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Wave transmission lines and networks November USPTO class listing 11/08

20080290960 - Apparatus of impedance matching for bidirectional data line: An apparatus includes a bidirectional data line to couple to a device and an impedance to provide an impedance matching between the data line and the device. In some embodiments, when a direction of data flow in the data line is away from the device, the impedance is of a... Agent: Schwegman, Lundberg & Woessner / Infineon

20080290959 - Millimeter wave integrated circuit interconnection scheme: A millimeter-wave integrated circuit (IC) package is disclosed. The package includes a substrate having a plurality of layers and a vertical interconnection. The vertical interconnection comprises a shielded transition between the plurality of layers and a compensation structure to minimize the parasitic effect of the transition.... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080290961 - Semiconductor device: Disclosed is a semiconductor device including an input/output circuit having a terminal capacitance adjustment circuit connected to a signal line between an external pin and an initial-stage circuit; a command decoder for decoding an entered command and detecting a terminal capacitance adjustment command; and a terminal capacitance control circuit, which... Agent: Sughrue Mion, PLLC

20080290962 - Radio frequency switch: An RF switch is provided. In the RF switch, a T-junction slot line has a horizontal slot line and a vertical slot line. An open-end circuit is provided at each end portion of the horizontal and vertical slot lines. A first transmission line delivers signals from and to one portion... Agent: Cha & Reiter, LLC

20080290963 - Radio frequency switch: An RF switch is provided. In the RF switch, a slot line is divided into a first slot line and a second slot line and an open-end circuit is provided at each end portion of the first and second slot lines. A first transmission line delivers signals from and to... Agent: Cha & Reiter, LLC

20080290964 - Branching filter package: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the... Agent: Venable LLP

20080290965 - Component operating on acoustic waves: A component operating with acoustic waves is described herein. The component includes a substrate having an underside subdivided into a center area and an edge area surrounding die center area on all sides. The component also includes a plurality of outer terminals in the edge area, and a plurality of... Agent: Fish & Richardson PC

20080290966 - Adaptive radio transceiver with filtering: An exemplary embodiment of the present invention described and shown in the specification and drawings is a transceiver with a receiver, a transmitter, a local oscillator (LO) generator, a controller, and a self-testing unit. All of these components can be packaged for integration into a single IC including components such... Agent: Mcandrews Held & Malloy, Ltd

20080290967 - Offset footprint of a connector on a printed board:

20080290968 - Boundary acoustic wave device and method for manufacturing the same: A boundary acoustic wave device includes a first medium, a second medium, and an IDT electrode disposed at an interface between the first medium and the second medium, the IDT electrode having an Au layer defining a main electrode layer, wherein a Ni layer is laminated so as to contact... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080290969 - Piezoelectric resonator, piezoelectric filter, and duplexer and communication device using the same: Three or more piezoelectric resonators having resonance frequencies different from one another are realized on the same substrate. First through third frequency adjustment layers 107a through 107c of first through third piezoelectric resonators 102a through 102c provided on the same substrate 101 are formed by varying, among the frequency adjustment... Agent: Wenderoth, Lind & Ponack L.L.P.

20080284537 - Impedance matching network, and plasma processing apparatus using such impedance matching network: Provided is an impedance matching network having: an amplitude-adjusting variable capacitor and a phase-adjusting variable capacitor that are positioned between an input terminal and an output terminal, matching being achieved by adjustment of values of the variable capacitors; a first capacitor connected in series to one of the variable capacitors;... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080284539 - High frequency circuit, semiconductor device, and high frequency power amplification device: A small, high performance, multifunctional high frequency circuit that is multiband and multimode compatible reduces loss from a switch formed on the output side of a final stage amplification unit. The final stage amplification unit power amplifies an input signal and outputs an amplified signal. A first matching circuit impedance... Agent: Ratnerprestia

20080284538 - Printed circuit board: A printed circuit board includes a signal layer, a first reference plane layer, and a second reference plane layer. At least one transmission line is arranged on the signal layer. The transmission line includes a main transmission line, and two branch transmission lines connected to an end of the main... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080284540 - Antenna duplexer: An antenna duplexer is provided, which can be built with a smaller size and lower height than ever without compromising out-of-band attenuation characteristic and isolation characteristic between a transmit terminal and a receive terminal. The antenna duplexer includes a transmit filter provided between an antenna terminal and the transmit terminal,... Agent: Arent Fox LLP

20080284541 - Bulk acoustic device and method for fabricating: A method for fabricating a bulk acoustic wave (BAW) device comprising providing a growth substrate and growing an Group-III nitride epitaxial layer on the growth substrate. A first electrode is deposited on the epitaxial layer. A carrier substrate is provided and the growth substrate, epitaxial layer and first electrode combination... Agent: Koppel, Patrick & Heybl

