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Wave transmission lines and networks inventions 10/08

Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
10/23/2008 > patent applications in patent subcategories.

20080258836 - Impedance matching methods and systems performing the same: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line including the matching system and the load; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling... Agent: Jenkins, Wilson, Taylor & Hunt, P. A.

20080258837 - Balun signal transformer: A system 20 includes an unbalanced device 22, a balanced device 24, and a balun (balanced-unbalanced) signal transformer 26 interposed between devices 22 and 24. The balun signal transformer 26 includes a balanced external port section 32 formed by ports 40 and 42. The balun signal transformer 26 includes a... Agent: Meschkow & Gresham, P.L.C

20080258838 - Multilayer balun, hybrid integrated circuit module, and multilayer substrate: A multilayer balun comprises first and second transmission lines that constitute a half-wave transmission line are opposed in adjacent layers, with a dielectric substance therebetween, so that, during use, the current of the first transmission line and the current of the second transmission line flow in the same direction. Thus,... Agent: Knobbe Martens Olson & Bear LLP

20080258849 - Low pass metal powder filter: A low pass filter having a coaxial structure of an inner conductor, an outer conductor and a metal powder composite interposed between the inner and outer conductor. Embodiments include a 50Ω characteristic impedance. The metal powder can be bronze, copper or other metals, mixed in an epoxy carrier.... Agent: Whitham, Curtis & Christofferson, P.C.

20080258839 - High-frequency switching module and frequency-characteristic adjusting method for high-freqency circuit: A high-frequency switching module in which a high-frequency switch including a diode, which functions as a switching device, and a high-frequency filter including inductors and a capacitor are integrated with each other. The inductor defining a π-type high-frequency filter is connected directly and in series to the diode. By inserting... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080258840 - Multilayer filter: A multilayer filter comprises an inductor stacked-layer portion and a varistor stacked-layer portion. The varistor stacked-layer portion has a varistor layer the main component of which is ZnO and a hot electrode and ground electrode positioned in opposite with the varistor layer intervening, and the region enclosed between the opposing... Agent: Oliff & Berridge, PLC

20080258842 - Acoustic resonator performance enhancement using alternating frame structure: Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second... Agent: Agilent Technologies Inc.

20080258841 - Wireless acoustic-electric feed-through for power and signal transmission: An embodiment provides electrical energy from a source on one side of a medium to a load on the other side of the medium, the embodiment including a first piezoelectric to generate acoustic energy in response to electrical energy from the source, and a second piezoelectric to convert the received... Agent: Seth Z. Kalson C/o Intollevate

20080258844 - Method for manufacturing surface acoustic wave device and surface acoustic wave device: A method for manufacturing a surface acoustic wave filter device includes a step of forming grooves in one principal surface of a piezoelectric substrate, a step of embedding a metallic film in the grooves to form IDT electrodes, a step of performing a process of removing a portion of the... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080258843 - Surface acoustic wave passband control: An apparatus in one example comprises a piezoelectric layer, an input transducer, an output transducer, and at least one electrode set. The input transducer is configured to convert an input signal from an input source to a surface acoustic wave and send the surface acoustic wave from an input portion... Agent: Patti, Hewitt & Arezina LLC

20080258846 - Elastic wave filter: An elastic wave filter of a resonator type includes at least one IDT electrode arranged so as to contact the piezoelectric substance. The elastic wave filter is arranged such that an elastic wave in a main propagation mode for obtaining target frequency characteristics and an elastic wave in a sub-propagation... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080258845 - Resonator operating with bulk acoustic waves: Disclosed is a resonator that is mounted on a substrate, operates with acoustic bulk waves, and is disposed above an acoustic mirror. According to the invention, the basic mode of the acoustic bulk wave that can be generated in the resonator is suppressed while a higher mode can be excited... Agent: Fish & Richardson PC

20080258847 - Composite resonator for use in tunable or fixed filters: A fixed or tunable resonator. The resonator includes an inner conductor, a hollow outer conductor, and a hollow insulating layer. The hollow outer conductor forms a first inner space. The hollow insulating layer is formed from an outer soft dielectric layer, an inner soft dielectric layer, and a ceramic layer... Agent: Ratnerprestia

20080258848 - Spring loaded microwave interconnector: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The... Agent: Raytheon Company Patent Docket Administration, E04/n119

  
10/23/2008 > patent applications in patent subcategories.

20080258836 - Impedance matching methods and systems performing the same: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line including the matching system and the load; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling... Agent: Jenkins, Wilson, Taylor & Hunt, P. A.

