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  Twin fin arrayed cooling device with liquid chamberUSPTO Application #: 20060086484Title: Twin fin arrayed cooling device with liquid chamber Abstract: A cooling device for dissipating heat from a component is disclosed. The cooling device includes a core with a plurality of twin fins connected with the core and a liquid chamber in thermal communication with the component. The liquid chamber includes a reservoir with a liquid therein and the core includes a cavity with a liquid therein. A heat pipe is connected with the liquid chamber and with the core and the heat pipe is in contact with the liquid in the reservoir and the liquid in the cavity so that waste heat in the liquid chamber is thermally communicated to the core and is dissipated by an air flow over the twin fins and the core. (end of abstract) Agent: Hewlett Packard Company - Fort Collins, CO, US Inventor: Shankar Hegde USPTO Applicaton #: 20060086484 - Class: 165104330 (USPTO) Related Patent Categories: Heat Exchange, Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat, Liquid Fluent Heat Exchange Material, Cooling Electrical Device The Patent Description & Claims data below is from USPTO Patent Application 20060086484. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001] The present invention relates generally to a cooling device for dissipating heat from a component in thermal communication with the cooling device. More specifically, the present invention relates to a cooling device including a core with a plurality of twin fins connected with the core and a liquid chamber in thermal communication with the component. Waste heat from the component is thermally communicated from the liquid chamber to the core by a heat pipe connected with the liquid chamber and the core. The heat pipe is in contact with a liquid in a reservoir of the liquid chamber and in contact with a liquid in a cavity in the core. BACKGROUND OF THE INVENTION [0002] It is well known in the electronics art to place a heat sink in contact with an electronic device so that waste heat generated by operation of the electronic device is thermally transferred to the heat sink to cool the electronic device. However, with continued increases in areal densities and system clock speeds in electronic devices such as microprocessors (CPU's), digital signal processors (DSP's), and application specific integrated circuits (ASIC), the amount of waste heat generated by those electronic devices and the operating temperature of those electronic devices are directly proportional to clock speed and device geometries. Efficient operation of a CPU as well as other high power dissipation electronic devices requires that waste heat be continuously and effectively removed. [0003] However, as the aforementioned areal densities and system clock speeds of electronic devices continue to increase, a heat flux of the electronic devices also increases. Although air cooled heat sinks are commonly used to dissipate waste heat from the aforementioned electronic devices, the increased heat flux in high performance electronic devices is often concentrated in a small area, usually on a package surface that will be placed in thermal contact with the heat sink. The ability to effectively dissipate ever increasing levels of heat flux in high performance electronic devices has challenged current heat sink designs where the entire heat sink is fabricated using processes such as machining, forging, casting, and extrusion. Those processes make it difficult to increase the number of fins or an area of the fins in order to effectively dissipate heat flux concentration. [0004] Typically, a heat mass includes a mounting surface that is in thermal communication with the electronic device and is operative to thermally conduct the waste heat away from the device and into the heat mass. As a result, the heat flux from the electronic device is concentrated in the area of the heat mass near the mounting surface. Ideally, it is desirable to spread the heat flux in the heat mass over as much of a volume of the heat mass as possible so that the heat is efficiently transferred to the fins and dissipated by the air flow over the fins. [0005] Heat flux is a thermal output per unit of area (i.e. W/cm.sup.2). For example, if a total thermal output is 100 Watts over a heat source having dimensions of 3.5 cm*3.5 cm, then the heat flux is 100 W/(3.5 cm*3.5 cm)=8.163 W/cm.sup.2. At present, based on area and cost constraints, electronic device package size remains the same or decreases while the areal densities and clock speeds continue to increase. Consequently, the problems associated with heat flux concentration continue to increase and those problems cannot be solved solely by increasing heat sink size, the number of fins, or fan capacity. [0006] Heat flux concentration can be exacerbated by conditions that reduce an efficiency of heat transfer to/from the heat mass. In instances where a liquid is used to transfer waste heat to the heat mass, a tilting of the heat mass from an optimal position (e.g. a horizontal orientation) can result in the liquid being displaced with a resulting reduction in thermal transfer from the liquid to the heat mass. In some prior heat sink designs, a heat pipe in contact with the liquid is used to transfer the waste heat from the liquid to the heat mass. However, the displacement of the liquid caused by the titling can result in a reduced contact or no contact at all between the heat pipe and the liquid. Consequently, heat transfer to the heat mass is reduced when the heat sink has a non-optimal orientation. [0007] Typically, waste heat from the heat mass is dissipated by an air flow through fins that are connected with the heat mass. However, in many prior heat sink designs, a bottom