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  Three-dimensional package and method of making the sameUSPTO Application #: 20070172983Title: Three-dimensional package and method of making the same Abstract: The present invention relates to a three-dimensional package and a method of making the same. The three-dimensional package comprises a first wafer, at least one first hole, a first isolation layer, a first conductive layer, a first solder, a second wafer, at least one second hole, a second isolation layer, a second conductive layer, and a second solder. The first wafer has at least one first pad and a first protection layer exposing the first pad. The first hole penetrates the first wafer. The first isolation layer is disposed on the side wall of the first hole. The lower end of the first conductive layer extends below the surface of the first wafer. The first solder is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. The second wafer has at least one second pad and a second protection layer exposing the second pad. The second hole penetrates the second wafer. The second isolation layer is disposed on the side wall of the second hole. The lower end of the second conductive layer extends to below the surface of the second wafer and contacts the upper end of the first solder. The second solder is disposed in the second hole and is electrically connected to the second pad via the second conductive layer. (end of abstract) USPTO Applicaton #: 20070172983 - Class: 438109 (USPTO)
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