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Cleaning And Liquid Contact With Solids > Liquid Treating Forms And Mandrels > Including Application Of Electrical Radiant Or Wave Energy To Work > Semiconductor Cleaning Semiconductor CleaningSemiconductor Cleaning patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/17/08 - 20080011321 - Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C): (A) an ethyleneoxide-type surfactant containing a hydrocarbon group which may have a substituent group except for phenyl, and a polyoxyethylene ... 01/10/08 - 20080006292 - System for megasonic processing of an article A system for megasonic processing of an article. In one aspect, the system for megasonic processing comprises a rotary support for supporting an article, a dispenser for applying a fluid to a surface of an article positioned on the rotary support; and a transducer assembly. The transducer assembly comprises (i) ... 11/29/07 - 20070272270 - Single-wafer cleaning procedure A single-wafer cleaning procedure has the steps of providing an etched wafer comprising a photo resist pattern on a front surface of the etched wafer, performing an ashing process to remove the photo resist pattern, hoisting the etched wafer to cool down the etched wafer, and performing a dry cleaning ... 11/22/07 - 20070267041 - Apparatuses and methods for cleaning test probes Apparatuses and methods for cleaning test probes used in a semiconductor testing machine of the type having a plurality of test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon. In one embodiment, the apparatus includes a roller-support arm and a ... 10/04/07 - 20070227555 - Method to manipulate post metal etch/side wall residue A method of semiconductor manufacturing to treat sidewall residue such that the side wall remains substantially vertical or peels back from the resist prior to removal of the resist by ashing or other means. ... 08/16/07 - 20070186953 - Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing Plasma systems and methods for supplying activation energy to remove cross-linked photoresist crust using ion bombardment of the substrate from a plasma, at reduced temperature, achieved in part by operating the processing chamber at low pressures. Reduced temperatures prevent “popping” of the photoresist which can cause particulate contamination. The gas ... 07/19/07 - 20070163618 - Cleaning solution for silicon surface and methods of fabricating semiconductor device using the same There are provided a cleaning solution for a silicon surface containing a buffer solution including acetic acid (CH3COOH) and ammonium acetate (CH3COONH4), iodine oxidizer, hydrofluoric acid (HF), and water. In a method for fabricating a semiconductor device, a silicon substrate may have an exposed silicon surface, which may be cleaned ... 06/14/07 - 20070131246 - Substrate processing method and substrate processing apparatus A substrate having a liquid film formed by pre-processing unit is transported by a substrate transport robot from the pre-processing unit to a freeze processing unit disposed away from the pre-processing unit. In the freeze-processing unit, the liquid film is frozen. This causes the adhesion power of contaminants adhering to ... 05/31/07 - 20070119477 - Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination present on the wafer surface. Energy imparted to particulate contamination via ... 05/31/07 - 20070119476 - Substrate processing apparatus and substrate processing method A substrate held by a spin chuck is supplied with a chemical solution by a chemical solution nozzle and a processing of the substrate is performed. At this time, the chemical solution supplied to the substrate scatters around and adheres to members (processing cup and splash guard) residing near the ... 04/19/07 - 20070084481 - System and method of cleaning substrates using a subambient process solution A system and method of cleaning a substrate utilizing sonic energy and a film of subambient gasified process solution that assists in reducing damage to the substrate. In one aspect, the invention is a method comprising: a) supporting a substrate in a substantially horizontal orientation; b) applying a solution comprising ... 04/19/07 - 20070084481 - System and method of cleaning substrates using a subambient process solution A system and method of cleaning a substrate utilizing sonic energy and a film of subambient gasified process solution that assists in reducing damage to the substrate. In one aspect, the invention is a method comprising: a) supporting a substrate in a substantially horizontal orientation; b) applying a solution comprising ... 03/15/07 - 20070056605 - Megasonic cleaning using supersaturated solution A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning ... 