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Xiaoming Li patents

Recent bibliographic sampling of Xiaoming Li patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):



07/14/11 - 20110173478 - Scheduler with voltage management
There is provided a method of scheduler assisted power management for semiconductor devices. By accessing and analyzing workload data for tasks to be completed, a scheduler may provide finer grained control for determining and implementing an efficient power management policy. In this manner, tasks with completion deadlines can be allocated...
Inventors: Xiaoming Li, Surinderjit S. Dhaliwal (Mindspeed Technologies, Inc.)

07/14/11 - 20110169562 - System on chip power management through package configuration
There is provided a semiconductor package configured for externally controlled power management. Instead of integrating voltage regulation on-chip as done conventionally, power regulation is moved externally to the PCB level, providing numerous package advantages including size, simplicity, power efficiency, integration flexibility, and thermal dissipation. In particular, the use of flip-chip...
Inventors: Xiaoming Li, Surinderjit S. Dhaliwal (Mindspeed Technologies, Inc.)

11/26/09 - 20090289321 - Thermal sensing and reset protection for an integrated circuit chip
There is provided a semiconductor package that includes a first semiconductor die mounted on a package substrate. The semiconductor package further includes a second semiconductor die mounted on the first semiconductor die and including a thermal sensing and reset protection circuit. The thermal sensing and reset protection circuit is configured...
Inventors: Xiaoming Li, Mishel Matioubian, Surinderjit Dhaliwal (Mindspeed Technologies, Inc)

11/05/09 - 20090273074 - Bond wire loop for high speed noise isolation
Semiconductor dies embodying electronic circuits are enclosed and protected within a package. To electrically access the die, the package includes external electrical leads which in turn connect to internal bond wires. The bond wires electrically connect the package to the die. As die density and circuit complexity increase, bond wire...
Inventors: Xiaoming Li

06/25/09 - 20090161273 - High voltage tolerant electrostatic discharge protection circuit
An electrostatic discharge (ESD) protection circuit includes an NPN transistor having a collector terminal connected to a voltage source and an emitter terminal connected to the ground via a diode. The NPN transistor includes a base terminal for receiving a base current to turn on the NPN transistor to allow...
Inventors: Xiaoming Li

Mindspeed Technologies, Inc., Mindspeed Technologies, Inc

Archived*
(*May have duplicates - we are upgrading our archive.)

20110169562 - System on chip power management through package configuration
20110173478 - Scheduler with voltage management


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The bibliographic references displayed about Xiaoming Li's patents are for a recent sample of Xiaoming Li's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Xiaoming Li filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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