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System and method for analog replication of microdevices having a desired surface contour


Abstract: A master wafer is replicated by creating a mold by plating a nickel electroform on a surface of a silicon wafer. Thereafter, a child wafer is prepared with a layer of photoresist or similar material that is compatible with plasma-etching techniques. Thereafter, the mold shape is transferred to the photoresist through compression molding, thereafter the child wafer is etched. ...


USPTO Applicaton #: #20050147925 - Class: 430320000 (USPTO) - Class 430 

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Related Patent Categories: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof, Imaging Affecting Physical Property Of Radiation Sensitive Material, Or Producing Nonplanar Or Printing Surface - Process, Composition, Or Product, Making Named Article
The Patent Description & Claims data below is from USPTO Patent Application 20050147925, System and method for analog replication of microdevices having a desired surface contour.




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