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Surface plate protecting device in cmp apparatusSurface plate protecting device in cmp apparatus description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20080076336, Surface plate protecting device in cmp apparatus. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001]The present invention relates to a surface plate protecting device in a CMP apparatus and particularly relates to a surface plate protecting device in a CMP apparatus capable of preventing damage or the like on the surface of a surface plate generated in a CMP operation or the like. BACKGROUND OF THE INVENTION [0002]Conventionally, surface plate protection devices in CMP apparatuses of this type have never been present. The technique of Japanese Patent Application Laid-Open (kokai) No. 2001-131500 is known as a technique closest to that. In the technique described in Japanese Patent Application Laid-Open (kokai) No. 2001-131500, a double-sided adhesive tape is wound around in the state in which a separator is attached to one side of the double-sided adhesive tape and a polishing cloth is attached to the other side, and the adhesive surfaces of the both sides of the double-sided tape are protected by the separator so that a polishing pad is not warped due to the repulsion force of the separator when it is to be attached to the surface plate; thus, it is configured so that the polishing cloth can be attached to a surface plate. As a matter of course, the separator is removed when the polishing cloth is to be attached to the surface plate. [0003]The above described conventional example cannot prevent damage, dent, etc. on the upper surface of the surface plate generated in, for example, operation of the CMP apparatus. [0004]A polishing pad is attached to a surface plate used in a CMP apparatus, and the polishing pad is a consumable product and has to be periodically replaced. Damage, dent, etc. is sometimes generated on the surface of the surface plate due to carelessness, etc. in the replacement operation of the polishing pad. Also, the surface of the surface plate is sometimes damaged due to a trouble such as projection of a wafer in wafer polishing. Meanwhile, there is close relation between the shape of the surface of the surface plate and the wafer polishing shape; and, when the surface of the surface plate is, for example, damaged, the polishing performance of the wafer is affected depending on the degree of the damage. Therefore, when the surface of the surface plate is damaged or dented, the surface plate has to be repaired or replaced by a new surface plate. However, the repairing operation in the state in which the surface plate is attached to the CMP apparatus is difficult. Also, since the weight of the surface plate is heavy, the replacement operation is also not easy and requires considerably long operation time, and the operation of the CMP apparatus has to be stopped for a corresponding period of time; thus, there are problems that the operation efficiency of the CMP apparatus is reduced and, in addition, the economic burden is increased due to the synergetic effects of high manufacturing cost of the surface plate per se and labor and time taken therefore. [0005]Thus, technical problems to be solved for solving the problems are generated, and it is an object of the present invention to solve the problems. SUMMARY OF THE INVENTION [0006]This invention has been proposed for achieving the above described object, and a first aspect of the invention provides a surface plate protecting device in a CMP apparatus having a surface plate used in the CMP apparatus, wherein a sheet is bonded with an upper surface of the surface plate by an adhesive agent, a polishing pad is further replaceably bonded with the upper surface of the sheet, so that damage of the surface of the surface plate generated in replacement of the polishing pad, wafer polishing, or the like is protected by the sheet. [0007]According to this configuration, the sheet is bonded with the upper surface of the surface plate, the polishing pad is bonded with the upper surface of the sheet, and a polishing operation of a wafer is executed by the CMP apparatus. [0008]A second aspect of the present invention provides the surface plate protecting device in the CMP apparatus, wherein the adhesive force of the adhesive agent bonding the upper surface of the surface plate with the sheet is larger than the adhesive force of the polishing pad. [0009]According to this configuration, in regular replacement of the polishing pad, the polishing pad can be independently peeled off from the sheet bonded with the upper surface of the surface plate, and a new polishing pad is bonded with the surface of the remaining sheet bonded with the upper surface of the surface plate so as to execute the polishing operation of the wafer by the CMP apparatus according to the first aspect. [0010]A third aspect of the present invention provides the surface plate protecting device in the CMP apparatus, wherein a chemically resistant material such as a fluorine resin is selected as the sheet. [0011]According to this configuration, since the sheet selects the chemically resistant material, it is not eroded by slurry, which is, for example, acidic or alkaline, during the polishing operation