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  Z-axis alignment of an optoelectronic component using a spacer toolUSPTO Application #: 20070036504Title: Z-axis alignment of an optoelectronic component using a spacer tool Abstract: A spacer tool system is used with an optoelectronic package to properly align an optical component within the device. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The spacer tool is of a length that corresponds with the predetermined distance between the optical component and the reference point. (end of abstract) Agent: Workman Nydegger (f/k/a Workman Nydegger & Seeley) - Salt Lake City, UT, US Inventor: Paul K. Rosenberg USPTO Applicaton #: 20070036504 - Class: 385134000 (USPTO) Related Patent Categories: Optical Waveguides, Accessories The Patent Description & Claims data below is from USPTO Patent Application 20070036504. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional of U.S. patent application Ser. No. 11/187,333, filed Jul. 22, 2005, which claims the benefit of U.S. Provisional Patent Application No. 60/590,280, filed Jul. 22, 2004. The foregoing patent applications are incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. The Field of the Invention [0003] The present invention is generally directed to optoelectronic devices. More particularly, the present invention is directed to the alignment of a component within an optoelectronic device so as to provide for efficient assembly of the device. [0004] 2. The Relevant Technology [0005] Fiber-optics and optoelectronics are important aspects of modern optical networks because they allow for efficient, accurate and rapid transmission of optical data between various components in the network system. Optical transceiver modules ("transceivers") are an example of modular components used in optical networks. Such modular component are desirable in optical networks and other fiber optic systems to reduce the cost of manufacturing the system, which cost increases the more customized the system becomes. [0006] Transceivers usually include an input receiver optical subassembly ("ROSA") and an output transmitter optical subassembly ("TOSA"). The ROSA includes a photodiode for detecting optical signals and sensing circuitry for converting the optical signals to electrical signals compatible with other network components. The TOSA includes a laser for transmitting optical signals and may include control circuitry for modulating the laser according to an input digital data signal as well as a photodetector to monitor laser power. The TOSA has an optical lens for focusing the optical signals from the laser of the TOSA into an optical fiber. Similarly, the ROSA often includes a lens to focus incoming optical signals on the photodiode. Additionally, one end of the transceiver includes pluggable receptacles, pig-tailed connections, or other suitable means for optically connecting the TOSA and the ROSA with other components within a fiber optic network, while another end often includes a connector for connecting with electrical components of a host system or device with which the transceiver communicates. [0007] The photodiode in the ROSA and the laser in the TOSA are examples of optoelectronic semiconductor components. Generally, these optoelectronic semiconductor components are sensitive devices that require mechanical and environmental protection. As such, these optoelectronic components are usually manufactured in packages to provide such protection and to facilitate their incorporation into higher level devices, such as TOSAs and ROSAs. [0008] One such packaging assembly is known as a transistor-outline header or transistor-outline package, referred to herein as a TO package. TO packages are widely used in the field of optoelectronics, and may be employed in a variety of applications. As such, TO packages are often standardized to facilitate their incorporation into components such as transceivers. The TO packages protect the sensitive electrical devices contained therein and electrically connect such devices to external components such as printed circuit boards ("PCB"). [0009] With respect to their construction, the TO packages often include a cylindrical metallic base, also known as a header, with a number of conductive leads extending completely through, and generally perpendicular to, the base. The size of the base is often sized to fit within a specific TO standard size and lead configuration, examples of which include a TO-5 or TO-46. The leads are usually hermetically sealed in the base to provide mechanical and environmental protection for the components contained in the TO package, and to electrically isolate the conductive leads from the metallic material of the base. Typically, one of the conductive leads is a ground lead that may be electrically connected directly to the base. [0010] Various types of electrical devices and optical components, such as the photodiode or laser device, are mounted on an interior portion of the base and connected to the leads to enable their operation. Generally a cap, also known as a can, is used to enclose the interior portion of the base where such electrical devices are mounted so as to form a hermetic chamber that helps prevent contamination or damage to the devices. The specific design of the TO package depends on the optoelectronic component being mounted on the base and the modular component with which the TO package will be used. By way of example, in applications where the optoelectronic component mounted on the base is an optical component, i.e., a laser or photodiode, the cap is at least partially transparent so as to allow an optical signal generated or received by the optical component to be transmitted to or from the TO package. These optical TO can packages are also known as window cans. [0011] In the case of mounting optical components within a window can or other TO package within an optical subassembly, various challenges are often encountered. One challenge deals with accurately positioning the optical component, such as a laser or photodiode, with respect to another component, such as the lens, which may be included in, or proximate to, the package in the optical subassembly. Such positioning is critical to ensure that the optical signals are properly collimated or otherwise focused upon entry to or exit from the optical transceiver module or related device. [0012] In light of the above, a need exists for a means by which a laser, photodiode, or other semiconductor and/or optoelectronic component can be properly positioned in an optoelectronic or other package such that operation of the device in which the component is disposed is optimized. BRIEF SUMMARY OF THE INVENTION [0013] The present invention has been developed in response to the above and other needs in the art. Briefly summarized, embodiments of the present invention are directed to [0014] An optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. In one embodiment, the package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The spacer tool is of a length that corresponds with the predetermined distance between the optical component and the reference point. [0015] In another embodiment, a method of positioning a first component with respect to a second component in an optoelectronic package is disclosed. The method includes determining a desired position of the first component with respect to the second component, then determining an amount of spacing between the first component and a reference point that is required to position the first component at the desired position. A spacer tool that has a length equal to the required amount of spacing to position the first component at the desired position is employed, then the first component is affixed at the desired position. [0016] These and other features of the present invention will become more fully apparent from the following description and appended claims, or may be learned by the practice of the invention as set forth hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS [0017] To further clarify the above and other advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which: [0018] FIG. 1 is a perspective view of an exemplary optical transceiver module, in which one embodiment of the present invention can be practiced; [0019] FIG. 2A is a perspective view of an optical subassembly including one embodiment of the present invention; [0020] FIG. 2B is a perspective view of another optical subassembly including one embodiment of the present invention; Continue reading... Full patent description for Z-axis alignment of an optoelectronic component using a spacer tool Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Z-axis alignment of an optoelectronic component using a spacer tool patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. 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