20080258837 - Balun signal transformer: A system 20 includes an unbalanced device 22, a balanced device 24, and a balun (balanced-unbalanced) signal transformer 26 interposed between devices 22 and 24. The balun signal transformer 26 includes a balanced external port section 32 formed by ports 40 and 42. The balun signal transformer 26 includes a... Agent: Meschkow & Gresham, P.L.C

20080258838 - Multilayer balun, hybrid integrated circuit module, and multilayer substrate: A multilayer balun comprises first and second transmission lines that constitute a half-wave transmission line are opposed in adjacent layers, with a dielectric substance therebetween, so that, during use, the current of the first transmission line and the current of the second transmission line flow in the same direction. Thus,... Agent: Knobbe Martens Olson & Bear LLP

20080258849 - Low pass metal powder filter: A low pass filter having a coaxial structure of an inner conductor, an outer conductor and a metal powder composite interposed between the inner and outer conductor. Embodiments include a 50Ω characteristic impedance. The metal powder can be bronze, copper or other metals, mixed in an epoxy carrier.... Agent: Whitham, Curtis & Christofferson, P.C.

20080258839 - High-frequency switching module and frequency-characteristic adjusting method for high-freqency circuit: A high-frequency switching module in which a high-frequency switch including a diode, which functions as a switching device, and a high-frequency filter including inductors and a capacitor are integrated with each other. The inductor defining a π-type high-frequency filter is connected directly and in series to the diode. By inserting... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080258840 - Multilayer filter: A multilayer filter comprises an inductor stacked-layer portion and a varistor stacked-layer portion. The varistor stacked-layer portion has a varistor layer the main component of which is ZnO and a hot electrode and ground electrode positioned in opposite with the varistor layer intervening, and the region enclosed between the opposing... Agent: Oliff & Berridge, PLC

20080258842 - Acoustic resonator performance enhancement using alternating frame structure: Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second... Agent: Agilent Technologies Inc.

20080258841 - Wireless acoustic-electric feed-through for power and signal transmission: An embodiment provides electrical energy from a source on one side of a medium to a load on the other side of the medium, the embodiment including a first piezoelectric to generate acoustic energy in response to electrical energy from the source, and a second piezoelectric to convert the received... Agent: Seth Z. Kalson C/o Intollevate

20080258844 - Method for manufacturing surface acoustic wave device and surface acoustic wave device: A method for manufacturing a surface acoustic wave filter device includes a step of forming grooves in one principal surface of a piezoelectric substrate, a step of embedding a metallic film in the grooves to form IDT electrodes, a step of performing a process of removing a portion of the... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080258843 - Surface acoustic wave passband control: An apparatus in one example comprises a piezoelectric layer, an input transducer, an output transducer, and at least one electrode set. The input transducer is configured to convert an input signal from an input source to a surface acoustic wave and send the surface acoustic wave from an input portion... Agent: Patti, Hewitt & Arezina LLC

20080258846 - Elastic wave filter: An elastic wave filter of a resonator type includes at least one IDT electrode arranged so as to contact the piezoelectric substance. The elastic wave filter is arranged such that an elastic wave in a main propagation mode for obtaining target frequency characteristics and an elastic wave in a sub-propagation... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080258845 - Resonator operating with bulk acoustic waves: Disclosed is a resonator that is mounted on a substrate, operates with acoustic bulk waves, and is disposed above an acoustic mirror. According to the invention, the basic mode of the acoustic bulk wave that can be generated in the resonator is suppressed while a higher mode can be excited... Agent: Fish & Richardson PC

20080258847 - Composite resonator for use in tunable or fixed filters: A fixed or tunable resonator. The resonator includes an inner conductor, a hollow outer conductor, and a hollow insulating layer. The hollow outer conductor forms a first inner space. The hollow insulating layer is formed from an outer soft dielectric layer, an inner soft dielectric layer, and a ceramic layer... Agent: Ratnerprestia

20080258848 - Spring loaded microwave interconnector: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The... Agent: Raytheon Company Patent Docket Administration, E04/n119

  
10/16/2008 > patent applications in patent subcategories.