of the wafer. [0012]A fourth aspect of the present invention provides the surface plate protecting device in the CMP apparatus, wherein a lower surface of the sheet is subjected to surface treatment that increases a friction coefficient, and the adhesive agent bonding the lower surface of the sheet with the upper surface of the surface plate uses an adhesive agent having adhesive force equal to or more than the adhesive force of the polishing pad. [0013]According to this configuration, the friction coefficient of the lower surface of the sheet is increased, and the adhesive agent uses the adhesive force equal to or more than the adhesive force of the polishing pad; therefore, the adhesive force between the sheet and the upper surface of the surface plate is reliably increased. As a result, in regular replacement of the polishing pad, the polishing pad can be independently and reliably peeled off from the sheet bonded with the upper surface of the surface plate, a new polishing pad is bonded with the surface of the remaining sheet bonded with the upper surface of the surface plate, and the polishing operation of the wafer by the CMP apparatus according to the first aspect is executed. [0014]A fifth aspect of the present invention provides a surface plate protecting device in a CMP apparatus having a surface plate used in the CMP apparatus, wherein a sheet protecting a surface of the surface plate is provided, both sides of the sheet are respectively coated by adhesive agents having different adhesive force, the adhesive agent of the lower surface side having the adhesive force larger than the adhesive force of the upper surface side, the lower surface of the sheet is bonded with the upper surface of the surface plate by the adhesive agent having the large adhesive force, and a polishing cloth is replaceably bonded with the upper surface of the sheet by the adhesive agent having the small adhesive force, so that damage of the surface of the surface plate generated in replacement of the polishing cloth, wafer polishing, or the like can be protected by the sheet. [0015]According to this configuration, in regular replacement of the polishing cloth, the polishing cloth can be independently peeled off from the sheet bonded with the upper surface of the surface plate, a new polishing cloth is bonded with the surface of the remaining sheet bonded with the upper surface of the surface plate, and the polishing operation of the wafer by the CMP apparatus is executed. [0016]A sixth aspect of the present invention provides the surface plate protecting device in the CMP apparatus, wherein the surface of the sheet in the surface plate side is coated in advance by an adhesive agent having adhesive force larger than the adhesive force of the polishing pad, the sheet is bonded with the upper surface of the surface plate, and the polishing pad is bonded with the upper surface of the sheet. [0017]According to this configuration, the sheet is coated in advance by the adhesive agent having the adhesive force larger than the adhesive force of the polishing pad; therefore, the adhesive agent having the large adhesive force is bonded with the upper surface of the surface plate and the polishing pad is bonded with the other side so as to constitute the CMP apparatus of the first aspect and execute polishing operation. [0018]A seventh aspect of the present invention provides the surface plate protecting device in the CMP apparatus, wherein an outer coating sheet for preventing adhesion with another material is bonded with the surface of the adhesive agent coating the sheet. [0019]According to this configuration, the sheet is coated in advance by adhesive agents, etc. having different adhesive force, and each of the adhesive agents is protected by the outer coating sheet. [0020]In the first aspect of the invention, the polishing operation of the wafer by the CMP apparatus is executed in the state in which the sheet is bonded with the upper surface of the surface plate and the polishing pad is bonded with the upper surface of the sheet. Therefore, even when the wafer projects out in the polishing operation and broken pieces of the broken wafer involve the polishing pad, etc., the upper surface of the surface plate is not damaged since the upper surface of the surface plate is protected by the sheet. [0021]Also in replacement of the polishing pad, the polishing pad is once peeled off from the sheet bonded with the upper surface of the surface plate, and a new polishing pad is bonded again. Even when damage is to be erroneously generated on the surface of the surface plate in the ordinary replacement operation of the polishing pad, the damage is blocked by the sheet, the surface shape of the surface plate is maintained in an appropriate state, a long surface plate life can be expected, and use of the sheet can be kept as long as damage or dent is not generated thereon. Therefore, the wafer polishing operation by the CMP apparatus can be most efficiently executed, and a high-quality wafer can be expected to be obtained. Thus, repairing, replacement, etc. of the surface plate can be suppressed to a minimum level, and there is an economical advantage. Continue reading about Surface plate protecting device in cmp apparatus... 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