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Water-cooling heat-dissipating system

Water-cooling heat-dissipating system description/claims

1. Field of the Invention

The present invention relates to a heat-dissipating system, and in particular to a water-cooling heat-dissipating system in which a working fluid is used as a heat-conducting medium.

2. Description of Prior Art

Since the required power of electronic elements and semiconductors contained therein becomes larger and larger, the electricity consumption of the associated system increases substantially. As a result, the amount of heat generated by the electricity-controlled elements also increases to a great extent. In order to reduce the excessively high temperature of the electronic element and keep the working temperature thereof stable, therefore, it is an important issue for modern technology to develop an excellent heat-dissipating solution.

As far as now is concerned, in addition to the heat-dissipating fan that is used most commonly, another common heat-dissipating solution is a water-cooling heat-dissipating system. Conventional water-cooling heat-dissipating system includes some primary components such as a water block, a pump, a water tank and a water cooler. The primary components are in fluid communication with one another via conduits, thereby allowing a working fluid to flow in each component. The water block is attached to a heat-generating element directly to absorb the heat generated by the heat-generating element. After the water block performs a heat-exchanging action with the working fluid flowing therein, the heat generated by the heat-generating element can be taken away. Finally, after the working fluid flows to the water cooler and performs a heat-exchanging action with the water cooler, the heat can be dissipated to the outside to keep the heat-generating element within a normal range of working temperature. The pump is used to generate a force to push the working fluid to flow in each component. The water tank is used to store additional working fluid.

However, since the functions of modern electronic products are more and more powerful, it is necessary to require various electronic elements, which inevitably occupies the accommodating space within the electronic product and also affects the arrangement of the water-cooling heat-dissipating system directly. Although each of the primary components of the water-cooling heat-dissipating system starts to reduce its volume to correspond to the limited arrangement space so as to optimize the integrity and utilization of space, the conventional pump structure uses a turbine to increase the pressure so as to generate a thrust. The turbine assembly has a certain structure and volume. Therefore, it is difficult to further compress the whole volume of the pump; however, the water-cooling heat-dissipating system still occupies a certain space. As a result, it is difficult to apply the water-cooling heat-dissipating system to a further thinner electronic product, which becomes a drawback of the water-cooling heat-dissipating system.

In view of the above drawback, the present invention is to provide a water-cooling heat-dissipating system having a thin pump. By providing a membrane pump which uses an activating element as a power source, the volume of the membrane pump is compressed substantially and thus the space occupied by the water-cooling heat-dissipating system is reduced. Not only the utilization of the space can be improved, but also the water-cooling heat-dissipating system can be applied to more electronic products having a thinner structure.

The present invention provides a water-cooling heat-dissipating system, which includes a water block and a heat exchanger. The above-mentioned components are in fluid communication with one another via a plurality of conduits. The water block is attached on a heat-generating element to absorb the heat generated by the heat-generating element. The top surface of the water block is provided with a membrane. The membrane is provided thereon with an activating element, so that the membrane swings up and down at one side thereof to guide the flow of the working fluid. The heat exchanger performs a heat-conducting action with the flowing working fluid, thereby dissipating the heat absorbed by the working fluid to the outside. In this way, the heat-generating element can be kept in a normal range of working temperature.

FIG. 1 is a perspective view showing the structure of the present invention;

FIG. 2 is an exploded perspective view showing the structure of a membrane pump of the present invention;

FIG. 3 is a top view of a second embodiment of the present invention;

FIG. 4 is a top view of a third embodiment of the present invention;

FIG. 5 is a top view of a fourth embodiment of the present invention;

FIG. 6 is a top view of showing the structure of a fifth embodiment of the present invention;

FIG. 7 is an exploded view showing the membrane pump of the fifth embodiment of the present invention;

FIG. 8 is a top view of showing the structure of a sixth embodiment of the present invention;

FIG. 9 is a top view of showing the structure of a seventh embodiment of the present invention; and

• Provisional Patent
• Utility Patent

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