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Metal Working > Method Of Mechanical Manufacture > Electrical Device Making > Conductor Or Circuit Manufacturing Conductor Or Circuit ManufacturingConductor Or Circuit Manufacturing patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/24/08 - 20080016685 - Wiring board, multilayer wiring board, and method for manufacturing the same A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on ... 12/27/07 - 20070294887 - Method of manufacturing cord management device A method of manufacturing a cord management device. The method includes: (a) providing a power strip; (b) physically and electrically coupling a power cord to the power strip; (c) providing a stationary portion, providing the stationary portion includes: (1) providing a first wall; (2) providing two or more slots in ... 12/20/07 - 20070289126 - Method for the production of a portable data support The invention relates to a method for the production of a portable data carrier (1) having an integrated circuit (10) and a contact field (7) galvanically connected to the integrated circuit (10). In the area of the contact field (7) the portable data carrier (1) is shaped in such a ... 11/01/07 - 20070251087 - Shaped lead assembly for optoelectronic devices An optoelectronic package is attached to a printed circuit board, in which optoelectronic package has a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In ... 10/18/07 - 20070240303 - Printed circuit board including embedded capacitors and method of manufacturing the same Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit ... 08/30/07 - 20070199194 - Method of electroplating a plurality of conductive fingers A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive ... 07/19/07 - 20070163109 - Strip for integrated circuit packages having a maximized usable area A strip on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The strip includes one or more fiducial notches and/or guide pin notches formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow ... 06/21/07 - 20070137032 - Ground stud installation on composite structure for electrostatic charges Method and system for installing a ground stud on composite material. The method includes securing the ground stud to the composite material creating an electrical contact between the ground stud and composite material; and attaching a connective device to the ground stud for allowing current to flow from the connective ... 03/01/07 - 20070044302 - Method of making ignition wire with grafted coating An ignition wire includes a conductive core, an insulation layer surrounding the core, an insulating jacket surrounding the insulation layer and a coating layer which is grafted and bonded to at least a portion of an exterior surface of the insulating jacket. The coating layer and insulating jacket are preferably ... 02/22/07 - 20070039171 - Method of fabricating a high-layer-count backplane Method and apparatus are disclosed for flow control over Point-to-Point Protocol (PPP) data links. A method of negotiating such flow control between two PPP peers is disclosed, along with methods for operating flow control across a PPP link. In one embodiment, flow control frames carry an IEEE802.3x MAC control frame ... 02/22/07 - 20070039170 - Three-dimensional metal microfabrication process and devices produced thereby The present invention relates, in general, to a method for three-dimensional (3D) microfabrication of complex, high aspect ratio structures with arbitrary surface height profiles in metallic materials, and to devices fabricated in accordance with this process. The method builds upon anisotropic deep etching methods for metallic materials previously developed by ... 01/11/07 - 20070006451 - Method of forming a metal wiring in a semiconductor device Example embodiments of the present invention relate to a method of forming a metal wiring in a semiconductor device. Other example embodiments of the present invention relate to a method of forming a metal wiring in a semiconductor device without a generation of a bridge between adjacent metal wirings. In ... 12/07/06 - 20060272148 - Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof A metal electroplating process of an electrically connecting pad structure of a circuit board and structure thereof are proposed. First, a circuit board with a patterned circuit layer formed on at least one surface thereof is provided, wherein the circuit layer defines a plurality of electrically connecting pads and electroplating ... 11/30/06 - 20060265868 - Inter-metal dielectric fill An inter-metal dielectric (IMD) fill process includes depositing an insulating nanolaminate barrier layer. The nanolaminate is preferably an oxide liner formed by using an alternating layer deposition process. The layer is highly conformal and is an excellent diffusion barrier. Gaps between metal lines are filled using high density plasma chemical ... 11/02/06 - 20060242824 - Methods of manufacturing enhanced electrical cables Disclosed are methods of manufacturing electrical cables. In one embodiment of the invention, method for manufacturing a wellbore cable includes providing at least one insulated conductor, extruding a first polymeric material layer over the insulated conductor, serving a first layer of armor wires around the polymeric material and embedding the ... 10/26/06 - 20060236532 - Conductive elements i) depositing a supplementary material on a sheet of conductive, parent material (1) to form a sheet of composite material; ii) applying a carrier material over the supplementary material of the composite sheet to form a sheet of semi-finished material; iii) removing portions from at least the conductive parent material ... 09/14/06 - 20060200976 - Tool for the esd-safeguarded mounting of a detector module A tool for the ESD-safeguarded mounting of a detector module is disclosed. The tool includes an accommodating element for accommodating at least one module plug of the detector module, in which case it is possible, when the module plug is accommodated, for an electrostatic charge on the detector module to ... 08/17/06 - 20060179652 - Connecting flexible circuitry by stitching A means is described of connecting multiple flexible printed circuit (FPC) tags. The means is suitable where electrical circuitry has been printed or otherwise applied to one side of flexible substrates, and where the circuitry of two such substrates is required to be brought into electrical continuity. In this method, ... 