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11/27/08 - USPTO Class 340 |  58 views | #20080291027 | Prev - Next | About this Page  340 rss/xml feed  monitor keywords

Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit

USPTO Application #: 20080291027
Title: Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit
Abstract: A curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate. In another aspect, the invention includes a method of conductively interconnecting electronic components using a curable adhesive composition which comprises an epoxy terminated silane. The invention in another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.3 ohm-cm2. In another aspect, a battery powerable apparatus includes a conductive adhesive mass comprising an epoxy terminated silane between a battery and substrate. A radio frequency communication device is one example. In another aspect, the invention includes an electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass comprising an epoxy terminated silane. (end of abstract)



USPTO Applicaton #: 20080291027 - Class: 3405727 (USPTO)

Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20080291027, Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit.

Brief Patent Description - Full Patent Description - Patent Application Claims
  monitor keywords TECHNICAL FIELD

This invention relates to thin profile battery bonding methods, to methods of conductively interconnecting electronic components, to battery powerable apparatus, to radio frequency communication devices, and to electric circuits.

BACKGROUND OF THE INVENTION

Thin profile batteries comprise batteries that have thickness dimensions which are less than a maximum linear dimension of its anode or cathode. One type of thin profile battery is a button type battery. Such batteries, because of their compact size, permit electronic devices to be built which are very small or compact.

One mechanism by which thin profile batteries are electrically connected with other circuits or components is with electrically conductive adhesive, such as epoxy. Yet in some applications, a suitably conductive bond or interconnection is not created in spite of the highly conductive nature of the conductive epoxy, the outer battery surface, and the substrate surface to which the battery is being connected. This invention arose out of concerns associated with providing improved conductive adhesive interconnections between thin profile batteries and conductive nodes formed on substrate surfaces. The invention has other applicability as will be appreciated by the artisan. with the invention only being limited by the accompanying claims appropriately interpreted in accordance with the Doctrine of Equivalents.

SUMMARY OF THE INVENTION

The invention in one aspect includes a thin profile battery bonding method. In one implementation, a curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided, The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate.

The invention in another aspect includes a method of conductively interconnecting electronic components. In one implementation, a curable adhesive composition comprising an epoxy terminated silane is provided. First and second electronic components to be conductively connected with one another are provided. The curable adhesive composition is interposed between the first and second electronic components. The adhesive is cured into an electrically conductive bond electrically interconnecting the first and second components.

The invention in still another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a contact resistance through said metal surface of less than or equal to about 0.3 ohm-cm2.

The invention in a further aspect includes a battery powerable apparatus. In one implementation, such includes a substrate having a surface comprising at least one node location. A thin profile battery is mounted over the substrate and node location. A conductive adhesive mass electrically interconnects the thin profile battery with the node location, with the conductive adhesive mass comprising an epoxy terminated silane.

The invention in still a further aspect includes a radio frequency communication device. In one implementation, such includes a substrate having conductive paths including an antenna. At least one integrated circuit chip is mounted to the substrate and in electrical connection with a first portion of the substrate conductive paths. A thin profile battery is conductively bonded with a second portion of the substrate conductive paths by a conductive adhesive mass, with the conductive adhesive mass comprising an epoxy terminated silane.

The invention in still another aspect includes an electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass comprising an epoxy terminated silane.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below with reference to the following accompanying drawings.

FIG. 1 is a side elevational, partial cross sectional, view of a thin profile battery.

FIG. 2 is a side elevational view of a substrate.

FIG. 3 is a side elevational view of a battery powerable apparatus.

FIG. 4 is a diagrammatic plan view of a radio frequency communication device.



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Full patent description for Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit

Brief Patent Description - Full Patent Description - Patent Application Claims

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