All USA states > New York > Chappaqua patent applications
Chappaqua, New York , USAPatent applications with an agent or inventor associated with Chappaqua, New York , USA.
20070187772 - Ald of amorphous lanthanide doped tiox films
20070187831 - Conductive layers for hafnium silicon oxynitride films
20070192540 - Architectural support for thread level speculative execution
20070192545 - Low complexity speculative multithreading system based on unmodified microprocessor core
20070192762 - Method to analyze and reduce number of data reordering operations in simd code
20070181931 - Hafnium tantalum oxide dielectrics
20070185746 - Intelligent event adaptation mechanism for business performance monitoring
20070185960 - Method and system for recognizing spam email
20070186077 - System and method for executing instructions utilizing a preferred slot alignment mechanism
20070177367 - Thermal interface apparatus
20070178635 - Atomic layer deposition of metal oxide and/or low asymmetrical tunnel barrier interpoly insulators
20070178643 - Memory utilizing oxide-conductor nanolaminates
20070170492 - Germanium-silicon-carbide floating gates in memories
20070173008 - Introduction of metal impurity to change workfunction of conductive electrodes
20070174367 - Selective file erasure using metadata modifications
20070174763 - System and method for developing and enabling model-driven xml transformation framework for e-business
20070174825 - Apparatus and method for optimizing scalar code executed on a simd engine by alignment of simd slots
20070164021 - Connectable segmented container
20070164323 - Cmos gates with intermetallic compound tunable work functions
20070164359 - Area-efficient gated diode structure and method of forming same
20070164367 - Cmos gates with solid-solution alloy tunable work functions
20070166994 - Prevention and control of intermetallic alloy inclusions that form during reflow of pb free, sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless ni(p) metallization is present
20070167005 - Selective electroless-plated copper metallization
20070169058 - Method and system for versioning codes based on relative alignment for single instruction multiple data units
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The listing of Patent Applications for Chappaqua, New York , USA is of recent patent applications only. Freshpatents.com tracks patent applications. The applications are submitted to the USPTO for approval, published and eventually approved or denied. This process is completed in anywhere between 1-3 years time by the USPTO, a US goverment agency not affiliated with Freshpatents.com. Notifiy us with any corrections or comments about Chappaqua, New York , USA patents or the website in general.
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