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Whyte Hirschboeck Dudek S.c. patentsThe following is a sampling of recent Whyte Hirschboeck Dudek S.c. patent applications (USPTO Patent Application #, Patent Title) sorted by month.
April 2008 - Whyte Hirschboeck Dudek S.c. patents
20080093019 - Electrical interconnect using locally conductive adhesive
20080096316 - Stacked die in die bga package
20080097038 - Moisture-curable, silane crosslinking compositions
20080097238 - Colorectal cell sampling device
20080091263 - Apparatus and methods for preventing or treating failure of hemodialysis vascular access and other vascular grafts
20080085973 - Nitroxide compounds for minimizing scorch in crosslinkable compositions
20080078374 - Hinge mechanism for barbeque grills and smokers
20080078445 - Electronic device module comprising polyolefin copolymer
March 2008 - Whyte Hirschboeck Dudek S.c. patents
20080074852 - Elimination of rdl using tape base flip chip on flex for die stacking
20080064821 - Nanohybrid polymers for ophthalmic applications
20080064840 - Nanohybrid polymers for ophthalmic applications
20080057527 - Methods for carboxypeptidases
February 2008 - Whyte Hirschboeck Dudek S.c. patents
20080041725 - Method of selectively removing conductive material
20080032449 - Stacked die in die bga package
20080033756 - System and method for obtaining, maintaining and maximizing healthcare benefits
December 2007 - Whyte Hirschboeck Dudek S.c. patents
20070292545 - Anti-infective agents and methods of use
20070287164 - Alpha methylacyl a coenzyme racemase detection
20070278611 - Modified facet etch to prevent blown gate oxide and increase etch chamber life
November 2007 - Whyte Hirschboeck Dudek S.c. patents
20070272768 - Water-based airless adhesive application container
20070273417 - Method and system for improved efficiency of synchronous mirror delays and delay locked loops
20070262048 - Highly selective doped oxide etchant
20070264751 - Super high density module with integrated wafer level packages
20070251883 - Reverse osmosis membrane with branched poly(alkylene oxide) modified antifouling surface
20070254176 - Multi-layer, pre-stretched elastic articles
October 2007 - Whyte Hirschboeck Dudek S.c. patents
20070249798 - Isotactic propylene copolymers, their preparation and use
20070234574 - Ball bearing assisted cutting implements
20070238297 - Method of manufacture of constant groove depth pads
September 2007 - Whyte Hirschboeck Dudek S.c. patents
20070214661 - Pencil-sharpening device
20070218806 - Embedded fiber acoustic sensor for cmp process endpoint
20070207622 - Highly selective doped oxide etchant
August 2007 - Whyte Hirschboeck Dudek S.c. patents
20070200276 - Method for rapid printing of near-field and imprint lithographic features
20070202088 - Microorganisms and methods for treating poultry
20070193975 - Using positive dc offset of bias rf to neutralize charge build-up of etch features
20070186421 - Coating for cutting implements
20070184509 - Methods for transferases
July 2007 - Whyte Hirschboeck Dudek S.c. patents
20070169602 - Device for scoring or cutting sheet material
20070170018 - Positive pad retraction and retention device
20070170552 - Ultra thin tcs (sicl4) cell nitride for dram capacitor with dcs (sih2cl2) interface seeding layer
20070163391 - Decorative scissor handles and method for manufacturing decorative scissor handles
20070163851 - High thermal transfer caliper
20070152259 - Method of forming inside rough and outside smooth hsg electrodes and capacitor structure
20070152327 - Super high density module with integrated wafer level packages
20070156803 - Overflow detection and clamping with parallel operand processing for fixed-point multipliers
June 2007 - Whyte Hirschboeck Dudek S.c. patents
20070144015 - Mechanically assisted scissors
20070145558 - Super high density module with integrated wafer level packages
May 2007 - Whyte Hirschboeck Dudek S.c. patents
20070122613 - Isotactic propylene copolymer fibers, their preparation and use
20070102491 - Flip chip dip coating encapsulant
March 2007 - Whyte Hirschboeck Dudek S.c. patents
20070048955 - Method for enhancing electrode surface area in dram cell capacitors
February 2007 - Whyte Hirschboeck Dudek S.c. patents
20070022613 - Scissors
January 2007 - Whyte Hirschboeck Dudek S.c. patents
20070004852 - Ophthalmic apparatuses and methods
December 2006 - Whyte Hirschboeck Dudek S.c. patents
20060289902 - Method for forming raised structures by controlled selective epitaxial growth of facet using spacer
20060289918 - Low resistance peripheral local interconnect contacts with selective wet strip of titanium
20060289949 - Method of composite gate formation
20060289950 - Method of composite gate formation
20060289951 - Method of composite gate formation
20060289952 - Method of composite gate formation
20060289989 - Intrinsic thermal enhancement for fbga package
20060289993 - Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
20060290011 - Molded stiffener for thin substrates
20060292743 - Stacked die in die bga package
20060292745 - Stacked die in die bga package
20060292746 - Stacked die in die bga package
20060292750 - Standoffs for centralizing internals in packaging process
20060292875 - Method for enhancing electrode surface area in dram cell capacitors
20060284269 - Method for forming raised structures by controlled selective epitaxial growth of facet using spacer
20060275839 - Genes
November 2006 - Whyte Hirschboeck Dudek S.c. patents
20060268655 - Method and system for improved efficiency of synchronous mirror delays and delay locked loops
20060269852 - Method to recover the exposure sensitivity of chemically amplified resins from post coat delay effect
20060269853 - Method to recover the exposure sensitivity of chemically amplified resins from post coat delay effect
20060271135 - Medical devices with aromatic polyimide coating
20060257871 - One step real-time rt pcr kits for the universal detection of organisms in industrial products
20060249252 - Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
20060250139 - Bond pad structure comprising multiple bond pads with metal overlap
20060252268 - Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
20060252844 - Ultra violet, violet, and blue light filtering polymers for ophthalmic applications
20060246714 - Method of forming a conductive contact
October 2006 - Whyte Hirschboeck Dudek S.c. patents
20060237832 - Standoffs for centralizing internals in packaging process
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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Whyte Hirschboeck Dudek S.c. in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Whyte Hirschboeck Dudek S.c. with additional patents listed. Browse our Agent directory for other possible listings.
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