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Tape compositions for the deposition of electronic featuresRelated Patent Categories: Coating Processes, Solid Particles Or Fibers AppliedTape compositions for the deposition of electronic features description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070178232, Tape compositions for the deposition of electronic features. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation of co-pending U.S. patent application Ser. No. 10/274,495 filed Oct. 18, 2002, which claims the benefit of U.S. Provisional Application No. 60/348,223 filed Oct. 19, 2001. Each of the foregoing referenced patent applications is incorporated by reference herein as if set forth in its entirety. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to precursor compositions in the form of a tape that are useful for the deposition of electronic features such as conductors, resistors and dielectrics by transferring the tape to a substrate. The tape materials can also have a low conversion temperature to enable low-temperature treatment of the tape to form electronic features on a variety of substrates. The tape compositions can also be disposed on a carrier to form a mechanically robust ribbon structure. [0004] 2. Description of Related Art [0005] The electronics, display and energy industries rely on the formation of coatings and patterns of various materials such as conductors, dielectrics and resistors, to form circuits on organic and inorganic substrates. The primary methods for generating these patterns are screen printing for features larger than about 100 .mu.m and thin film and etching methods for features smaller than about 100 lm. Other subtractive methods to attain fine feature sizes include photopatternable pastes and laser trimming. [0006] Another method that is known in the art is the transfer of material from one surface (a carrier) to another surface (a substrate) by some force, such as mechanical force. [0007] For example, U.S. Pat. Nos. 6,177,151 by Chrisey et al. and 6,025,026 by Smith et al. disclose the use of laser transfer from a tape to fabricate a variety of electronic end products. The tape includes a composition that increases in volatility during transfer. [0008] U.S. Pat. No. 5,645,932 by Uchibori discloses the use of a tape with an adhesive to attach conducting layers with stamping for patterning. A method to overcome the need for etching to provide layers is also disclosed. [0009] U.S. Pat. No. 5,494,550 by Benge discloses a web driven approach for handling of tape. U.S. Pat. No. 5,211,984 by Wilson discloses decals and decal transfer methods for fuel cell component assembly. The decals are formed on a surface with a release layer and then laminated to another surface and separated from the backing. U.S. Pat. No. 4,826,554 by McIntyre et al. discloses methods for laminating to make fuel cell layers. U.S. Pat. No. 4,383,010 by Spaepen discloses rolling methods to make coatings for fuel cells and the like. [0010] U.S. Pat. No. 6,207,268 by Kosaka et al. discloses a transfer sheet including a thermoplastic resin, a protective cover and a release layer. A resist is used to obtain patterns. The use of laser transfer and thermal heads is also disclosed. [0011] U.S. Pat. No. 6,214,520 by Wolk et al. discloses thermal transfer and laser transfer for electroluminescent (EL) lamp manufacture. Light is used to heat a conversion layer to accomplish transfer. Conductor compositions disclosed include ATO, ITO, carbon and graphite. [0012] U.S. Pat. No. 5,932,280 by Roth discloses thermally active coatings on ribbon. Transfer to a printed circuit board is accomplished by thermal processing. The use of precursors in the coating is not disclosed. [0013] U.S. Pat. No. 5,826,329 by Roth discloses polymer thick film conductors formed from tape. U.S. Pat. No. 5,909,083 by Asano et al. discloses patterning tapes by etching through masks, particularly for glasses in plasma display applications. U.S. Pat. No. 5,992,320 by Kosaka et al. discloses transfer sheets and the details of their construction. U.S. Pat. No. 5,712,673 by Hayashi et al. discloses color transfer sheets. U.S. Pat. No. 4,105,483 by Lin discloses the transfer of material from printed paper. A solvent is applied, pressure is applied, and material is dissolved and removed to achieve transfer. [0014] U.S. Pat. No. 5,665,472 by Tanaka et al. discloses the use of Bi--B--Si--O glass tapes and hot melt tape transfer to form patterns for plasma displays. [0015] U.S. Pat. No. 5,998,085 by Isberg et al. discloses organic electroluminescent lamp fabrication methods. The deposition of phosphors by laser transfer is disclosed. Optional interlayers, thermal transfer layers and adhesive coatings are also disclosed. [0016] U.S. Pat. No. 6,074,725 by Kennedy discloses applications of tape fabrication in microfluidics. Laminates are formed comprising structures between channels. The structures can be printed by laser, screen printing, ink-jet printing, precursor chemistry, and other approaches. [0017] U.S. Pat. No. 5,953,037 by Hayashi et al. discloses tapes for color applications. [0018] There is a need for compositions that provide electronic materials at low processing temperatures to allow deposition of the materials onto organic substrates with a fine minimum feature size, such as less than 200 .mu.m, while still providing electronic features with adequate properties. [0019] Precursor compositions for electronic materials such as conductors have been described by R. W. Vest (Metallo-Organic Materials for Improved Thick Film Reliability, Nov. 1, 1980, Final Report, Contract #N00163-79-C-0352, National Avionic Center). The compositions disclosed by Vest included a precursor and a solvent for the precursor. These compositions were not designed for processing at low temperatures, and as a result the processing temperatures were relatively high, such as greater than 250.degree. C. [0020] U.S. Pat. Nos. 5,882,722 and 6,036,889 by Kydd disclose conductor precursor compositions that contain particles, a precursor and a vehicle and are capable of forming pure conductors at low temperatures on organic substrates. However, the formulations are designed for screen printing of thick film electronic components. Materials to form transferrable ribbon materials are not disclosed. [0021] Polymer thick film materials containing particles in a polymerizable organic vehicle have also been disclosed in the prior art. These compositions are processable at low temperatures, such as less than 200.degree. C., allowing deposition onto organic substrates. The compositions contain particles, usually flakes, at high loading and have a high viscosity. Ribbon and tape applications designed for transfer onto a substrate are not disclosed. [0022] Attempts have been made to produce metal-containing compositions at low temperatures by using a composition containing a polymer and a precursor to a metal. See, for example, U.S. Pat. No. 6,019,926 by Southward et al. However, the deposits were chosen for optical properties and were either not conductive or were poorly conductive. Continue reading about Tape compositions for the deposition of electronic features... Full patent description for Tape compositions for the deposition of electronic features Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Tape compositions for the deposition of electronic features patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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