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06/28/07 | 22 views | #20070148821 | Prev - Next | USPTO Class 438 | About this Page  438 rss/xml feed  monitor keywords

Thermally enhanced stacked die package and fabrication method

USPTO Application #: 20070148821
Title: Thermally enhanced stacked die package and fabrication method
Abstract: A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die is electrically connected to the substrate, and the first die, the heat sink, and the second die are encapsulated. (end of abstract)
USPTO Applicaton #: 20070148821 - Class: 438109000 (USPTO)
Related Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Assembly Of Plural Semiconductive Substrates Each Possessing Electrical Device, Stacked Array (e.g., Rectifier, Etc.)

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Microelectronic devices and methods for manufacturing microelectronic devices
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Microelectronic packages and methods therefor
Industry Class:
Semiconductor device manufacturing: process

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