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Wire bonding methodRelated Patent Categories: Metal Fusion Bonding, Process, Plural Joints, Of Electrical Device (e.g., Semiconductor), Wire BondingWire bonding method description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060175383, Wire bonding method. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] The present invention relates to a wire bonding method and more particularly to a wire bonding method well suited to low-loop implementation. [0002] In wire bonding methods for bonding a ball to a first bond point, the ball neck portion at a tip end of a bonding wire becomes a recrystallized area which is hard and brittle; accordingly, in order to form a wire loop, the wire must be bent from the portion above the recrystallized area. For that reason, it would not be able to respond to the desire for low-loop implementation. [0003] Japanese Patent Application Laid-Open (Kokai) Nos. H9-51011 and 2004-172477 solve the above-described problems. The methods disclosed in these publications takes the following steps: a ball formed at the tip end of a wire is first bonded to a die pad to form a compression-bond ball; next, after raising the capillary, it is moved in a direction opposite from an interconnect wiring (or an outer lead of a lead frame); then, after raising the capillary, it is moved to directly above the pad; the capillary is next lowered, and the wire is pressure-bonded onto the pressure-bond ball; and then, the capillary is moved onto the interconnect wiring, bonding the wire to the interconnect wiring. [0004] In these publications described above, the recrystallized area portion of the wire is bent and bonded onto a pressure-bond ball bonded to the pad; as a result, it would be able to lower the bonding height on the pad and to accomplish low-loop implementation. However, since it is necessary to superimpose wire, doubled, on the pressure-bond ball, there have been inherent limitations to low-loop implementation. BRIEF SUMMARY OF THE INVENTION [0005] The object of the present invention is to provide a wire bonding method that provides a further or improved low-loop implementation. [0006] The above object is accomplished by a series of unique processes of the present invention for a wire bonding method that performs first bonding to a pad of a die (called "die pad" or merely "pad") that is a first bond point and then second bonding to an interconnect wiring that is a second bond point, thus connecting the die pad and interconnect wiring; and in the present invention, the method includes sequentially: [0007] a bump forming process for forming a bump on a die pad, this bump forming process including a step of cutting and bending a wire protruding from a tip end of a capillary in a lateral direction thus forming a bent part in the wire; [0008] a first bonding process for bonding the bent part of the wire to the bump; and [0009] a second bonding process for bonding the wire to the interconnect wiring. [0010] The above object is accomplished by another series of unique processes of the present invention for a wire bonding method that performs first bonding to an interconnect wiring that is a first bond point and second bonding to a die pad that is a second bond point, thus connecting the interconnect wiring and die pad; and in the present invention, the method includes sequentially: [0011] a bump forming process for forming a bump on a die pad, this bump forming process including a step of cutting and bending a wire protruding from a tip end of a capillary in a lateral direction thus forming a bent part in the wire; [0012] a first bonding process for bonding the bent part of the wire to the interconnect wiring thus forming a lower first bonding part on the interconnect wiring, the first bonding process further raising and moving the capillary above the lower first bonding part then lowering the capillary and superimposing and connecting the wire onto the lower first bonding part thus forming an upper first bonding part on the lower first bonding; and [0013] a second bonding process for bonding the wire to the bump on the die pad. [0014] In the above-described methods of the present invention, the bent part is formed by holding the wire with a clamper, and moving the damper and capillary in the lateral direction, thus cutting the wire. [0015] Furthermore, in the methods of the present invention the bent part can be formed by holding the wire with a clamper, and then moving the capillary and damper parallel to the direction for joining the interconnect wiring and die pad and toward the interconnect wiring, thus cutting the wire. [0016] Furthermore, in the methods of the present invention, the bump forming process comprises the ordered steps of: [0017] bonding a ball formed at an end of the wire to the die pad, [0018] raising the capillary so that the edge at the lower end of the capillary is positioned within the height of a pillar portion formed on the bump, [0019] moving the capillary in the lateral direction thus forming a small thickness portion on a connected portion of the bump and wire, [0020] raising the capillary by a fixed amount, and [0021] pulling the wire by a damper thus cutting the wire from the small thickness portion. [0022] The bump forming process may include the ordered steps of: [0023] bonding a ball formed at an end of the wire to the die pad, Continue reading about Wire bonding method... Full patent description for Wire bonding method Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Wire bonding method patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Wire bonding method or other areas of interest. ### Previous Patent Application: Tool geometries for friction stir spot welding of high melting temperature alloys Next Patent Application: File folder with support stand Industry Class: Metal fusion bonding ### FreshPatents.com Support Thank you for viewing the Wire bonding method patent info. IP-related news and info Results in 0.10108 seconds Other interesting Feshpatents.com categories: Tyco , Unilever , Warner-lambert , 3m 174 |
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