| System and method for electroplating flexible substrates -> Monitor Keywords |
|
|
  System and method for electroplating flexible substratesUSPTO Application #: 20070114125Title: System and method for electroplating flexible substrates Abstract: A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded, unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unloading station having an output spool adapted to receive the processed flexible substrate; and a substrate stability subsystem adapted to maintain the flexible substrate in a substantially vertical orientation while the substrate undergoes the one or more processes performed by the processing station. The substrate stability subsystem includes movable upper clips adapted to engage with upper portions of the flexible substrate, and a plurality of lower clips adapted to engage with lower portions of the flexible substrate as it is being transported into and out of the processing station. Also disclosed is a unique shield for the cathode clips to improve the uniformity of the deposition formed on the flexible substrate, and a unique seal to allow the transportation of the lower clips into and out of the electroplating cell while reducing leakage of fluid from the cell. (end of abstract) Agent: Orion Law Group - Santa Ana, CA, US Inventors: Dale Edward Jackson, Kam Sourivongs, John Scott Harris, Boyd Nelson USPTO Applicaton #: 20070114125 - Class: 204198000 (USPTO) Related Patent Categories: Chemistry: Electrical And Wave Energy, Apparatus, Electrolytic, Object Protection, Work Conveyer The Patent Description & Claims data below is from USPTO Patent Application 20070114125. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001] This invention relates generally to electroplating systems, and in particular, to a system and method for electroplating flexible substrates. BACKGROUND OF THE INVENTION [0002] The electroplating of a flexible substrate typically involves a two step process. First, an electrically-conductive seed layer is formed on the flexible substrate. Typically, this is accomplished by subjecting the substrate to a vacuum sputtering process to form a thin layer of metallization on the substrate (typically referred to as a "seed layer"). For example, a copper seed layer having a thickness between 500 and 2000 Angstroms may be formed on a polyimide or polyethylene substrate. The seed layer serves as an electrically-conductive layer on which further deposition may be formed by a subsequent electroplating process. [0003] Second, the flexible substrate having the seed layer thereon is subjected to an electroplating process to increase the thickness of the metallization layer to a desired level. In some systems, the flexible substrate is fed into an electroplating apparatus in a vertical orientation. Near a loading station, electrically-conductive clips make contact to upper portions of the flexible substrate in order to provide a cathode potential to the substrate. The flexible substrate is transported horizontally from the loading station, through one or more pre-treatment cells, one or more electroplating cells, and one or more post-treatment cells, to an unloading station. This process and equipment are further explained with reference to the following example. [0004] FIG. 1A illustrates a top view of a conventional electroplating system 100 for electroplating flexible substrates. The electroplating system 100 includes a loading station 102, a pre-treatment cell 104, an electroplating cell 106, a post-treatment cell 108, and an unloading station 110. The electroplating system 100 further includes a substrate transportation subsystem 120 including an input spool 122 oriented to have a vertical rotational axis, an output spool 124 also oriented to have a vertical rotational axis, and a drive motor (not shown) to cause the rotation of the input and output spools such that the flexible substrate S is transported laterally from the input spool 122 to the output spool 124 by way of the pre-treatment cell 104, electroplating cell 106, and post-treatment cell 108. [0005] The conventional electroplating system 100 further includes a cathode contact system 140 comprising an idle wheel 142 oriented to have a vertical rotational axis, a drive wheel 144 also oriented to have a vertical rotational axis, and an electrically-conductive belt 146 situated around and adapted to rotate in the counter-clockwise direction with the idle and drive wheels 142 and 144. The drive motor that drives the substrate transportation system 120 may also serve to drive the cathode contact system such that the movement of both are in synchronization. The belt 146 supports a plurality of equally spaced-apart, electrically-conductive clips 148 adapted to make cathode contact to upper portions of the flexible substrate S while it travels from the loading station 102 to the unloading station 110. The electroplating system 100 further includes a clip strip cell 112 adapted to remove residual plating which forms on the clips during the electroplating process. [0006] In operation, the drive motor is operated to cause the clockwise movement of the drive wheel 124 of the substrate transportation system 120, and the counter-clockwise movement of the cathode contact system 140 such that the movement of both subsystems 120 and 140 are in synchronization. Near the loading station 102, the clips 148 are operated to engage the top portion of the flexible substrate S. The clips 148 move in synchronization with the flexible substrate S maintaining a fixed cathode contact to the flexible substrate S as it moves from the loading station 102 to the unloading station 110. The substrate S undergoes the various processes provided by the pre-treatment cell 104, electroplating cell 106, and post-treatment cell 108, wherein the clips 148 provide the cathode contact for the electroplating process. Near the unloading station 110, the clips 148 are operated to disengage from the substrate S, and subsequently move to the clip strip cell 112 for removal of residual plating formed on the clips 148. The processed substrate S is continuously rolled onto the output spool 124. [0007] FIG. 1B illustrates a side view of the conventional electroplating cell 