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Refrigeration > Using Electrical Or Magnetic Effect > Thermoelectric; E.g., Peltier Effect > Including Specific Circuitry Or Heat Exchanger Material Including Specific Circuitry Or Heat Exchanger MaterialIncluding Specific Circuitry Or Heat Exchanger Material patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/08/07 - 20070256427 - Thermoelectric device In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the ... 11/01/07 - 20070251243 - Thermally stabilized sensors for cooled electrical packages Described is a thermally stabilized sensor for cooled component packages. A cooled component package includes a cooled component, a temperature-sensing device located adjacent to the cooled component, and a heat flow modifier located adjacent to the temperature-sensing device. Examples of the heat flow modifier include a ground shield, a wire ... 08/16/07 - 20070186561 - Cooling apparatus The invention relates to a cooling apparatus having a cooling structure that comprises at least one surface area for introducing heat, and a cooling member that is connected to the cooling structure in a heat-conducting manner, wherein the cooling member is moveable so as to generate an air flow by ... 05/17/07 - 20070107441 - Heat-dissipating unit and related liquid cooling module A liquid cooling module includes a heat-absorbing unit, a heat-dissipating unit, a outlet pipe and a inlet pipe. The heat-dissipating unit includes a tank configured for receiving a coolant therein, a pump disposed in the tank, at least one thermoelectric device and at least one heat sink. The thermoelectric device ... 04/12/07 - 20070079616 - High power thermoelectric controller A high power thermoelectric controller system is disclosed, capable of operating multiple thermoelectric cooler (TEC) devices, each with a maximum power demand greater than 200 watts. The controller system utilizes interleaved triggering of multiple pulse width modulated power conversion circuits in order to minimize switching transient currents. In another aspect, ... 02/15/07 - 20070033951 - Thermoelectric based heating and cooling system for a hybrid-electric vehicle A heating and cooling system including a first and second thermoelectric module each has a first surface and a second surface. In thermal communication with the first and second surfaces of the thermoelectric modules are separate heat exchangers. A thermal storage device is in thermal communication with the first surface ... 01/04/07 - 20070000256 - Localized microelectronic cooling An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling system comprising one or more thermoelectric cooler(s) is thermally coupled to a heat spreader to provide cooling to one or more hot spot(s) of ... 08/31/06 - 20060191271 - Heat exchanger and manufacturing method thereof Resins 5, 6 are interposed as insulating layers between heat radiation side and heat absorption side heat exchange bodies 2, 3 and heat radiation side and heat absorption side electrodes 41, 42 of a thermoelectric conversion element module 4. The resin 5 is fusion bonded to the heat radiation side ... 08/03/06 - 20060168969 - Compact high-performance thermoelectric device for air cooling applications This invention is a compact, high-performance thermoelectric device for cooling air. Several variations on compact heat sinks are disclosed as well as several optimized configurations for maximized cooling effect, a mechanism to preventing overheating, and robust configuration to withstand rugged applications such as cooling automobile seats, air ducts, and power ... 07/27/06 - 20060162342 - Thermoelectric heat transfer system A thermoelectric heat transfer system is provided. The thermoelectric heat transfer system comprises a coolant circuit with a pump circulating coolant through the circuit. A first heat exchanger is in fluid communication with the coolant circuit to remove heat from the coolant. At the same time, a second heat exchanger ... 07/20/06 - 20060156738 - Solar-powered temperature regulation system for the interior of an automobile/motor vehicle A temperature regulation system, which can be used to cool the interior temperature of an automobile/motor vehicle, when it is parked under the sun, substantially below the external temperature, was designed and produced. The system was powered by solar cells, thus functioning without dissipating any energy from the vehicle's battery. ... 07/06/06 - 20060144052 - Thermoelectric heat exchange element A thermoelectric heat exchange module includes a first substrate including a heat receptive side and a heat donative side and a series of undulatory pleats. The module may also include a thermoelectric material layer having a ZT value of 1.0 or more disposed on at least one of the heat ... 06/29/06 - 20060137361 - System employing temporal integration of thermoelectric action Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. In such configurations, it can be advantageous to discontinuously ... 06/29/06 - 20060137360 - Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. In such configurations, it can be advantageous ... 06/29/06 - 20060137359 - Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. Total cooling power can be increased by ... 06/15/06 - 20060123799 - Thermoelectric device In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the ... 