02/22/07 - 20070039630 - Wet clean and drying method and apparatus Systems and techniques for cleaning, including a reservoir with a first portion and a second portion. The first portion is configured to contain fluid under a receiving surface of the fluid. The second portion is configured to contain fluid under a transmitting surface of the fluid separate from the receiving ... 02/01/07 - 20070023066 - Multilayer substrate cleaning method, substrate bonding method, and bonded wafer manufacturing method The present invention is a method for cleaning a multilayer substrate, comprising steps of forming a protective film on a surface of the SiGe layer of an outermost surface layer in the multilayer substrate and then cleaning the protective film with a cleaning liquid capable of etching the protective film ... 01/18/07 - 20070012337 - In-line metrology for supercritical fluid processing The system includes a metrology module coupled to a supercritical processing chamber, and the method includes positioning a substrate on a substrate holder in a metrology chamber, measuring a residue in at least one feature of the substrate, determining a supercritical cleaning process recipe based on the measured residue, positioning ... 12/28/06 - 20060289034 - Compositions containing free radical quenchers The invention relates to a method of cleaning the surface of a substrate to remove post-etch residue or post chemical mechanical polishing residues from the surface of a substrate. Specifically, the present invention relates to a method of post-CMP or post-etch cleaning. The method involves contacting the surface of a ... 12/28/06 - 20060289033 - Method of cleaning semiconductor surfaces Devices and methods of cleaning are described. The methods, and devices formed by the methods have a number of advantages. Embodiments are shown that include cleaning using a supercritical fluid. Advantages include a combination of both chemical and mechanical removal abilities from the supercritical fluid. Mechanical energy for cleaning is ... 12/14/06 - 20060278253 - Method and apparatus for wafer cleaning An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer. ... 11/23/06 - 20060260644 - Method and apparatus for wafer cleaning An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer. ... 11/23/06 - 20060260643 - Method and apparatus for wafer cleaning An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer. ... 11/23/06 - 20060260642 - Method and apparatus for wafer cleaning An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer. ... 10/26/06 - 20060237031 - Apparatus and method for treating substrate In an embodiment, an apparatus and method for cleaning a wafer include a container containing deionized water, and a cover opening/closing an opened upper portion of the container. A nozzle is installed in the cover to spray the deionized water to a space defined by the cover. A first electrode ... 10/05/06 - 20060219257 - Cleaning device and cleaning method The invention provides a cleaning device for cleaning or rinsing a wafer disposed in a cleaning bath by cleaning fluid in the cleaning bath including a front wall that configures the cleaning bath by being in abutment with a device body and is formed with an opening corresponding to a ... 09/21/06 - 20060207631 - Apparatus and method of cleaning a sustrate A cleaning apparatus is provided with a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator, and a retainer for holding a substrate to be immersed into a cleaning chemical. The front surface of the substrate is cleaned while ultrasonic waves are radiated from the ultrasonic oscillator ... 08/17/06 - 20060180175 - Method and system for determining flow conditions in a high pressure processing system In a high pressure processing system configured to treat a substrate, a flow measurement device is utilized to determine a flow condition in the high pressure processing system. The flow measurement device can, for example, comprise a turbidity meter. The flow parameter can, for example, include a volume flow rate ... 08/17/06 - 20060180174 - Method and system for treating a substrate with a high pressure fluid using a peroxide-based process chemistry in conjunction with an initiator A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry containing a process peroxide is introduced to the high pressure fluid for treating the substrate surface. The peroxide-based chemistry is used in conjunction with ... 08/10/06 - 20060174912 - Wafer cleaning solution for cobalt electroless application A method and cleaning solution that removes contaminants from a dielectric material and polished surfaces of copper interconnect structures prior to an electroless deposition of a capping layer without substantially adversely affecting the interconnect formed therefrom are disclosed. The cleaning solution includes combinations of a core mixture and sulfuric acid ... 