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Metal Working > Method Of Mechanical Manufacture > Electrical Device Making > Conductor Or Circuit Manufacturing > On Flat Or Curved Insulated Base, E.g., Printed Circuit, Etc. > Assembling To Base An Electrical Component, E.g., Capacitor, Etc. Assembling To Base An Electrical Component, E.g., Capacitor, Etc.Assembling To Base An Electrical Component, E.g., Capacitor, Etc. patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/17/08 - 20080010819 - Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where ... 11/22/07 - 20070266556 - Mounter device, part cartridge for the device, and method of holding and carrying substrate A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the ... 11/15/07 - 20070261235 - Electronic device removal tool and carrier A tool is used for the removal of a processor from a heat sink for replacement or repair, or for delivery of the processor for servicing. The tool combines the features for the removal of the processor from the heat sink and a covered container for storage and delivery of ... 10/04/07 - 20070226997 - Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An ... 10/04/07 - 20070226996 - Hybrid integrated circuit device and method of manufacturing the same An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with ... 08/16/07 - 20070186415 - Anticorrosive bipolar fuel cell board and method for manufacturing the same A method of manufacturing an anticorrosive bipolar fuel cell board is disclosed and comprises the following steps. Step (a) is to provide a first printed circuit substrate with at least a first predetermined region and etch metal on the regions. Step is to provide a second printed circuit substrate with ... 08/02/07 - 20070175025 - Method of manufacturing multi-layer wiring board A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin ... 08/02/07 - 20070175023 - Tamper barrier for electronic device A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom ... 07/12/07 - 20070157462 - Electronic component mounting apparatus and electronic component mounting method An electronic component mounting apparatus includes a mounting device adapted such that the applying unit applies adhesive to a substrate located in a predetermined site, a mounting unit mounts an LSI onto the application of the adhesive, subsequently the applying unit applies another adhesive onto the LSI, and the mounting ... 06/28/07 - 20070143993 - Substrate structure with capacitor component embedded therein and method for fabricating the same A capacitor components embedded substrate structure comprises a substrate, capacitor components, a first and second dielectric layers, and a circuit layer. The substrate includes a first surface, a second surface, and a hole penetrating the first and the second surfaces. The capacitor components whose surface is pretreated with a roughness ... 06/14/07 - 20070130763 - Method of fabricating electrical connection terminal of embedded chip An electrical connection terminal of an embedded chip and a method for fabricating the same are proposed. Firstly, an insulating layer is provided on a circuit board integrated with a chip and is produced a plurality of first openings on the circuit board, wherein at least one of the first ... 06/07/07 - 20070124928 - Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By pushing up on a tape substrate by a bonding stage, and applying suction to the tape substrate through a suction ... 06/07/07 - 20070124927 - Apparatus and method for assembling electronic circuits A device for assembling electronic circuits comprises a placing station (7) for placing circuit components on a circuit carrier (1) held at a placing location (17), a fixing station (19) for fixing the circuit components to the circuit carrier (1) under the effect of heat, and a belt conveyor means ... 05/10/07 - 20070101572 - Component mounting apparatus and component mounting method A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding ... 05/03/07 - 20070094871 - Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby The invention provides a method for manufacturing a printed circuit board with a film capacitor embedded therein and a printed circuit board obtained thereby. In the method, a lower electrode is formed on an insulating substrate. An amorphous dielectric film is formed on the lower electrode by low temperature film ... 04/12/07 - 20070079505 - Tape feeder for component mounter providing stable tape feeding and method for mounting a component on a circuit board with component mounter Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to ... 04/05/07 - 20070074389 - Reducing loadline impedance in a system In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices ... 03/29/07 - 20070067987 - Printed circuit board with improved cooling of electrical component An improved cooling of an electronic component loaded to a printed circuit board, wherein the PCB comprises at its upper side at least one electronic component, and at least one heat conducting member inserted into a through-hole of the PCB, wherein the HCM extends from the upper side to the ... 02/15/07 - 20070033800 - Method for electrically contacting a component to a flat cable d) The component (5a) is electrically contacted to the contact segments (11a, 11b) of the sub-sections (10a, 10b). ... 01/18/07 - 20070011870 - Method of manufacture of an identification wristband construction A method of manufacture of a wristband includes the steps of providing a bottom substrate. First circuit elements are deposited on the bottom substrate. A dielectric material is deposited at predetermined areas on the bottom substrate. A remainder of the circuit is deposited on the bottom substrate and dielectric materials. ... 01/11/07 - 20070006454 - Component mounting apparatus and component mounting method In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from ... 01/11/07 - 20070006453 - Component mounting apparatus and component mounting method In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from ... 01/11/07 - 20070006452 - Method of making a circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the ... 11/09/06 - 20060248714 - Apparatus and method for storing an electronic component, method for packaging electronic components and method for mounting an electronic component An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the electronic component and wherein the pocket has a protrusion at a bottom and wherein a top of the protrusion ... 11/09/06 - 20060248713 - Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device having a reduced cost, manufacturing time, weight, and thickness A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or ... 10/19/06 - 20060230610 - Mounting method of electronic components Mounting methods of electronic components in which the electronic components are mounted on plural printed circuit boards are disclosed. An exemplary method includes: supplying a printed circuit board on a first conveyor; transferring the printed circuit board to the third conveyor and simultaneously, transferring the printed circuit board transferred to ... 10/12/06 - 20060225272 - Method of fabricating semiconductor chip assemblies A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is ... 09/21/06 - 20060207090 - Electronic-component holding apparatus, electronic-component mounting system, and electronic-component mounting method An electronic-component holding apparatus, an electronic-component mounting system, and an electronic-component mounting method each of which assures that a nozzle head holding at least one suction nozzle is easily attached to, and detached from, a head holding member, are provided. A suction surface 130 of a head holding member 52 ... 