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Susumu Hiyama patents

Recent patents with Susumu Hiyama listed as an inventor - additional entries may be under other spellings.


Susumu Hiyama - Related organizations: Sony Corporation patents

Image pickup element, method of manufacturing image pickup element, and electronic apparatus

02/09/17 - 20170040359 - An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film
Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga

Solid-state imaging device, method of manufacturing the same, and electronic equipment

07/21/16 - 20160211301 - A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least
Inventors: Susumu Hiyama, Kazufumi Watanabe

Image pickup element, method of manufacturing image pickup element, and electronic apparatus

07/14/16 - 20160204145 - An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film
Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga

Image pickup element, method of manufacturing image pickup element, and electronic apparatus

04/02/15 - 20150091121 - An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film
Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga

Solid-state imaging device, method of manufacturing the same, and electronic equipment

07/10/14 - 20140191353 - A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least
Inventors: Susumu Hiyama, Kazufumi Watanabe

Solid-state imaging element, method of manufacturing the same, solid-state imaging apparatus, and imaging apparatus

10/03/13 - 20130256821 - A solid-state imaging element including a semiconductor substrate that has a light reception portion performing a photoelectric conversion of an incident light; an oxide layer that is formed on a surface of the semiconductor substrate; a light shielding layer that is formed on an upper layer further than the oxide
Inventors: Yoshiyuki Ohba, Susumu Hiyama, Itaru Oshiyama

Solid-state imaging device, method of manufacturing the same, and electronic equipment

09/12/13 - 20130234276 - A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least
Inventors: Susumu Hiyama, Kazufumi Watanabe

Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same

08/08/13 - 20130200252 - A solid-state image pickup element 1 is structured so as to include: a semiconductor layer 2 having a photodiode formed therein, photoelectric conversion being carried out in the photodiode; a first film 21 having negative fixed charges and formed on the semiconductor layer 2 in a region in which at
Inventors: Itaru Oshiyama, Susumu Hiyama

Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same

10/04/12 - 20120249847 - An embodiment of the invention provides a solid-state image pickup element, including: a semiconductor layer having a photodiode, photoelectric conversion being carried out in the photodiode; a silicon oxide film formed on the semiconductor layer in a region having at least the photodiode by using plasma; and a film formed
Inventors: Itaru Oshiyama, Susumu Hiyama

Solid-state imaging element, method of manufacturing the same, solid-state imaging apparatus, and imaging apparatus

03/01/12 - 20120049306 - A solid-state imaging element includes a semiconductor substrate that has a light reception portion performing a photoelectric conversion of an incident light; an oxide layer that is formed on a surface of the semiconductor substrate; a light shielding layer that is formed on an upper layer further than the oxide
Inventors: Yoshiyuki Ohba, Susumu Hiyama, Itaru Oshiyama

Solid-state imaging device, method of manufacturing the same, and electronic equipment

10/06/11 - 20110241148 - A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least
Inventors: Susumu Hiyama, Kazufumi Watanabe

Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same

02/10/11 - 20110031376 - A solid-state image pickup element 1 is structured so as to include: a semiconductor layer 2 having a photodiode formed therein, photoelectric conversion being carried out in the photodiode; a first film 21 having negative fixed charges and formed on the semiconductor layer 2 in a region in which at
Inventors: Itaru Oshiyama, Susumu Hiyama

Method for manufacturing semiconductor device

12/02/10 - 20100304520 - Disclosed herein is a method for making a semiconductor device including the steps of: forming a light-receiving portion for carrying out photoelectric conversion in a semiconductor substrate; forming an insulating film to cover a light-receiving side of the semiconductor substrate; forming a metallic light-shielding film to partly cover the insulating
Inventors: Susumu Hiyama

Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same

09/09/10 - 20100224946 - An embodiment of the invention provides a solid-state image pickup element, including: a semiconductor layer having a photodiode, photoelectric conversion being carried out in the photodiode; a silicon oxide film formed on the semiconductor layer in a region having at least the photodiode by using plasma; and a film formed
Inventors: Itaru Oshiyama, Susumu Hiyama


### Susumu Hiyama patent invention listings

The bibliographic references displayed about Susumu Hiyama's patents are for a recent sample of Susumu Hiyama's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Susumu Hiyama filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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