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System and method for increasing the bond strength between a structural material and its reinforcementRelated Patent Categories: Stock Material Or Miscellaneous Articles, Composite (nonstructural Laminate), Of Inorganic Material, Metal-compound-containing Layer, Next To Second Metal-compound-containing Layer, O-containingSystem and method for increasing the bond strength between a structural material and its reinforcement description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070264527, System and method for increasing the bond strength between a structural material and its reinforcement. Brief Patent Description - Full Patent Description - Patent Application Claims Continue reading about System and method for increasing the bond strength between a structural material and its reinforcement... Full patent description for System and method for increasing the bond strength between a structural material and its reinforcement Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this System and method for increasing the bond strength between a structural material and its reinforcement patent application. ### 1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like System and method for increasing the bond strength between a structural material and its reinforcement or other areas of interest. ### Previous Patent Application: Modeling compound and articles created using same Next Patent Application: Ceramic laminate Industry Class: Stock material or miscellaneous articles ### FreshPatents.com Support Thank you for viewing the System and method for increasing the bond strength between a structural material and its reinforcement patent info. IP-related news and info Results in 0.34218 seconds Other interesting Feshpatents.com categories: Qualcomm , Schering-Plough , Schlumberger , Seagate , Siemens , Texas Instruments , 174 |
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