components of semiconductor process equipment. A method in accordance with one embodiment cleans articles with differently contaminated interior and exterior surfaces by using those articles to separate a cleaning vessel into separate chambers, one chamber for the interior surface and one ... 09/29/05 - 20050211269 - Apparatus and method for rapid thermal control of a workpiece in liquid or dense phase fluid A surface cleaning apparatus comprising a chamber, and a thermal transfer device. The chamber is capable of holding a semiconductor structure therein. The thermal transfer device is connected to the chamber. The thermal transfer device has a surface disposed inside the chamber for contacting the semiconducting structure and controlling a ... 09/29/05 - 20050211268 - Plate-like element loading and unloading apparatus An apparatus for loading and unloading plate-like elements for machines for processing materials in plate form, comprising, on one side of a machine for processing materials in plate form, a station for loading the plate to be processed and, on the other side of the machine, a station for unloading ... 09/29/05 - 20050211267 - Rinse nozzle and method A method and apparatus for rinsing and drying a substrate (100) of a semiconductor wafer (102), has a first nozzle (110) dispensing rinsing fluid against the substrate (100); and a second nozzle (114) dispensing dry gas under pressure against the substrate (100) during a drying cycle to dry the substrate ... 09/15/05 - 20050199264 - Cmp cleaning composition with microbial inhibitor An antimicrobial cleaning composition and methods for cleaning semiconductor substrates, particularly after chemical mechanical planarization or polishing, are provided. In one embodiment, the cleaning composition combines a solvent, a cleaning agent such as a hydroxycarboxylic acid or salt thereof, and at least one antimicrobial agent resulting in a cleaning composition ... 09/15/05 - 20050199263 - Washing method and washing device A cleaning effect is improved by cleaning a component that has a recess structure by using a cleaning medium of a liquefied gas or a supercritical fluid. By the cleaning method of removing adhering substances adhering to at least the surface of the recess structure of the component that has ... 09/08/05 - 20050194023 - Method of processing selected surfaces in a semiconductor process chamber based on a temperature differential between surfaces The present invention relates to a method of processing selected surfaces in a semiconductor process chamber by creating a temperature differential between the selected surfaces and contacting the surfaces with a reactant that preferentially react with a surface at one end of the temperature differential relative to the other selected ... 09/01/05 - 20050189001 - Method for cleaning substrates using supercritical fluids A method for cleaning substrates typically after a CMP process is carried out thereon. The method includes providing a cleaning chamber, providing a substrate to be cleaned in the cleaning chamber, providing the chamber at temperature and pressure conditions favorable for formation of a supercritical cleaning fluid therein, and introducing ... 07/21/05 - 20050155626 - Apparatus and method for cleaning a machine tool An apparatus and a method for dislodging contaminants from a surface of a machine tool. A machine tool has a spindle and a housing disposed around the spindle. The apparatus includes a support plate, an arbor, and a cleaning member. The arbor is disposed on the support plate and is ... 07/14/05 - 20050150517 - Removing discoloration in heated metal using vinegar A process for removing discoloration from metal parts due to the heating of these parts. ... 06/30/05 - 20050139232 - Methods for cleaning a chamber of semiconductor device manufacturing equipment Methods for cleaning a chamber of semiconductor device manufacturing equipment are disclosed. An illustrated method comprises supplying cleaning gas into a chamber to start a cleaning process; detecting the intensity of a wavelength for the cleaning gas; fixing a valve at a predetermined position to control the pressure in the ... 06/30/05 - 20050139231 - Method of wet cleaning a surface, especially of a material of the silicon-germanium type Method of wet cleaning a surface of at least one material chosen from silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and epitaxially grown crystalline materials, such as germanium, in which method the following successive steps are carried out: a) the surface is brought into contact with an HF solution; b) the surface ... 06/30/05 - 20050139230 - Method for cleaning semiconductor wafers A method for cleaning a semiconductor wafer according to the present invention includes the steps of: removing particles on a semiconductor wafer with an alkaline chemical solution to clean the wafer; neutralizing a surface charge of the semiconductor wafer with a weak acid cleaning solution; and removing residual metal impurities ... 06/16/05 - 20050126587 - Method of cleaning a steam generator of a pressurized water reactor A method for cleaning steam generating devices of a pressurized water reactor treats the devices on their secondary sides at high pressure and high temperature. An aqueous cleaning solution is employed with EDTA, a reducing agent, and an alkalizing agent. Morpholine is used as the alkalization agent. A molar morpholine-concentration, ... 06/16/05 - 20050126586 - Method of cleaning semiconductor device fabrication apparatus A semiconductor device fabrication apparatus is cleaned after a conductive layer is formed on a metal oxide layer of a substrate. The substrate is disposed on a heater in a process chamber of the apparatus, and the conductive layer is formed by introducing source gases into the chamber. Then the ... 06/09/05 - 20050121053 - Single type of semiconductor wafer cleaning apparatus and method of using the same A semiconductor wafer cleaning apparatus includes a gas spraying unit, having a gas injection tube and a gas guard extending therearound, for spraying cleaning gas into a water layer formed on a wafer. The gas guard forms a small chamber just above the water layer, so that the partial pressure ... 06/09/05 - 20050121052 - Anti-tarnish aqueous treatment An aqueous solution that has the capacity for removing tarnish and other soil from copper, silver, gold and other noble metals and alloys thereof comprises an acid, thiourea and a transition metal salt. The aqueous material can be used to treat the surfaces of such articles for the purpose of ... ### FreshPatents.com Support |