08/17/06 - 20060179651 - Telecommunications cable jacket adapted for post-extrusion insertion of optical fiber and methods for manufacturing the same The present disclosure relates to a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of an optical fiber or other signal-transmitting member. The present disclosure also relates to a method for making a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of ... 08/03/06 - 20060168802 - Wireless identification device, rfid device with push-on/push-off switch, and method of manufacturing wireless identification device A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification ... 07/06/06 - 20060143906 - Metal wire with filaments for biomedical applications A method for constructing a metal wire with embedded filaments or cavities therein for biomedical applications. The method includes first drilling nonconcentric apertures in a symmetrical pattern in a metal rod and then embedding filaments in the apertures. The metal rod is then drawn and thermally-treated to form a metal ... 04/13/06 - 20060075632 - Method of fabricating a micro-electromechanical device with a thermal actuator A method of fabricating a micro-electromechanical device includes the step of forming electrical connections to drive circuitry on a wafer substrate. A first sacrificial structure is formed on the wafer substrate. The first sacrificial structure corresponds at least to a mechanical arm to be formed on the sacrificial structure, spaced ... 03/02/06 - 20060042076 - Bus bar system for heatable glass A composition for forming an electrically conductive bus, which comprises a polymer and conductive filler particles. A composition for forming an electrically conductive bus, comprising silver-based flakes within a polymer adhesive carrier such as polyurethane for forming a conductive bus for vehicle glass. A method for forming a glass laminate ... 02/16/06 - 20060032049 - Circuit device manufacturing method A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto the overcoat resin. A first conductive film 23A and a second conductive film 23B, which are laminated with an ... 01/26/06 - 20060016069 - Intelligent connector assembly for use in medical device cables An intelligent connector assembly for use in an interface between a device and a cable, including: a block having a circuit thereon, the block being configured to be received onto a housing, with alignment features on the housing and the block such that the block is receivable in only one ... 01/19/06 - 20060010685 - Rfid tag and method of manufacturing rfid tag A method of manufacturing an RFID tag includes forming through-holes on a sheet to embed a plurality of electronic components, such as IC chips; forming a substrate by sticking a bottom plate sheet to the sheet, and forming recesses; embedding the electronic components into the recesses; printing antenna patterns on ... 12/29/05 - 20050283974 - Methods of manufacturing an electrical connector incorporating passive circuit elements A process for manufacturing an electrical connector is described. In the preferred embodiment, the process includes the following steps: (a) providing a lead frame that has a plurality of signal conductors, where each of the signal conductors has a first contact end, a second contact end and an intermediate portion ... 12/08/05 - 20050268459 - System and method for detecting connector pin insertion in printed circuit board assemblies A pin detection system detects connection pin insertion in a printed circuit board assembly. The printed circuit board assembly comprises a printed circuit board having multiple wells and one or more connectors having pins that are inserted into the wells of the printed circuit board. The system comprises a conveyer, ... 11/03/05 - 20050241146 - Method of fabricating a rat's nest rfid antenna A method of fabricating a rat's nest radio frequency identification (RFID) antenna is disclosed. The antennas are fabricated on a substrate that includes already fabricated RFID chips. The antennas can be loop antennas. An antenna is connected to a RFID chip in an assembly order and a RFID tag including ... 10/20/05 - 20050229391 - Method for producing an insulated wire A method for producing an insulated wire having a cross section of a desired shape, in which a conductor having a cross section of a desired shape is coated with an insulating film, which method comprises: supplying a raw conductor while passing through a rolling unit composed of at least ... 10/13/05 - 20050223550 - Method for making a non-detachable microcircuit card A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) on the wall of the cavity (12) ... 09/08/05 - 20050193554 - Method of making a housing for drug delivery An electrotransport reservoir housing which contains, integrally formed therein, at least one region of conductive material which allows for a liquid and moisture tight barrier, while at the same time providing a means for conducting an electric current therethrough. ... 08/18/05 - 20050178000 - Method for making metal cladded metal matrix composite wire A method for forming metal-cladded metal matrix composite wires. The method associates a ductile metal cladding to the exterior surface of a metal matrix composite wire comprising a plurality of continuous, longitudinally positioned fibers in a metal matrix. ... 07/14/05 - 20050150105 - Method of reducing noise induced from reference plane currents A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path references a voltage plane. The method further includes routing a second path for the electrical trace on the ... 06/30/05 - 20050138798 - Radio ic tag, method for manufacturing radio ic tag, and apparatus for manufacturing radio ic tag A radio IC tag includes a first antenna and a first spacer, and is arranged so as to generate an operating power by a radio wave received at the first antenna and having a predetermined frequency, operate an IC chip using the power, read out identification information stored in the ... 06/09/05 - 20050120550 - Method for forming metal wires by microdispensing pattern A method for forming metal wires by microdispensing a pattern is disclosed. The method includes the steps of microdispensing a catalyst pattern on the substrate and forming metal wires by electroless plating. Before the step of microdispensing catalyst pattern, the surface properties of the substrate have been improved by a ... ### FreshPatents.com Support |