05/18/06 - 20060101831 - Cooling apparatus, systems, and methods Apparatus and systems, as well as methods and articles, may operate to actively cool an electronic device using a first heat removing cooling element, and to induce a thermal gradient in a heat pipe by conducting heat from a hot side of the first heat removing cooling element to a ... 05/04/06 - 20060090475 - System and method for suppressing sublimation using opacified aerogel The present invention relates to a castable, aerogel-based, ultra-low thermal conductivity opacified insulation to suppress sublimation. More specifically, the present invention relates to an aerogel opacified with various opacifying or reflecting constituents to suppress sublimation and provide thermal insulation in thermoelectric modules. The opacifying constituent can be graded within the ... 04/13/06 - 20060075760 - Temperature measuring device using a matrix switch, a semiconductor package and a cooling system An embodiment relates to a temperature measuring device using a matrix switch, and a semiconductor package. In another embodiment a cooling system may be included. A plurality of temperature sensors may be arranged on a surface of a semiconductor device. The matrix switch may select the temperature sensors by an ... 02/16/06 - 20060032238 - Optical transmitter with forward controlled peltier device The present invention provides an optical transmitter with a forward controlled Peltier driver. The temperature sensor generates a monitoring signal Sm. The comparator compares this monitored signal Sm with the target temperature signal St to generated the temperature difference signal Sn. The limiter restricts this difference signal Sn between the ... 01/12/06 - 20060005550 - Temperature control device and method using peltier element There are provided an device for controlling temperature by Peltier element and a method for controlling temperature by the same, wherein the structure of the device can be simplified, the cost making the device can be reduced and an accuracy of the temperature control of a contact plane based on ... 12/29/05 - 20050284153 - Method and system for cooling According to one embodiment of the invention a method for cooling a structure includes flowing a saturated refrigerant through one or more passageways in the structure while maintaining the refrigerant at a substantially constant pressure. The method also includes evaporating at least a portion of the refrigerant at a substantially ... 12/22/05 - 20050279105 - Integrated thermoelectric module The integrated thermoelectric module is formed of a set of thermoelectric elements, consisting of N type and P type conductor and/or semiconductor elements electrically connected in series and/or in parallel and thermally connected in parallel and assembled on flexible supports (11) of polymeric material, capable of electrically isolating said circuit, ... 12/15/05 - 20050274120 - Heat pipe connection system and method A stackable heat transfer system incorporating a plurality of flow controlled endcaps facilitating select flow of heat transfer fluid through low profile extrusions. The low profile extrusions are mounted in a sandwiched configuration with thermal electric cooling arrays for providing heat dissipation from the cooler arrays and the heat transfer ... 12/15/05 - 20050274119 - Thermoelectric chiller/warmer of contained substance In one form of the invention, a thermoelectric chiller and warmer is provided which can decrease or increase the temperature of a contained liquid or solid and liquid combination such as a bottled or canned liquid and/or solid. In one embodiment, the thermoelectric chiller/warmer is equipped with one or more ... 11/24/05 - 20050257532 - Module for cooling semiconductor device A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to the heat receiving plate and other end portion of which is thermally connected to a ... 10/27/05 - 20050235652 - Cooling apparatus, cooling method, program, computer readable information recording medium and electronic apparatus A cooling apparatus of supplying driving power to a cooling element from a power supply unit, to drive it, includes a driving power changing part changing a power value of the driving power supplied to said cooling element from the power supply unit, by a predetermined power value at each ... 09/22/05 - 20050204749 - Scraped surface heat exchanger for continuous heating or cooling of viscous masses A heat exchanger, preferably a scraped surface heat exchanger, is designed to heat or cool viscous or highly viscous material. The heat exchanger is equipped with a product cylinder (3) surrounded by a heat transfer medium and containing a rotationally driven shaft (2). The shaft and the product cylinder form ... 09/22/05 - 20050204748 - Cooling apparatus for articles operated at low temperature A cooling apparatus for articles operated at low temperatures comprises a refrigerating machine and a cold head provided in the refrigerating machine. A first Peltier element is thermally contacted and fixed with the cold head, and a second Peltier element is thermally contacted and fixed with the cold head. A ... 09/22/05 - 20050204747 - Thermoelectrically cooling electronic devices A heat sink may be clamped to a thermoelectric cooler and vapor chamber using a U-shaped retention band. The band may attach underneath the vapor chamber, extending around the thermoelectric cooler, and over a heat sink. The heat sink may include a plate to distribute the force of the band ... 06/30/05 - 20050138935 - Temperature controller for a semiconductor-fabricating tool A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for ... ### FreshPatents.com Support |