106 including a normally situated flexible substrate S. The conventional cell 106 includes a container 150 adapted to support a bath of electroplating fluid 152, one or more anode electrodes 154 situated within the container 150 and adapted to make contact with the plating fluid bath 152, and a sparger 156 adapted to introduce fresh plating fluid into the plating fluid bath 152 in the direction of the substrate S. In normal operations, the flexible substrate S is oriented substantially vertical within the electroplating cell 106. Generally, the weight of the flexible substrate S keeps it substantially vertical. [0008] FIG. 1C illustrates a side view of a conventional electroplating cell 106 including an abnormally situated flexible substrate S. When the thickness of the flexible substrate S becomes relatively small, the stability of the substrate S as it travels through the electroplating cell 106 typically degrades. As a result, the orientation of the flexible substrate S is no longer substantially vertical, and may warp as shown. Since the spatial distance between the anode 154 and the flexible substrate S is no longer consistent due to the warping of the substrate S, a non-uniform plating forms on the surface of the flexible substrate S. [0009] FIG. 1D illustrates a side view of the conventional electroplating cell 106 including another abnormally situated flexible substrate S. Another problem associated with thin flexible substrates is that the bottom portion of the substrate tends to float. As shown, the bottom portion of the flexible substrate S curves upwardly due to the buoyancy of the substrate S. Similarly, because the spatial distance between the anode 154 and the flexible substrate S is no longer consistent due to the buoyancy of the substrate S, a non-uniform plating forms on the surface of the flexible substrate S. [0010] In the past, some electroplating systems, especially those designed and manufactured in Japan and Korea, include cathode contact rollers located at the entrance and exit of an electroplating cell. The contact rollers maintain the material in a vertical orientation while providing a cathode contact to the material. These cathode contact rollers need to be located at intervals along the length of the flexible substrate. Typically, the cathode contact rollers are designed to provide a cathode potential to about two (2) meters length of material. Normally, the effective cell length range from 10 to 30 meters. Accordingly, five (5) to 15 electroplating cells need to be provided to effectively plate 10 to 30 meters of material, which translates to five (5) to 15 sets of cathode contact rollers along the length of the material. The large number of cathode contact rollers making contact to the substrate typically causes considerable damage to the material. SUMMARY OF THE INVENTION [0011] A processing system for processing flexible substrates or other types of articles is disclosed. The system includes a loading station having an input spool adapted to provide an unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unloading station having an output spool adapted to receive the processed flexible substrate; and a substrate stability subsystem adapted to maintain the flexible substrate in a substantially stable vertical orientation while the substrate undergoes the one or more processes performed by the processing station. The substrate stability subsystem includes a plurality of movable upper clips adapted to engage with respective upper portions of the flexible substrate, and a plurality of movable lower clips adapted to engage with respective lower portions of the flexible substrate as it is being transported into and out of the processing station. Also disclosed is a unique shield for the cathode clips to improve the uniformity of the deposition formed on the flexible substrate, and a unique seal to allow the transportation of the lower clips into and out of a processing cell while reducing leakage of fluid from the cell. [0012] Other aspects, features, and techniques of the invention will be apparent to one skilled in the relevant art in view of the following detailed description of the exemplary embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1A illustrates a top view of a conventional electroplating system for electroplating flexible substrates; [0014] FIG. 1B illustrates a side view of a conventional electroplating cell including a normally situated flexible substrate; [0015] FIG. 1C illustrates a side view of a conventional electroplating cell including an abnormally situated flexible substrate; [0016] FIG. 1D illustrates a side view of a conventional electroplating cell including another abnormally situated flexible substrate; [0017] FIG. 2A illustrates a top view of an exemplary electroplating system in accordance with an embodiment of the invention; [0018] FIG. 2B illustrates a side view of an exemplary electroplating cell in accordance with another embodiment of the invention; [0019] FIG. 3A illustrates a right side view of the exemplary substrate stability subsystem in accordance with another embodiment of the invention; [0020] FIG. 3B illustrates a left side view of the exemplary substrate stability subsystem in accordance with another embodiment of the invention; Continue reading... Full patent description for System and method for electroplating flexible substrates Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this System and method for electroplating flexible substrates patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like System and method for electroplating flexible substrates or other areas of interest. ### Previous Patent Application: Deposition on charge sensitive materials with ion beam deposition Next Patent Application: System and method to forecast the electrical conductivity of anodes for aluminum production before baking Industry Class: Chemistry: electrical and wave energy ### FreshPatents.com Support Thank you for viewing the System and method for electroplating flexible substrates patent info. IP-related news and info Results in 2.81908 seconds Other interesting Feshpatents.com categories: Qualcomm , Schering-Plough , Schlumberger , Seagate , Siemens , Texas Instruments , |
||