06/15/06 - 20060124152 - Method and apparatus for washing solid substrate with ultrasonic wave after hybridization reaction A method and apparatus for washing solid substrate with ultrasonic wave after hybridization reaction are provided. The method includes (1) putting the solid substrate into a container having a washing solution, on which the hybridization reaction has been completed, (2) using an ultrasonic generator to produce a certain strength of ... 05/25/06 - 20060107969 - Ozonated water flow and concentration control apparatus and method The invention features an apparatus and a method for supplying ozonated water to more than one process tool. Ozonated water of a first concentration received from an ozonated water generator and water received from a source are mixed to produce ozonated water of a second concentration. The ozonated water of ... 04/27/06 - 20060086372 - Composition for the removing of sidewall residues The present invention relates to a composition for the removal of so-called “sidewall residues” from metal surfaces, in particular from aluminium or aluminium-containing surfaces, in particular from aluminium or aluminium-containing surfaces, during the production of semiconductor elements. ... 03/02/06 - 20060042653 - Method of forming contact hole A method of forming a contact hole in a semiconductor device, by which a PMD layer as an insulating interlayer is prevented from being overetched by wet cleaning for removing polymer and photoresist after forming a contact hole perforating the PMD layer in a manner of adjusting temperature and concentration ... 02/02/06 - 20060021634 - Method and apparatus for creating ozonated process solutions having high ozone concentration A method and system for creating an ozonated process solution, such as ozonated deionized water, having high ozone concentration. The system comprises, a static mixer coupled to a recirculation loop of an auxiliary tank. The system and method are designed so that during the initial feed of process liquid and ... 11/03/05 - 20050241673 - Resist removing apparatus and method of removing resist In a resist removing apparatus of the present invention, a distance between a surface of a substrate (10) and an ultraviolet rays transmission plate (3) is adjusted to a predetermined distance by an upward and downward moving mechanism (2b) of a substrate stage (2), and O3 water is supplied from ... 10/06/05 - 20050217694 - Control of dissolved gas levels in deionized water An embodiment of the invention is an apparatus having a cleaning tank 2, a megasonic energy source 3, and an intake pipe 6 where a membrane contactor 9 is coupled to the intake pipe 6 to change the concentration of nitrogen gas in the deionized water 8 contained in intake ... 09/29/05 - 20050211266 - Wafer drying apparatus A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the ... 08/18/05 - 20050178402 - Methods and apparatus for cleaning and drying a work piece Methods and apparatus are provided for the cleaning and drying of a work piece. The apparatus comprises a carrier configured to carry a work piece that has a surface. The apparatus further comprises a press plate having a first surface and a second surface. During a cleaning process, the carrier, ... 08/18/05 - 20050178401 - Method and apparatus for treating a substrate with an ozone-solvent solution iii A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined temperature T1 to form an ozone-solvent solution with a relatively high dissolved ozone concentration, and heating either the ozone-water solution ... 07/14/05 - 20050150516 - Semiconductor manufacturing method and apparatus The present invention aims to provide processes and equipments for manufacturing semiconductors, according to which oxidation of wafer surfaces can be controlled by simple means and contaminants promoting oxidation and contaminants inviting a decreased yield of wafers can also be totally controlled. To achieve the object above, the present invention ... 07/07/05 - 20050145264 - Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display An ultrasonic-wave washing unit comprising an ultrasonic-wave vibrating plate to which an ultrasonic-wave vibrator is fixed by adhesive bonding, an ultrasonic-wave transmission plate opposed to the vibrating plate, a liquid supply means which supplies a liquid to a space defined between the vibrating plate and the transmission plate, and a ... 06/23/05 - 20050133060 - Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface ... 06/09/05 - 20050121051 - Method for cleaning substrate and apparatus therefor A substrate cleaning method and an apparatus therefor capable of increasing a particle removal ratio at which particles firmly adhering to a substrate are removed therefrom and increasing a throughput. A substrate such as a wafer or the like placed in a cleaning tank filled therein with a cleaning liquid ... ### FreshPatents.com Support |