20080252393 - Balun circuit suitable for integration with chip antenna: A balun including a single-ended port, a differential port and first and second sets of coupled transmission line sections. Each set has three coupled transmission line sections. The signal carrying terminal of the single-ended port is connected to an inner end of a third coupled transmission line sections in one... Agent: Oliff & Berridge, PLC

20080252394 - Surface acoustic wave device and duplexer: A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43° to 53° from a Y axis to a Z axis direction about an X axis, and... Agent: Arent Fox LLP

20080252395 - Compact coils for high performance filters: A coil structure for a filter device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil.... Agent: Quarles & Brady LLP

20080252396 - Electroacoustic component: A component working with guided bulk acoustic waves includes a first substrate, a second substrate, and a layer system between the first and second substrates. The layer system includes a metal layer and a dielectric layer. A ratio of the acoustic impedance of the metal layer to the acoustic impedance... Agent: Fish & Richardson PC

20080252397 - Baw resonator filter bandwidth and out-of-band frequency rejection: Embodiments of the present invention provide systems, devices and methods for improving both the bandwidth of a BAW resonator bandpass filter and the suppression of out-of-band frequencies above the passband. In various embodiments of the invention, blocker inductors are located in series between the filter input and the filter output... Agent: North Weber & Baugh LLP

20080252398 - Bulk acoustic wave (baw) filter having reduced second harmonic generation and method of reducing second harmonic generation in a baw filter: In a filter having a half-ladder structure comprising an alternating series of series branches and shunt branches, including a signal input and a signal output related to a common ground. at least one series branch or one parallel branch of the filter is configured as a BAW device comprising a... Agent: Kathy Manke Avago Technologies Limited

20080252399 - Passband resonator filter with predistorted quality factor q: A filter for processing an RF signal includes an input port and an output port and a plurality of resonators. The resonators are arranged in a sequentially-coupled arrangement between the input and output ports to affect an RF signal therebetween. Each resonator includes a cavity and resonant element. The resonant... Agent: Wood, Herron & Evans, LLP

20080252400 - Filter and radio communication device using the same: A filter includes a resonant unit which has a plurality of resonators respectively formed of each microstrip line and connected in cascade with one another, and a coupling unit which has at least one inter-resonator coupling of the resonant unit in an area within a range of ±45° (⅛-wavelength) in... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080252401 - Evanescent mode resonator including tunable capacitive post: An evanescent mode resonator including a cavity formed in a substrate of semiconductor material. The resonator includes a capacitive post positioned within the cavity, and a tuning element positioned within the wall of the cavity proximate to the capacitive post, where a gap between the flexible element and the post... Agent: MillerIPGroup, PLC Emag Technologies, Inc.

  
10/09/2008 > patent applications in patent subcategories.

20080246551 - Interleaved non-linear transmission lines for simultaneous rise and fall time compression: A non-linear waveguide comprises a transmission line including a first conductive line and a second conductive line; a first bias voltage supply connected with the transmission line; and one or more pairs of diodes connected between the first conductive line and the second conductive line, the one or more pairs... Agent: Fliesler Meyer LLP

20080246552 - Balanced acoustic wave filter device: A surface acoustic wave filter device includes an unbalanced terminal, first and second balanced terminals, and first, second and third IDTs. One end of the first IDT and one end of the third IDT are connected to the unbalanced terminal. The second IDT includes first and second divided IDT portions... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080246553 - Structure of coaxial-to-waveguide transition and traveling wave tube: The present invention includes a waveguide for outputting radio frequency wave, a vacuum envelope provided with a slow-wave circuit, a coaxial connection part connecting the waveguide and the vacuum envelope, an insulating window member which is provided in the coaxial connection part and which hermetically seals a said of vacuum... Agent: Sughrue Mion, PLLC

20080246554 - Semiconductor devices and methods for inspecting the same: A method for inspecting a semiconductor device includes establishing a first circuit state in which electrical conduction through at least one of branch transmission line portions is established and electrical conduction through at least one other branch transmission line portion is prevented. Then, electrical signal reflection characteristics of the transmission... Agent: Leydig Voit & Mayer, Ltd

20080246555 - Differential electrical connector with skew control: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers each containing a column of conductive elements, some of which form differential pairs. A housing for the wafer is formed with regions of higher and lower dielectric constant material. The regions of lower dielectric... Agent: Wolf Greenfield & Sacks, P.C.

