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Wiring board, method of manufacturing wiring board, and electronic deviceRelated Patent Categories: Electricity: Conductors And Insulators, Conduits, Cables Or Conductors, Preformed Panel Circuit Arrangement (e.g., Printed Circuit)Wiring board, method of manufacturing wiring board, and electronic device description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060005994, Wiring board, method of manufacturing wiring board, and electronic device. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a wiring board having a wiring layer formed in multiple layers, a method of manufacturing such wiring board, and an electronic device having such wiring board. [0003] 2. Background Information [0004] Conventionally, wiring boards are manufactured by forming a wiring layer and an insulating layer simultaneously on the surface of a substrate. First, droplets of both a conductive material for forming the wiring layer and an insulating material for forming the insulating layer are deposited onto the surface of the substrate by ink jetting. Then, the wiring layer and the insulating layer are formed simultaneously on the surface of the substrate as one layer. Thereafter, another layer of a wiring layer and an insulating layer is formed by similar methods on top of the layer already formed. Thus, a wiring board having multiple layers of the wiring layer is obtained. The wiring layers are electrically conductive relative to each other. Japanese Patent Application Publication No. 11-163499 discloses an example of such wiring board. [0005] In other words, the conventional technique entails forming the wiring layer and the insulating layer simultaneously as one layer by ink jetting, and curing the layer by heating or the like. Consequently, it is difficult to use the two materials together when the heating temperatures at which the conductive material and the insulating material are deposited onto the surface of the substrate are different, or when the curing methods for the two materials, such as with heating and ultraviolet ray irradiation, for example, are different. Also, the wiring layer and the insulating layer formed by ink jetting do not have a high density, unlike the high-density wiring boards formed by conventional additive methods or the like. [0006] In view of the above, it will be apparent to those skilled in the art from this disclosure that there exists a need for improved wiring board, method of manufacturing wiring board, and electronic device having such wiring board that overcome the problems of the conventional art. This invention addresses this need in the art as well as other needs, which will become apparent to those skilled in the art from this disclosure. SUMMARY OF THE INVENTION [0007] An object of the present invention is to provide a wiring board, a method of manufacturing a wiring board, and an electronic device having such wiring board, wherein a wider variety of conductive material and insulating material can be used for forming the wiring layers and the insulating layers on the substrate by ink jetting, while the wiring board can have a first wiring layer having high density. [0008] The wiring board according to the first aspect of the present invention has a substrate, a first wiring layer formed on the substrate by photolithography, a first insulating layer formed by ink jetting so as to cover at least a part of the first wiring layer, and a second wiring layer formed by ink jetting partly over the first wiring layer, with the first insulating layer being between the part of the first wiring layer and a part of the second wiring layer. [0009] The method of manufacturing a wiring board according to another aspect of the present invention includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink jetting so as to cover a part of the first wiring layer and expose an exposed section of the first wiring layer; and forming a second wiring layer by ink jetting partly over the first wiring layer, with the first insulating layer being between the part of the first wiring layer and a part of the second wiring layer. [0010] These and other objects, features, aspects and advantages of the present invention will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses a preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0011] Referring now to the attached drawings which form a part of this original disclosure: [0012] FIG. 1(a)-(d) are schematic cross-sectional views illustrating the first half of the method of manufacturing the wiring board according to the first embodiment of the present invention; [0013] FIG. 2(3)-(g) are schematic cross-sectional views illustrating the second half of the method of manufacturing the wiring board according to the first embodiment of the present invention; [0014] FIG. 3(a)-(d) are schematic cross-sectional views illustrating the method of manufacturing the wiring board according to the second embodiment of the present invention; [0015] FIG. 4 is a perspective view of a droplet depositing apparatus to be used to perform the manufacturing method of the present invention; [0016] FIGS. 5(a) and (b) are plan views of a head unit and an ejection head of the droplet depositing apparatus shown in FIG. 4; [0017] FIGS. 6(a) and (b) are a partial perspective view and a partial cross sectional view of a nozzle of the droplet depositing apparatus shown in FIG. 4; [0018] FIG. 7 is a block view showing the configuration of the control unit of the droplet depositing apparatus shown in FIG. 4; [0019] FIG. 8 is a schematic view of the manufacturing apparatus for the wiring board to be used to perform the manufacturing method of the present invention; [0020] FIG. 9 is a plan view of a liquid crystal display device including the wiring board of the present invention; and [0021] FIG. 10 is an external view of a portable phone provided with a liquid crystal display device having the wiring board of the present invention. Continue reading about Wiring board, method of manufacturing wiring board, and electronic device... Full patent description for Wiring board, method of manufacturing wiring board, and electronic device Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Wiring board, method of manufacturing wiring board, and electronic device patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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