20080284542 - Film bulk acoustic resonator: A film bulk acoustic resonator includes: a substrate; a lower electrode held on the substrate with at least a portion thereof being in a hollow state; a piezoelectric film provided on the lower electrode; and an upper electrode provided on the piezoelectric film. At least one of the lower electrode... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080284543 - Piezoelectric thin-film resonator and filter: A piezoelectric thin-film resonator includes: a lower electrode that is formed on a substrate; a piezoelectric film that is formed on the substrate and the lower electrode; an upper electrode that is formed on the piezoelectric film, with a portion of the piezoelectric film being interposed between the lower electrode... Agent: Arent Fox LLP

20080284544 - Mems filter device and manufacturing method thereof: An object of the invention is to provide a coupling element of an MEMS filter with design flexibility and minimization of mass loading effects. The invention provides a structure wherein the mass loading effects are not reflected on the MEMS filter characteristic by using a nanosize coupling element with a... Agent: Pearne & Gordon LLP

20080284545 - Fixed impedance low pass metal powder filter with a planar buried stripline geometry: A fixed impedance low pass metal powder filter having a planar buried stripline geometry comprises first and second parallel ground planes spaced from one another and a central stripline spaced equal distance from the first and second parallel ground planes and parallel thereto. The space between the first and second... Agent: Whitham, Curtis & Christofferson, P.C.

20080278256 - Rf - coupled digital isolator: An RF-coupled digital isolator includes a first leadframe portion and a second leadframe portion, electrically isolated from one another. The first leadframe portion includes a first main body and a first finger. The second leadframe portion includes a second main body and a second finger. The first main body is... Agent: Fliesler Meyer LLP

20080278255 - Rf-coupled digital isolator: An RF-coupled digital isolator includes a first leadframe portion and a second leadframe portion, electrically isolated from one another. The first leadframe portion includes a first main body and a first finger. The second leadframe portion includes a second main body and a second finger. The first main body is... Agent: Fliesler Meyer LLP

20080278257 - Managed wideband radio frequency distribution system with signal level enabling interface device: A system and method for managing distribution of wideband radio frequency signals includes detecting an impedance signature of a device connected at the end of transmission medium. A switch is opened to apply a wideband radio frequency signal to a transmission medium for distribution. A biasing voltage can be applied... Agent: Buchanan, Ingersoll & Rooney PC

20080278258 - Integrated circuit having re-configurable balun circuit and method therefor: A balun circuit comprises a balun transformer having first and second windings, and first and second variable capacitors. The first variable capacitor has a first plate electrode coupled to the first terminal of the first winding, and a second plate electrode coupled to the second terminal of the first winding.... Agent: Freescale Semiconductor, Inc. Law Department

20080278260 - Matching circuit: First, second and third matching parts 110, 120, and 130 are connected in series between a circuit element 199 whose impedance has a frequency characteristic and a circuitry 198 having a constant impedance. The second matching part 120 has the capability of converting impedances. The first matching part 110 operates... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080278259 - Methods for designing switchable and tunable broadband filters using finite-width conductor-backed coplanar waveguide structures: This invention uses the structures of the finite-sized conductor-backed coplanar waveguides for designing broadband switchable and tunable signal filters. The design methods construct a plurality of configurations, which including waveguides, via holes, metallic posts, and conductor planes in the structures, for selecting, coupling, converting, and dissipating of the signals with... Agent: Troxell Law Office PLLC

20080278261 - Millimeter-band switching circuit: A millimeter-band switching circuit easily corrects a varied off capacitance of a switching element without shifting position of the switching element. The millimeter-band switching circuit includes: a coupling line having a line length that can be changed; a first input and output terminal; a second input and output terminal; a... Agent: Leydig Voit & Mayer, Ltd

20080278262 - Zig-zag array resonators for relatively high-power hts applications: A narrowband filter comprises an input terminal, an output terminal, and an array of basic resonator structures coupled between the terminals to form a single resonator having a resonant frequency. The resonator array may be arranged in a plurality of columns of basic resonator structures, with each column of basic... Agent: VistaIPLaw Group LLP

20080278263 - Low phase noise testing system utilizing a crystal filter: According to one embodiment, a low phase noise testing system includes a tester providing a high phase noise digital channel output. The low phase noise testing system further includes a crystal filter configured to receive the digital channel output and to pass a narrow frequency range from the digital channel... Agent: Farjami & Farjami LLP

20080278265 - Dual band resonator and dual band filter: A signal input/output line 101 is used for input and output of a signal. A first resonating part 102 is connected to the signal input/output line 101 at one end and is opened at the other end. A second resonating part 103 is connected to a ground conductor 105 at... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080278264 - Wireless energy transfer: Disclosed is an apparatus for use in wireless energy transfer, which includes a first resonator structure configured to transfer energy non-radiatively with a second resonator structure over a distance greater than a characteristic size of the second resonator structure. The non-radiative energy transfer is mediated by a coupling of a... Agent: Fish & Richardson PC