20080246557 - Component comprising at least one filter that operates with acoustic waves: A component includes a first filter configured to work with acoustic waves. The first filter includes a first sub-filter on a first chip and a second sub-filter on a second chip separate from the first chip. The first filter if a different type of filter, has a different layer structure,... Agent: Fish & Richardson PC

20080246556 - Filter assembly comprising two bulk wave resonators: An arrangement includes a substrate, a filter, a first bulk acoustic wave resonator, a second bulk acoustic wave resonator, and a large surface covering. The first bulk acoustic wave resonator includes a first electrode and a second electrode and is arranged flatly on the substrate. The second bulk acoustic wave... Agent: Fish & Richardson PC

20080246558 - Miniature rf and microwave components and methods for fabricating such components: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20080246559 - Lithographically-defined multi-standard multi-frequency high-q tunable micromechanical resonators: Disclosed are micromechanical resonator apparatus having features that permit multiple resonators on the same substrate to operate at different operating frequencies. Exemplary micromechanical resonator apparatus includes a support substrate and suspended micromechanical resonator apparatus having a resonance frequency. In one embodiment, the suspended micromechanical resonator apparatus comprises a device substrate... Agent: The Law Offices Of Kenneth W. Float

20080246560 - Saw filter featuring impedance transformation: A surface acoustic wave (SAW) filter includes at least one first electroacoustic transducer, and at least one second electroacoustic transducer. The at least one first electroacoustic transducer and the at least one second electroacoustic transducer are side-by-side inside an acoustic track having an aperture A0. The at least one first... Agent: Fish & Richardson PC

20080246561 - Multiband filter: A multiband filtering apparatus (40) for use in a communications system, said apparatus including a housing (21); a plurality of cavities (22.1, 22.2) disposed within said housing wherein each cavity includes a resonant structure, the resonant structure having at least one ceramic element (23.1, 23.2); at least one input port... Agent: Law Office Of James Trosino

20080246562 - Coaxial transmission line microstructures and methods of formation thereof: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.... Agent: Jonathan D. Baskin Rohm And Haas Electronic Materials LLC

  
10/02/2008 > patent applications in patent subcategories.

20080238567 - Electrical component for the front end circuit of a transceiver: An electrical component is described with a first signal path (TX, RX1) and a second signal path (RX, RX2) that are connected to a common signal path (ANT, RX12). In the first signal path a first filter (F1) is arranged, and in the second signal path a second filter (F2)... Agent: Fish & Richardson PC

20080238580 - T-shape waveguide twist-transformer: A junction for connecting two waveguides (101, 103) having substantially a 90-degree angular offset between longitudinal symmetry axes of their cross-sections, said junction comprising a first interface (102) and a second interface (104) for connecting said waveguides (101, 103), and further comprising at least a first transformer section (202) and... Agent: Coats & Bennett, PLLC

20080238579 - Waveguide corner and radio device: A waveguide corner including a first rectangular waveguide and a second rectangular waveguide. An end face of the second rectangular waveguide is made open to an H-plane wall of the first rectangular waveguide and the H-plane walls of the second rectangular waveguide are disposed along the pipe axis of the... Agent: Dickstein Shapiro LLP

20080238582 - Flexible capacitive coupler assembly and method of manufacture: A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric... Agent: Cantor Colburn LLP-ibm Yorktown

20080238583 - Discrete component electromagnetic coupler: In some embodiments a discrete component electromagnetic coupler includes an input and an output, wherein a signal to be observed passes through the coupler via the input and the output, a coupler to transfer energy through electromagnetic effects to a second output, and a termination point to ground through a... Agent: Intel/bstz Blakely Sokoloff Taylor & Zafman LLP

20080238568 - Package embedded three dimensional balun: Methods and apparatus relating to package embedded three dimensional baluns are described. In one embodiment, components of one or more baluns may be embedded in a single semiconductor substrate. Other embodiments are also described.... Agent: Caven & Aghevli C/o Intellevate, LLC

20080238587 - Package embedded equalizer: A passive equalizer circuit is embedded within a substrate of a package containing an integrated circuit. It is believed that substantial reduction in uneven frequency dependent loss may be achieved for interconnects interconnecting the integrated circuit with other integrated circuits on a printed circuit board. Other aspects are described and... Agent: Konrad Raynes & Victor, LLP. Attn: Int77

20080238588 - Programmable passive equalizer: Embodiments of a programmable passive equalizer are described herein.... Agent: Lee & Hayes, PLLC C/o Intellevate, LLC

20080238569 - Variable matching circuit: A variable matching circuit includes a variable capacitance circuit formed of a capacitor coupled to varactor diode and provided between terminals, and a resonator-type circuit includes a plurality of inductors and a variable capacitance circuit formed of a capacitor and a varactor diode. The inductors and the variable capacitance circuit... Agent: Ratnerprestia