09/21/06 - 20060207089 - Component verification method A component verification method for a mounter (100) that is capable of performing component verification with less labor, is comprised of: a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from ... 09/14/06 - 20060200979 - Component mounting method Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a ... 08/24/06 - 20060185162 - Electronic component mounting method and electronic component mounting apparatus The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection ... 07/27/06 - 20060162154 - In-line program system for assembly printed circuit board An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICS) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system ... 06/08/06 - 20060117560 - Component mounting order optimization method, component mounting order optimization program, recording medium for the program, and component mounting apparatus using the method A controller optimizes an arrangement of component supply parts installed in a component supply unit while position information of mounting points on a circuit board is taken into account, and then optimizes a mounting path to the circuit board under the arrangement. Since the position information of mounting points is ... 05/18/06 - 20060101639 - Method of making innerlayer panels and printed wiring boards using x-ray identification of fiducials Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials. ... 05/18/06 - 20060101638 - Method and structure for creating printed circuit boards with stepped thickness A method and structure are provided for creating printed circuit boards with stepped thickness. A non-laminating breakaway material layer is selectively placed between layers of the printed circuit board. A perimeter portion of the printed circuit board near the breakaway material layer is scored. Then the breakaway material layer and ... 03/23/06 - 20060059682 - Manufacturing method of a multi-layer circuit board embedded with a passive component A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points; connecting a passive element to the corresponding metal protruding points; providing a board having a core substrate with organic ... 03/16/06 - 20060053624 - Method and equipment for mounting part The present invention is to provide a method and an apparatus for mounting components having a feature of detecting with high accuracy component pick up failure by the nozzle at component pick up stage, and/or component carrying back by the nozzle at component mounting stage. Achieved vacuum pressure is initialized ... 03/09/06 - 20060048382 - Method and apparatus for installing a circuit device A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the ... 03/09/06 - 20060048381 - Die attaching apparatus, and system and method for cleaning the same Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing ... 03/09/06 - 20060048380 - Parts mounting device and method An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction ... 03/09/06 - 20060048379 - Board carrier component mounter, and method for carrying board in component mounting A component-mounted substrate moved to a specified substrate position by a substrate holding-and-moving device is delivered from the top of the substrate holding-and-moving device to a substrate discharge holder, and then while the substrate discharge holder is not moved, the substrate holding-and-moving device is moved to another substrate position, where ... 01/12/06 - 20060005384 - Manufacturing method of a multi-layer circuit board with an embedded passive component A manufacturing method of a multi-layer circuit board with an embedded passive component includes: providing a conductive layer which has a first surface and a second surface; forming a metal paste on the first surface to form metal joints; using a sintering process to connect a passive element to the ... 11/24/05 - 20050257369 - Electronic component extraction tool An electronic component extraction tool is provided. The extraction tool comprises two opposing deflectable arms connected to one another, each arm having an end with a first surface adapted to extend under a side edge of an electronic component and a second surface adapted to extend over a side edge ... 11/10/05 - 20050246891 - Multilayer wiring board, manufacturing method therefor and test apparatus thereof A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame resin layer includes at least one of glass cloth, filler and nonwoven fabric. The frame resin layer includes no electronic ... 10/27/05 - 20050235489 - Component placing head and component placing method A component placing head has a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component ... 10/20/05 - 20050229392 - Parts mounting method A suction head is inserted between first and second cameras relatively disposed facing one another with aligned optical axes, so that the first camera takes images of a head reference mark on the suction head, and the second camera of a first part suctioned to the suction head. Next, a ... 10/13/05 - 20050223552 - Bonding an interconnect to a circuit device and related devices This disclosure relates to a system and method for bonding an interconnect to a dense circuit device. ... 09/01/05 - 20050188536 - Color image display unit Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an array direction of the light emitting devices into long-sized line-shaped device substrates. The line-shaped device substrates are arrayed on ... 08/18/05 - 20050178001 - Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... 07/28/05 - 20050160593 - Tape feeder, electronic component mounting apparatus using the same, and method of feeding electronic components A tape feeder feeds electronic components by advancing a tape intermittently. The tape feeder comprises a motor controller for controlling a motor, which rotatively drives a sprocket to advance the tape, and a communication unit for receiving a control signal from a control unit of an electronic component mounting apparatus ... 07/28/05 - 20050160592 - Mounting system for high-mass heatsinks A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The ... 07/28/05 - 20050160591 - Method for dissociating metals from metal compounds In the forming of copper interconnects for an integrated circuit, a method for dissociating copper oxides from copper surfaces is provided. An antireflective coating layer is formed over an insulating layer formed over a semiconductor substrate. An interconnect pattern is patterned and etched into said insulating layer. A diffusion barrier ... 07/21/05 - 20050155223 - Methods of making microelectronic assemblies A method of making a microelectronic assembly includes juxtaposing a first element having conductive leads thereon with a second element having contacts thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads ... 06/30/05 - 20050138801 - Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, ... 06/30/05 - 20050138800 - Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device Apparatus and methods are provided for thermally coupling a heat dissipation device to a microelectronic device. A reflowable thermal interface material is applied between the back side of a microelectronic die and a heat dissipation device. Heat and pressure is conducted through the heat dissipation device to the interface material ... 06/16/05 - 20050125998 - Electronic part mounting device and method An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to ... ### FreshPatents.com Support |