20080278266 - Temperature compensation apparatus for frequency stabilization: A temperature compensation apparatus for a cavity filter including a plunger barrel, a compensation barrel having a first coefficient of thermal expansion, wherein the compensation barrel is housed with the plunger barrel, a tuning rod housed primarily within the compensation barrel, the tuning rod having a second coefficient of thermal... Agent: Simpson & Simpson, PLLC

20080278267 - Large diameter rf rotary coupler: A rotary coupler comprises a stator 1 having a first face 3a and a rotor 2 having a second face 4a, the first and second faces 3a, 4a being spaced apart from and facing each other. A first electrically conducting track 5 is provided on the first face 3a of... Agent: Keusey, Tutunjian & Bitetto, P.C.

20080272864 - Gain compensation circuit: A gain compensation circuit, applied to a microwave transceiver, includes a gain adjuster, a first attenuator and a second attenuator. The gain adjuster is disposed between a first amplifier and a filter for adjusting a nominal gain of the microwave transceiver. The first attenuator is disposed between the filter and... Agent: Connolly Bove Lodge & Hutz LLP

20080272865 - Gain compensation circuit: A gain compensation circuit comprises a first amplifier, a second amplifier, a filter, a first attenuator, a second attenuator and a third attenuator. The first amplifier is configured to amplify an input signal of the microwave signal processor. The filter is disposed between the first and second amplifiers. The first... Agent: Connolly Bove Lodge & Hutz LLP

20080272853 - Filter that comprises bulk acoustic wave resonators and that can be operated symmetrically on both ends: A filter for use with bulk acoustic waves includes an input port and an output port. The input port and the output port are symmetrically operable. Signal paths extend from a terminal of the input port to a terminal of the output port. Bulk acoustic wave resonators are in the... Agent: Fish & Richardson PC

20080272854 - Antenna duplexer and wireless terminal using the same: A technology which can realize a high-performance multiband operation in a compact circuit configuration and is advantageous for a wireless terminal of GSM system for which the further increase of the demands is expected in the future is provided. Provided is a multiband switch type antenna duplexer adopted in a... Agent: Mattingly, Stanger, Malur & Brundidge, P.C.

20080272855 - Laminate type band pass filter and diplexer using the same: It is possible to generate an additionally attenuation pole in a laminate type band pass filter without adding an attenuation circuit and improve the attenuation characteristics of the laminate type band pass filter by independently controlling the frequencies of the attenuation poles. A diplexer is realized by using at least... Agent: Stites & Harbison PLLC

20080272856 - Arrangement relating to antenna communication: An arrangement for providing communication between a radio antenna and a radio base station in a cellular communication system. A waveguide is configured to connect the radio base station to the antenna. The waveguide may be connected directly or indirectly to the radio base station and/or the antenna. The waveguide... Agent: Ericsson Inc.

20080272857 - Tunable millimeter-wave mems phase-shifter: A phase shifter for and a method for shifting phase in an antenna configured to emit a radio signal at a wavelength include a transmission line. The transmission line has a length along a primary axis and a width across a secondary axis. The primary axis and secondary axis intersect... Agent: Honeywell International Inc. Patent Services Ab-2b

20080272858 - Surface acoustic wave device: A surface acoustic wave device having a three-layered structure of sealing resin for sealing a mounting substrate and a surface acoustic wave element in which the elastic modulus of resin of the intermediate layer is higher than that of resin of the outermost layer and the elastic modulus of resin... Agent: Ratnerprestia

20080272859 - Photonic crystal device: A photonic crystal device according to the present invention includes: a first dielectric substrate 104 having a first lattice structure, of which the dielectric constant changes periodically within a first plane; a second dielectric substrate 105 having a second lattice structure, of which the dielectric constant changes periodically within a... Agent: Mcdermott Will & Emery LLP

20080272861 - Cross coupling tuning apparatus for dielectric resonator circuit: The invention is an apparatus and technique for tuning the cross coupling of resonators in a dielectric resonator circuit. A cross coupling element such as a coaxial cable having a first end positioned adjacent a first resonator in the circuit and a second end position adjacent a second resonator is... Agent: Tyco Technology Resources

20080272860 - Tunable dielectric resonator circuit: A dielectric resonator circuit is provided that is tunable over a broad frequency range and/or a broad bandwidth range. The center frequency is made tunable over a broad range by use of a dielectric tuning plug that is positioned in a through hole within the resonator. The bandwidth is made... Agent: Tyco Technology Resources

20080272862 - Electrically optimized and structurally protected via structure for high speed signals: An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a... Agent: Ibm Corp. (wip) C/o Walder Intellectual Property Law, P.C.

20080272863 - Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs: The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of the signal trace pattern. The... Agent: Lsi Corporation