20080238570 - Spst switch, spdt switch and mpmt switch: A single pole single throw switch for controlling propagation of a high frequency signal between an input terminal (11a) and an output terminal (11b). First FET switches (14a, 14b) in which drains and sources of FETs (12a, 12b) are connected in parallel with inductors (13a, 13b) are connected in parallel.... Agent: Birch Stewart Kolasch & Birch

20080238571 - Detection device: Since known detection devices include detectors of the same number as that of samples, the system configuration is complicated. According to the present invention, therefore, a plurality of electromagnetic-wave-transmission lines with different propagation-delay times and a coupled-transmission line coupling the electromagnetic-wave-transmission lines with each other are provided, and an electromagnetic... Agent: Fitzpatrick Cella Harper & Scinto

20080238572 - Surface acoustic wave device and duplexer and communication device using the same: A surface acoustic wave device includes a first surface acoustic wave filter forming a ladder filter circuit; and a second surface acoustic wave filter having a passband at a frequency range higher than that of the first surface acoustic wave filter. The first surface acoustic wave filter includes a series-arm... Agent: Bacon & Thomas, PLLC

20080238573 - Coupling circuit and network device for power line communication: A coupling circuit is used in a power line communication system for bridging a signal of a high frequency between lines of a single-phase three-line type which feed an electric current having a low frequency as compared to the high frequency of the signal and which include a first power... Agent: Crowell & Moring LLP Intellectual Property Group

20080238574 - Multilayer filter: A multilayer filter 1 according to an embodiment of the present invention is a multilayer filter in which an inductor section 7 and a varistor multilayer section 9 are arranged to form an interface P, wherein varistor layers 81-84 contain ZnO as a major ingredient and additives of at least... Agent: Oliff & Berridge, PLC

20080238575 - Electro mechanical device and manufacturing method thereof, and resonator and manufacturing method thereof: An electro mechanical device including: a main body of an electro mechanical device having a lower electrode and a movable member; an overcoat film sealing the main body of the electro mechanical device by maintaining a space, wherein a support post is provided between the overcoat film and the movable... Agent: Sonnenschein Nath & Rosenthal LLP

20080238576 - Longitudinally coupled resonator-type surface acoustic wave filter: Disclosed is a surface acoustic wave filter comprising two or more IDTs arranged in a propagation direction of the surface acoustic wave, wherein said two or more IDTs include at least one pair of IDTs arranged adjacent to each other in order to be acoustically coupled to each other, and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080238578 - Coplanar waveguide resonator and coplanar waveguide filter using the same: A coplanar waveguide resonator (100a) has a center conductor (101) formed on a dielectric substrate (105) that has a line conductor (a center line conductor) (101b) extending in the input/output direction, a ground conductor (103) that is disposed on the dielectric substrate (105) across a gap section from the center... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080238577 - Reflection-type bandpass filter: A reflection-type bandpass filter for ultra-wideband wireless data communication is provided. The filter comprises two conductors extending in a first direction on the surface of a dielectric substrate at a first distance from each other, the surface of the dielectric substrate between the conductors defining a non-conducting portion, wherein the... Agent: Sughrue Mion, PLLC

20080238581 - Circuit board microwave filters: A microwave filter having a resonator comprising a cylindrical structure having conductive walls filled with a conductor material. The cylindrical structure is recessed inside a multi-layered substrate. First and second conductive coupling arms are disposed on the top layer of the substrate for coupling signals to the cylindrical structure. The... Agent: Joseph Sofer Sofer & Haroun, L.L.P.

20080238584 - Reducing crosstalk in electronic devices having microstrip lines: An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes integrated circuits. By compressing said backing plate against... Agent: Trop Pruner & Hu, PC

20080238585 - Substrate including wiring for transmitting signal, apparatus and system including the substrate: An apparatus includes a substrate which includes an electronic component mounted on the substrate, the electronic component for processing a pair of signals, the substrate including a first wire for transmitting one of the signals, the first wire being formed on a first layer of the substrate, and a second... Agent: Mcginn Intellectual Property Law Group, PLLC

20080238586 - Controlled impedance radial butt-mount coaxial connection through a substrate to a quasi-coaxial transmission line: A solution to the problem of creating a controlled impedance coaxial connection to a quasi-coaxial transmission line at a location interior to a substrate and not along an edge is to radially butt-mount the connector to via-like structure on the backside of the substrate. By butt-mounting we mean that the... Agent: Agilent Technologies Inc.

Previous industry: Modulators
Next industry: Tuners


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