portion of the fins are placed in close proximity to a base plate that is used to mount the heat mass (e.g. mounting surface) in thermal communication with the electronic device to be cooled. The air flow passes through the fins and is obstructed by the base plate resulting in reduced air flow, turbulent air flow, back pressure, and air shock noise. Ideally, the air flow through the fins should be smooth and unobstructed so that the heat transfer from the fins and the heat mass to the air flow is optimal. Moreover, when a system fan is used to supply the air flow to two or more heat sinks, the base plate or some other structure that obstructs the air flow can significantly reduce heat transfer from the heat mass and fins to the air flow. [0008] Furthermore, many prior heat sink designs resort to a configuration where the heat sink is mounted to an electronic device carried by a PC board or mother board with a resulting horizontal placement of the heat sink that matches a horizontal mounting of the electronic device on the PC board. However, this horizontal placement does not always allow for the aforementioned optimal air flow. Therefore, flexibility in a placement of the heat sink and its fins relative to the air flow is lacking in prior heat sink designs. [0009] Consequently, there is a need for a cooling device with improved thermal conductivity that reduces heat flux concentration. There is also a need for a cooling device that efficiently transfers waste heat from a liquid when the cooling device has a non-optimal orientation. Finally, there exists a need for a cooling device that allows for flexibility in positioning the cooling device to obtain an unobstructed air flow through fins of the cooling device. SUMMARY OF THE INVENTION [0010] The cooling device of the present invention solves the aforementioned problems of heat flux concentration, non-optimal orientation, and obstructed air flow. The cooling device includes a heat pipe including a first end and a second end, a plurality of twin fins with each twin fin including a root and a pair of vanes extending outward of the root, the vanes are spaced apart to define a slot between the vanes, and each vane includes a leading edge, a trailing edge, and an outer edge. A core includes a plurality of grooves that are adapted to receive the roots of the twin fins. The core also includes a top face, a cavity, a liquid disposed in the cavity, and a plate that is connected with the core. The plate includes an aperture and the heat pipe is connected with the aperture with the first end of the heat pipe positioned in the cavity and in contact with the liquid in the cavity. The cooling device also includes a liquid chamber including a reservoir, a liquid disposed in the reservoir, an aperture, and a base including a mounting surface for thermally connecting the liquid chamber with the component. The heat pipe is connected with the aperture in the liquid chamber and the second end of the heat pipe is positioned in the reservoir and in contact with the liquid in the reservoir. [0011] The aforementioned problems associated with heat flux concentration are addressed by the liquid chamber, the heat pipes, and the core because waste heat thermally conducted into the liquid in the reservoir via the mounting surface is thermally transferred to the liquid in the core via the heat pipe where an air flow through the vanes dissipates the waste heat from the core. The vanes of the twin fins provide a large surface area for the heat in the core to be dissipated by the air flow over vanes. Moreover, there is flexibility in positioning the leading and trailing edges of the vanes so that the air flow can pass through the slots of the vanes unobstructed by any structures, such as the base, for example. Consequently, the problems associated with obstructed air flow are addressed by the cooling device. Another advantage to the flexibility in positioning the twin fins relative to the air flow is that a system fan or the like can be used to supply the air flow. [0012] Additionally, the first and second ends of the heat pipes are immersed in their respective liquids so that the cooling device can be positioned in a non-optimal orientation (e.g. a non-horizontal orientation) and the liquids still cover the ends of the heat pipes to ensure heat transfer from the liquid chamber to the core. Therefore, the problems associated with reduced heat transfer caused by a non-optimal orientation are addressed by the cooling device. [0013] Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIGS. 1a and 1b are profile views depicting a cooling device. [0015] FIG. 1c is a side profile view depicting a cooling device. [0016] FIG. 1d is a cross-sectional view of a cooling device along a line I-I of FIG. 1c. [0017] FIG. 1e is a rear profile view depicting a cooling device. [0018] FIGS. 2a and 2b are profile views depicting a plurality of twin fins connected with a core. [0019] FIG. 2c is a bottom profile view depicting a plurality of twin fins connected with a core. [0020] FIG. 3 is an enlarged top profile view depicting a plurality of twin fins connected with a plurality of grooves on a core. Continue reading... Full patent description for Twin fin arrayed cooling device with liquid chamber Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Twin fin arrayed cooling device with liquid chamber patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Twin fin arrayed cooling device with liquid chamber or other areas of interest. ### Previous Patent Application: Heat pipe with axial and lateral flexibility Next Patent Application: Temperature control of heat-generating devices Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Twin fin arrayed cooling device with liquid chamber patent info. 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