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Toshihiko Hayashi patents

Recent patents with Toshihiko Hayashi listed as an inventor - additional entries may be under other spellings.


Toshihiko Hayashi - Related organizations: Sony Corporation patents

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

02/23/17 - 20170053961 - Disclosed herein is a solid-state imaging device including: a laminated semiconductor chip configured to be obtained by bonding two or more semiconductor chip sections to each other and be obtained by bonding at least a first semiconductor chip section in which a pixel array and a multilayer wiring layer are
Inventors: Toshihiko Hayashi

Semiconductor device and method of manufacturing thereof

02/23/17 - 20170053960 - There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite
Inventors: Satoru Wakiyama, Naoki Jyo, Kan Shimizu, Toshihiko Hayashi, Takuya Nakamura

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

01/21/16 - 20160020240 - Disclosed herein is a solid-state imaging device including: a laminated semiconductor chip configured to be obtained by bonding two or more semiconductor chip sections to each other and be obtained by bonding at least a first semiconductor chip section in which a pixel array and a multilayer wiring layer are
Inventors: Toshihiko Hayashi

Solid-state imaging device and method for manufacturing the same

09/24/15 - 20150270305 - A solid-state imaging device includes: a light-receiving pixel part configured to be formed on a semiconductor substrate; a black-level reference pixel part configured to be formed on the semiconductor substrate; and a multilayer interconnect part configured to be provided over the semiconductor substrate. The multilayer interconnect part includes an insulating
Inventors: Toshihiko Hayashi, Yoshiharu Kudoh

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

05/29/14 - 20140145288 - Disclosed herein is a solid-state imaging device including: a laminated semiconductor chip configured to be obtained by bonding two or more semiconductor chip sections to each other and be obtained by bonding at least a first semiconductor chip section in which a pixel array and a multilayer wiring layer are
Inventors: Toshihiko Hayashi

Solid-state imaging device and method for manufacturing the same

01/30/14 - 20140027874 - A solid-state imaging device includes: a light-receiving pixel part configured to be formed on a semiconductor substrate; a black-level reference pixel part configured to be formed on the semiconductor substrate; and a multilayer interconnect part configured to be provided over the semiconductor substrate. The multilayer interconnect part includes an insulating
Inventors: Toshihiko Hayashi, Yoshiharu Kudoh

Solid-state imaging device, manufacturing method thereof, and electronic device

08/15/13 - 20130207215 - A solid-state imaging device has: an imaging region in which a plurality of pixels each having a photoelectric conversion element are arranged, and a color filter. The color filter includes: filter components of a first color (2G), filter components of a second color (2R) formed by self-alignment and each being
Inventors: Yoichi Otsuka, Yoshiyuki Enomoto, Kazunori Nagahata, Tadayuki Kimura, Toshihiko Hayashi, Kenichi Aoyagi, Kiyotaka Tabuchi, Iwao Sugiura, Kensaku Maeda

Semiconductor apparatus, semiconductor-apparatus manufacturing method and electronic equipment

05/30/13 - 20130134576 - A method for manufacturing the semiconductor apparatus includes an anchor process of forming a barrier metal film and carrying out physical etching making use of sputter gas. The anchor process is carried out at the same time on a wire connected to the lower portion of a first aperture serving
Inventors: Toshihiko Hayashi

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

08/09/12 - 20120199930 - Disclosed herein is a solid-state imaging device including: a laminated semiconductor chip configured to be obtained by bonding two or more semiconductor chip sections to each other and be obtained by bonding at least a first semiconductor chip section in which a pixel array and a multilayer wiring layer are
Inventors: Toshihiko Hayashi

Solid-state imaging device and method for producing the same

02/03/11 - 20110024858 - A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole
Inventors: Ikuo Yoshihara, Masaya Nagata, Naoto Sasaki, Taku Umebayashi, Hiroshi Takahashi, Yoichi Otsuka, Isaya Kitamura, Tokihisa Kaneguchi, Keishi Inoue, Toshihiko Hayashi, Hiroyasu Matsugai, Masayoshi Aonuma, Hiroshi Yoshioka

Solid-state imaging device, manufacturing method thereof, and electronic device

12/10/09 - 20090303359 - A solid-state imaging device has: an imaging region in which a plurality of pixels each having a photoelectric conversion element are arranged, and a color filter. The color filter includes: filter components of a first color (2G), filter components of a second color (2R) formed by self-alignment and each being
Inventors: Yoichi Otsuka, Yoshiyuki Enomoto, Kazunori Nagahata, Tadayuki Kimura, Toshihiko Hayashi, Kenichi Aoyagi, Kiyotaka Tabuchi, Iwao Sugiura, Kensaku Maeda

Solid-state imaging device and method for manufacturing the same

07/30/09 - 20090189236 - A solid-state imaging device includes: a light-receiving pixel part configured to be formed on a semiconductor substrate; a black-level reference pixel part configured to be formed on the semiconductor substrate; and a multilayer interconnect part configured to be provided over the semiconductor substrate. The multilayer interconnect part includes an insulating
Inventors: Toshihiko Hayashi, Yoshiharu Kudoh

Solid-state image pickup device and fabrication method therefor

07/23/09 - 20090184386 - Disclosed herein is a solid-state image pickup device, including, a light receiving pixel section, a black level reference pixel section, a multi-layer wiring line section, a first light blocking film, a second light blocking film, a third light blocking film, and a fourth light blocking layer.
Inventors: Yusaku Kobayashi, Koji Watanabe, Toshihiko Hayashi


### Toshihiko Hayashi patent invention listings

The bibliographic references displayed about Toshihiko Hayashi's patents are for a recent sample of Toshihiko Hayashi's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Toshihiko Hayashi filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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