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  Tape adhering method and tape adhering deviceUSPTO Application #: 20070267132Title: Tape adhering method and tape adhering device Abstract: A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape. (end of abstract) Agent: Christie, Parker & Hale, LLP - Pasadena, CA, US Inventors: Isamu Kawashima, Hideshi Sato, Hideo Kino, Minoru Ametani USPTO Applicaton #: 20070267132 - Class: 156249 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20070267132. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001]1. Field of the Invention [0002]The present invention relates to a tape adhering method for adhering a tape, for example, a dicing tape onto a back surface of a wafer. The present invention also relates to a tape adhering device of executing this tape adhering method. [0003]2. Description of the Related Art [0004]In the field of manufacturing semiconductors, there is a tendency for large-sized wafers to be used year after year. Further, in order to enhance the packing density, the wafer thickness is reduced, and in order to reduce the wafer thickness, the back surface of a semiconductor wafer is ground. At the time of back-grinding, in order to protect a semiconductor element formed on a front surface of the wafer, a surface protection film is adhered to the front surface of the wafer. [0005]When back-grinding is conducted on the wafer, the wafer is greatly reduced in thickness. Therefore, a dicing tape is adhered to the back surface of the wafer so that the wafer can be integrated with a mount frame into one body. When the wafer is integrated with the mount frame, the wafer can be easily handled in the next step. [0006]Japanese Unexamined Patent Publication No. 2006-044152 discloses a adhering device in which a tape is drawn out onto a mount frame and a wafer so as to adhere the tape. The tape drawn out from a tape roller is guided by a guide member and adhered to a neighborhood of an edge portion of the mount frame at first by an adhering roller. [0007]FIG. 6 is a top face view of a wafer in the case where adhering operation of a tape onto a mount frame is started in the prior art, such as disclosed in Japanese Unexamined Patent Publication No. 2006-044152. At the time of adhering as shown in FIG. 6, the tape 3 is adhered only to an adhering portion 3a located in the neighborhood of an edge portion of the mount frame 36. [0008]Next, a table (not shown) for supporting the mount frame 36 and the wafer 20 is moved in the horizontal direction. Due to the foregoing, the tape 3 is adhered to the entire mount frame 36 and wafer 20. [0009]However, at the beginning of adhering the tape 3 to the mount frame 36, the area of the adhering portion 3a is relatively small. Therefore, this is a case in which the tension of the tape 3 given by the tape roller exceeds the adhesive force at the adhering portion 3a. In this case, when the tension given to the tape 3 exceeds the elastic limit of the tape 3, wrinkles 99 extending in the longitudinal direction are formed on the tape outside both end portions 3b, 3c of the adhering portion 3a as shown in FIG. 6. Since these wrinkles 99 are formed on the tape 3 as a result of the tension that has exceeded the elastic limit of the tape 3, when the wrinkles 99 are formed, it is impossible to remove the wrinkles even after the tension given by the tape roller has been released. [0010]In this connection, FIG. 7 is a view showing a state of a common tape roller. A draw-out position of the dicing tape 3, which is drawn out right after the tape roller 142 has been loaded into an adhering device, is located relatively outside in the radial direction. When the adhering operation of the dicing tape 3 progresses and the amount of the dicing tape 3 remaining on the tape roller 142 is reduced, the draw-out position of the dicing tape 3 is gradually moved inside in the radial direction. Concerning this matter, refer to the imaginary line 3' in FIG. 7. In the case where the draw-out position of the dicing tape 3 is located relatively outside, in order to prevent the tape roller 142 from over-running, it is necessary to arrange a braking mechanism (not shown) adjacent to the tape roller 142. [0011]Due to the foregoing, right after the tape roller 142 has been loaded and right before the tape roller 142 is replaced, the intensity of the drive torque needed for rotating the tape roller 142 is different. The intensity of the drive torque right after the tape roller 142 has been loaded is considerably higher than the intensity of the drive torque right before the tape roller 142 is replaced. Therefore, the intensity of the tension given to the tape by the tape roller right after the tape roller 142 has been loaded is considerably high. As a result, right after the tape roller 142 has been loaded, wrinkles 99 described previously tend to form on the tape 3. Further, when the tension greatly exceeds the adhesive force at the adhering portion 3a, the tape 3, which has been adhered to the adhering portion 3a, may be detached from the mount frame 36. [0012]The present invention has been accomplished in view of the above circumstances. It is an object of the present invention to provide a tape adhering method capable of preventing the formation of wrinkles. It is another object of the present invention to provide a tape adhering device in which this tape adhering method is executed. SUMMARY OF THE INVENTION [0013]In order to accomplish the above object, the first aspect provides a tape adhering device comprising: a tape roller for drawing out a tape; a braking means for braking one portion of a traveling tape drawn out from the tape roller; a tape drawing means for drawing out a predetermined amount of tape, which has been braked by the braking means, from the tape roller between the braking means and the tape roller; and a tape adhering means for adhering the tape, which is located downstream of the braking means, onto an object to be adhered if the braking of the tape by the braking means is loosened or released. [0014]In the first aspect, the tape, for example, the dicing tape can be previously drawn out by a length corresponding to the object to be adhered. Therefore, when the tape is actually adhered, it is not necessary to rotate the table roller. That is, at the time of adhering the tape, no tension can be generated by the tape roller. Therefore, it is possible to prevent wrinkles from being formed on the tape. In this connection, the object to be adhered may be either the wafer or both the wafer and mount frame. [0015]According to the second aspect, as in the first aspect, the tape adhering means includes an adhering roller for pressing and adhering the tape to an edge portion of the object to be adhered, and also includes a support table capable of moving in the horizontal direction, for supporting the object to be adhered. [0016]That is, in the second embodiment, after the tape has adhered to an edge portion of the object to be adhered, the support table is moved in the horizontal direction. In this way, the tape can be adhered to the entire object. [0017]According to the third aspect, as in the second aspect, the support table is raised when the tape is adhered to the object. [0018]That is, according to the third aspect, an amount of movement of the adhering roller for pressing the tape to the object to be adhered is made to be relatively small. Due to the foregoing, the tape can be prevented from being oscillated at the time of adhering. [0019]According to the fourth aspect, as in one of the first to the third aspect, the tape drawing means is a dancer roller. [0020]That is, according to the fourth aspect, a predetermined amount of the tape can be further drawn out by a relatively simple structure. [0021]According to the fifth aspect, as in one of the first to the fourth aspect, the length of the tape drawn out by the tape drawing means between the braking means and the tape adhering means is not less than a diameter of the object to be adhered. [0022]That is, according to the fifth aspect, it is possible to ensure the amount of tape necessary for being adhered to the entire object to be adhered. Continue reading... Full patent description for Tape adhering method and tape adhering device Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Tape adhering method and tape adhering device patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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